Frank Niklaus
Frank Niklaus
Professor of Micro and Nanosystems at KTH Royal Institute of Technology, Stockholm, Sweden
Verified email at - Homepage
Cited by
Cited by
Handbook of Silicon Based MEMS Materials and Technologies
M Tilli, T Motooka, VM Airaksinen, S Franssila, M Paulasto-Kröckel, ...
Handbook of Silicon Based MEMS Materials and Technologies (Second Edition …, 2015
Adhesive wafer bonding
F Niklaus, G Stemme, JQ Lu, RJ Gutmann
Journal of applied physics 99 (3), 2006
MEMS-based uncooled infrared bolometer arrays: a review
F Niklaus, C Vieider, H Jakobsen
MEMS/MOEMS technologies and applications III 6836, 125-139, 2008
Electromechanical piezoresistive sensing in suspended graphene membranes
AD Smith, F Niklaus, A Paussa, S Vaziri, AC Fischer, M Sterner, ...
Nano letters 13 (7), 3237-3242, 2013
Low-temperature full wafer adhesive bonding
F Niklaus, P Enoksson, E Kälvesten, G Stemme
Journal of Micromechanics and Microengineering 11 (2), 100, 2001
Integrating MEMS and ICs
AC Fischer, F Forsberg, M Lapisa, SJ Bleiker, Stemme, Göran, N Roxhed, ...
Microsystems & Nanoengineering 1 (1), 15005, 2015
Resistive graphene humidity sensors with rapid and direct electrical readout
AD Smith, K Elgammal, F Niklaus, A Delin, AC Fischer, S Vaziri, ...
Nanoscale 7 (45), 19099-19109, 2015
Method of joining components
E Kälvesten, G Stemme, F Niklaus
US Patent 7,067,345, 2006
Handbook of wafer bonding
P Ramm, JJQ Lu, MMV Taklo
John Wiley & Sons, 2011
Wafer-level heterogeneous integration for MOEMS, MEMS, and NEMS
M Lapisa, G Stemme, F Niklaus
IEEE Journal of Selected Topics in Quantum Electronics 17 (3), 629-644, 2011
Hydrophobic valves of plasma deposited octafluorocyclobutane in DRIE channels
H Andersson, W van der Wijngaart, P Griss, F Niklaus, G Stemme
Sensors and Actuators B: Chemical 75 (1-2), 136-141, 2001
Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities
J Oberhammer, F Niklaus, G Stemme
Sensors and Actuators A: Physical 105 (3), 297-304, 2003
Low temperature full wafer adhesive bonding of structured wafers
F Niklaus, H Andersson, P Enoksson, G Stemme
Sensors and Actuators A: Physical 92 (1-3), 235-241, 2001
Sealing of adhesive bonded devices on wafer level
J Oberhammer, F Niklaus, G Stemme
Sensors and Actuators A: Physical 110 (1-3), 407-412, 2004
Encyclopedia of sensors
CA Grimes, EC Dickey, MV Pishko, RA Marcus
(No Title), 2006
Piezoresistive properties of suspended graphene membranes under uniaxial and biaxial strain in nanoelectromechanical pressure sensors
AD Smith, F Niklaus, A Paussa, S Schröder, AC Fischer, M Sterner, ...
ACS nano 10 (11), 9879-9886, 2016
Wearable all-solid-state potentiometric microneedle patch for intradermal potassium detection
M Parrilla, M Cuartero, S Padrell Sánchez, M Rajabi, N Roxhed, F Niklaus, ...
Analytical chemistry 91 (2), 1578-1586, 2018
Performance model for uncooled infrared bolometer arrays and performance predictions of bolometers operating at atmospheric pressure
F Niklaus, A Decharat, C Jansson, G Stemme
Infrared Physics & Technology 51 (3), 168-177, 2008
Large-area integration of two-dimensional materials and their heterostructures by wafer bonding
A Quellmalz, X Wang, S Sawallich, B Uzlu, M Otto, S Wagner, Z Wang, ...
Nature communications 12 (1), 917, 2021
Nanoelectromechanical sensors based on suspended 2D materials
MC Lemme, S Wagner, K Lee, X Fan, GJ Verbiest, S Wittmann, S Lukas, ...
Research, 2020
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