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Yidnekachew (Yidnek) Mekonnen
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Year
Embedded multi-die interconnect bridge (EMIB)--a high density, high bandwidth packaging interconnect
R Mahajan, R Sankman, N Patel, DW Kim, K Aygun, Z Qian, Y Mekonnen, ...
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 557-565, 2016
2372016
Black-box modeling of passive systems by rational function approximation
R Gao, YS Mekonnen, WT Beyene, JE Schutt-Aine
IEEE Transactions on Advanced Packaging 28 (2), 209-215, 2005
442005
Broadband macromodeling of sampled frequency data using z-domain vector-fitting method
YS Mekonnen, JE Schutt-Aine
2007 IEEE workshop on signal propagation on interconnects, 45-48, 2007
312007
Comparative study of convolution and order reduction techniques for blackbox macromodeling using scattering parameters
JE Schutt-Ainť, P Goh, Y Mekonnen, J Tan, F Al-Hawari, P Liu, W Dai
IEEE Transactions on Components, Packaging and Manufacturing Technology 1†…, 2011
212011
Impact of use conditions on dielectric and conductor material models for high-speed package interconnects
CS Geyik, YS Mekonnen, Z Zhang, K AygŁn
IEEE Transactions on Components, Packaging and Manufacturing Technology 9†…, 2019
122019
Acceleration of spectral domain approach for generalized multilayered shielded microstrip interconnects using two fast convergent series
S Jain, J Song, T Kamgaing, YS Mekonnen
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (3†…, 2013
122013
Low loss and low cross talk transmission lines using shaped vias
AA Elsherbini, M Manusharow, K Bharath, Z Zhang, YS Mekonnen, ...
US Patent 9,992,859, 2018
112018
Fast macromodeling technique of sampled time/frequency data using z-domain vector-fitting method
YS Mekonnen, JE Schutt-Aine
2007 IEEE Electrical Performance of Electronic Packaging, 47-50, 2007
112007
Mitigation of far-end crosstalk induced by routing and out-of-plane interconnects
N Altunyurt, K Aygun, KJ Doran, YS Mekonnen
US Patent 9,515,031, 2016
102016
Combining rational interpolation with the vector fitting method
YS Mekonnen, J Schutt-Aine, J Tan, C Kumar, D Milosevic
IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging†…, 2005
102005
Fast broadband macromodeling technique of sampled time/frequency data using z-domain vector-fitting method
YS Mekonnen, JE Schutt-Ainť
2008 58th Electronic Components and Technology Conference, 1231-1235, 2008
72008
Robust temperature and humidity dependent electrical package material characterization
YS Mekonnen, MJ Hill, L Wojewoda, K AygŁn
2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging†…, 2018
52018
Acceleration of spectral domain immitance approach for generalized multilayered shielded microstrips using the Levin’s transformation
H Xu, S Jain, J Song, T Kamgaing, YS Mekonnen
IEEE Antennas and Wireless Propagation Letters 14, 92-95, 2014
52014
A novel approach to accelerate spectral domain approach for shielded microstrip lines using the Levin transformations and summation-by-parts
H Xu, K Chen, J Song, T Kamgaing, YS Mekonnen
Radio Science 49 (8), 573-582, 2014
52014
An efficient modeling approach for multilayered dielectric embedded with periodic metal
T Zhao, J Song, T Kamgaing, YS Mekonnen
Microwave and Optical Technology Letters 56 (6), 1387-1391, 2014
52014
Integrated circuit package stack
S Jayaraman, JS Guzek, YS Mekonnen
US Patent 9,859,253, 2018
42018
The extrapolation methods in acceleration of SDA for shielded microstrip lines
H Xu, J Song, T Kamgaing, YS Mekonnen
2014 IEEE Antennas and Propagation Society International Symposium (APSURSI†…, 2014
42014
Black-box modelling by rational function approximation
R Gao, YS Mekonnen, WT Beyene, JE Schutt-Aine
Proceedings. 8th IEEE Workshop on Signal Propagation on Interconnects, 99-102, 2004
42004
MINIMIZATION OF INSERTION LOSS VARIATION IN THROUGH-SILICON VIAS (TSVs)
J Xie, YS Mekonnen, Z Qian, K Aygun
US Patent App. 16/643,816, 2020
32020
Rlink-ground shielding attachment structures and shadow voiding for data signal contacts of package devices; vertical ground shielding structures and shield fencing of vertical†…
YA Zhang, Z Qian, K Aygun, YS Mekonnen, GR Murtagian, S Ganesan, ...
US Patent 10,396,036, 2019
32019
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Articles 1–20