| Embedded multi-die interconnect bridge (EMIB)--a high density, high bandwidth packaging interconnect R Mahajan, R Sankman, N Patel, DW Kim, K Aygun, Z Qian, Y Mekonnen, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 557-565, 2016 | 316 | 2016 |
| Black-box modeling of passive systems by rational function approximation R Gao, YS Mekonnen, WT Beyene, JE Schutt-Ainé IEEE Transactions on Advanced Packaging 28 (2), 209-215, 2005 | 43 | 2005 |
| Broadband macromodeling of sampled frequency data using z-domain vector-fitting method YS Mekonnen, JE Schutt-Aine 2007 IEEE workshop on signal propagation on interconnects, 45-48, 2007 | 34 | 2007 |
| Comparative study of convolution and order reduction techniques for blackbox macromodeling using scattering parameters JE Schutt-Ainé, P Goh, Y Mekonnen, J Tan, F Al-Hawari, P Liu, W Dai IEEE Transactions on Components, Packaging and Manufacturing Technology 1 …, 2011 | 22 | 2011 |
| Low loss and low cross talk transmission lines using shaped vias AA Elsherbini, M Manusharow, K Bharath, Z Zhang, YS Mekonnen, ... US Patent 9,992,859, 2018 | 17 | 2018 |
| Impact of use conditions on dielectric and conductor material models for high-speed package interconnects CS Geyik, YS Mekonnen, Z Zhang, K Aygün IEEE Transactions on Components, Packaging and Manufacturing Technology 9 …, 2019 | 15 | 2019 |
| Rlink—die to die channel interconnect configurations to improve signaling K Aygun, RJ Dischler, JC Morriss, Z Qian, W Gomes, YA Zhang, ... US Patent 10,784,204, 2020 | 13 | 2020 |
| Mitigation of far-end crosstalk induced by routing and out-of-plane interconnects N Altunyurt, K Aygun, KJ Doran, YS Mekonnen US Patent 9,515,031, 2016 | 12 | 2016 |
| Acceleration of spectral domain approach for generalized multilayered shielded microstrip interconnects using two fast convergent series S Jain, J Song, T Kamgaing, YS Mekonnen IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (3 …, 2013 | 12 | 2013 |
| Fast macromodeling technique of sampled time/frequency data using z-domain vector-fitting method YS Mekonnen, JE Schutt-Aine 2007 IEEE Electrical Performance of Electronic Packaging, 47-50, 2007 | 12 | 2007 |
| Combining rational interpolation with the vector fitting method YS Mekonnen, J Schutt-Aine, J Tan, C Kumar, D Milosevic IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging …, 2005 | 10 | 2005 |
| Integrated circuit package stack S Jayaraman, JS Guzek, YS Mekonnen US Patent 9,859,253, 2018 | 8 | 2018 |
| Fast broadband macromodeling technique of sampled time/frequency data using z-domain vector-fitting method YS Mekonnen, JE Schutt-Ainé 2008 58th Electronic Components and Technology Conference, 1231-1235, 2008 | 8 | 2008 |
| Robust temperature and humidity dependent electrical package material characterization YS Mekonnen, MJ Hill, L Wojewoda, K Aygün 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018 | 6 | 2018 |
| Acceleration of spectral domain immitance approach for generalized multilayered shielded microstrips using the Levin’s transformation H Xu, S Jain, J Song, T Kamgaing, YS Mekonnen IEEE Antennas and Wireless Propagation Letters 14, 92-95, 2014 | 5 | 2014 |
| A novel approach to accelerate spectral domain approach for shielded microstrip lines using the Levin transformations and summation-by-parts H Xu, K Chen, J Song, T Kamgaing, YS Mekonnen Radio Science 49 (8), 573-582, 2014 | 5 | 2014 |
| An efficient modeling approach for multilayered dielectric embedded with periodic metal T Zhao, J Song, T Kamgaing, YS Mekonnen Microwave and Optical Technology Letters 56 (6), 1387-1391, 2014 | 5 | 2014 |
| The extrapolation methods in acceleration of SDA for shielded microstrip lines H Xu, J Song, T Kamgaing, YS Mekonnen 2014 IEEE Antennas and Propagation Society International Symposium (APSURSI …, 2014 | 4 | 2014 |
| Black-box modelling by rational function approximation R Gao, YS Mekonnen, WT Beyene, JE Schutt-Aine Proceedings. 8th IEEE Workshop on Signal Propagation on Interconnects, 99-102, 2004 | 4 | 2004 |
| Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs AA Elsherbini, M Manusharow, K Bharath, Z Zhang, YS Mekonnen, ... US Patent 10,651,525, 2020 | 3 | 2020 |
Telesphor KamgaingResearch Scientist, Intel CorporationVerified email at intel.com
