| Electromigration of composite Sn-Ag-Cu solder bumps A Sharma, DE Xu, J Chow, M Mayer, HR Sohn, JP Jung Electronic Materials Letters 11 (6), 1072-1077, 2015 | 35 | 2015 |
| More uniform Pd distribution in free-air balls of Pd-coated Cu bonding wire using movable flame-off electrode N Ly, DE Xu, WH Song, M Mayer Microelectronics Reliability 55 (1), 201-206, 2015 | 17 | 2015 |
| SAC305 solder reflow: identification of melting and solidification using in-process resistance monitoring J Feng, DE Xu, Y Tian, M Mayer IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019 | 12 | 2019 |
| Effect of different nanoparticles on microstructure, wetting and joint strength of Al–12Si–20Cu braze filler A Sharma, DE Xu, JP Jung Materials Research Express 6 (5), 056526, 2019 | 12 | 2019 |
| Real time joint resistance monitoring during solder reflow DE Xu, MD Hook, M Mayer Journal of Alloys and Compounds 695, 3002-3010, 2017 | 12 | 2017 |
| Sn-Ag-Cu to Cu joint current aging test and evolution of resistance and microstructure DE Xu, J Chow, M Mayer, JP Jung, JH Yoon Electronic Materials Letters 11 (6), 1078-1084, 2015 | 11 | 2015 |
| Joint properties between carbon nanotube and gold at different energy levels from molecular dynamics P He, D Xu, T Lin, Z Jiao Computational Materials Science 72, 38-41, 2013 | 9 | 2013 |
| The electrical reliability of silver wire bonds under high temperature storage M Mayer, DE Xu, K Ratcliffe 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 654-659, 2016 | 8 | 2016 |
| Real time resistance monitoring during sintering of silver paste DE Xu, JB Kim, MD Hook, JP Jung, M Mayer Elsevier, 2018 | 7 | 2018 |
| Thermal Aging Behavior of Fine Pitch Palladium Coated Silver (PCS) Ball Bonds on Al Metallization DE Xu, J Gomes, M Mayer, R Lyn, J Persic International Symposium on Microelectronics 2015 (1), 000298-000304, 2015 | 5 | 2015 |
| Electromigration testing of wire bonds M Hook, D Xu, M Mayer 2014 IEEE 27th Canadian Conference on Electrical and Computer Engineering …, 2014 | 4 | 2014 |
| Molecular dynamics simulation of the effect of carbon nanotube chirality on nano-joining with gold particle X Qiu, D Xu, T Lin, X Yang, Y Liu, P He Materials Transactions 56 (7), 1007-1009, 2015 | 1 | 2015 |
| Molecular dynamics study of nano-scale Ag surface electromigration and effect of Pd coating layer DE Xu, MD Hook, M Mayer 14th IEEE International Conference on Nanotechnology, 640-644, 2014 | 1 | 2014 |
Michael MayerAssociate Professor of Mechanical and Mechatronics Engineering, University of Waterloo在 uwaterloo.ca 的电子邮件经过验证
