Rao Tummala
Rao Tummala
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Cited by
Cited by
Microelectronics Packaging Handbook: Technology Drivers Part I
RR Tummala, EJ Rymaszewski, AG Klopfenstein
Springer Science & Business Media, 2012
Fundamentals of microsystems packaging
RR Tummala
McGraw-Hill 2 (01), 190-193, 2001
Ceramic and glass‐ceramic packaging in the 1990s
RR Tummala
Journal of the American Ceramic Society 74 (5), 895-908, 1991
ZnO nanobelt/nanowire Schottky diodes formed by dielectrophoresis alignment across Au electrodes
CS Lao, J Liu, P Gao, L Zhang, D Davidovic, R Tummala, ZL Wang
Nano Letters 6 (2), 263-266, 2006
SOP: What is it and why? A new microsystem-integration technology paradigm-Moore's law for system integration of miniaturized convergent systems of the next decade
RR Tummala
IEEE Transactions on Advanced Packaging 27 (2), 241-249, 2004
Next generation integral passives: materials, processes, and integration of resistors and capacitors on PWB substrates
SK Bhattacharya, RR Tummala
Journal of Materials Science: Materials in Electronics 11, 253-268, 2000
RF-system-on-package (SOP) for wireless communications
K Lim, S Pinel, M Davis, A Sutono, CH Lee, D Heo, A Obatoynbo, J Laskar, ...
IEEE Microwave magazine 3 (1), 88-99, 2002
A review of SiC power module packaging technologies: Challenges, advances, and emerging issues
H Lee, V Smet, R Tummala
IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 239-255, 2019
Low-cost thin glass interposers as a superior alternative to silicon and organic interposers for packaging of 3-D ICs
V Sukumaran, T Bandyopadhyay, V Sundaram, R Tummala
IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (9 …, 2012
Failure mechanisms and optimum design for electroplated copper through-silicon vias (TSV)
X Liu, Q Chen, P Dixit, R Chatterjee, RR Tummala, SK Sitaraman
2009 59th Electronic components and technology conference, 624-629, 2009
System on package: miniaturization of the entire system
RR Tummala
McGraw-Hill Education, 2008
The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade
RR Tummala, M Swaminathan, MM Tentzeris, J Laskar, GK Chang, ...
IEEE Transactions on Advanced Packaging 27 (2), 250-267, 2004
Carrier density and Schottky barrier on the performance of DC nanogenerator
J Liu, P Fei, J Song, X Wang, C Lao, R Tummala, ZL Wang
Nano letters 8 (1), 328-332, 2008
System on chip or system on package?
RR Tummala, VK Madisetti
IEEE Design & Test of Computers 16 (2), 48-56, 1999
Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper
AH Kumar, PW McMillan, RR Tummala
US Patent 4,301,324, 1981
Integral passives for next generation of electronic packaging: application of epoxy/ceramic nanocomposites as integral capacitors
SK Bhattacharya, RR Tummala
Microelectronics Journal 32 (1), 11-19, 2001
A novel integrated decoupling capacitor for MCM-L technology
P Chahal, RR Tummala, MG Allen, M Swaminathan
IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1998
Multilayered glass-ceramic substrate for mounting of semiconductor device
B Narken, RR Tummala
US Patent 4,221,047, 1980
Electrical modeling of through silicon and package vias
T Bandyopadhyay, R Chatterjee, D Chung, M Swaminathan, R Tummala
2009 IEEE International Conference on 3D System Integration, 1-8, 2009
Through-package-via formation and metallization of glass interposers
V Sukumaran, Q Chen, F Liu, N Kumbhat, T Bandyopadhyay, H Chan, ...
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
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