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- Katia BertoldiSEAS, Harvard UniversityVerified email at seas.harvard.edu
- Dr. Sicong ShanSchool of Engineering and Applied Sciences (SEAS), Harvard UniversityVerified email at seas.harvard.edu
- Bolei Deng (邓博磊)Georgia Institute of TechnologyVerified email at gatech.edu
- Sung Hoon KangKAIST, Johns Hopkins University, Harvard University, MITVerified email at kaist.ac.kr
- Jongmin ShimUniversity at BuffaloVerified email at buffalo.edu
- Sahab BabaeeMassachusetts Institute of TechnologyVerified email at mit.edu
- Jordan R. RaneyUniversity of PennsylvaniaVerified email at seas.upenn.edu
- Vincent TOURNATLaboratoire d'Acoustique de l'Université du Mans, UMR-CNRS 6613, Institut d'Acoustique - GraduateVerified email at univ-lemans.fr
- Jennifer A. LewisHarvard UniversityVerified email at seas.harvard.edu
- Lichen FangApple Inc.Verified email at jhu.edu
- Ling Lu (陆凌)Institute of Physics, Chinese Academy of ScienceVerified email at iphy.ac.cn
- Fei ChenUniversity of UtahVerified email at utah.edu
- James C. WeaverWyss Institute, Harvard UniversityVerified email at wyss.harvard.edu
- Qi HeMassachusetts Institute of TechnologyVerified email at mit.edu
- Samuel ShianResearch Associate in Materials Science and Mechanical Engineering, Harvard UniversityVerified email at seas.harvard.edu
- Cangyu Qu (瞿苍宇)Postdoc, University of Pennsylvania; PhD, Tsinghua UniversityVerified email at seas.upenn.edu
- Nick FangProfessor of Mechanical Engineering, HKU (current); previous: MIT, UCLA, UIUCVerified email at hku.hk
- Donglai WeiAssistant Professor, Boston CollegeVerified email at bc.edu
- Farhad JavidAutodesk Research - University of TorontoVerified email at mit.edu
- Soo Jin Adrian KohMax Planck Institute for Intelligent Systems, Department of Robotic MaterialsVerified email at is.mpg.de