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Michael HochbergPeriplous LLCVerified email at periplo.us
Tsung Yang LIOW, Jason (廖仲扬)Institute of Microelectronics (IME), A*STARVerified email at ime.a-star.edu.sg
Ran DingAmazon Web ServicesVerified email at amazon.com
Yee-Chia YeoNational University of SingaporeVerified email at nus.edu.sg
Yang LiuUniversity of Washington, University of DelawareVerified email at uw.edu
Ari NovackEnosemiVerified email at enosemi.com
Matthew StreshinskyEnosemiVerified email at enosemi.com
Rinus LeeTELVerified email at ieee.org
Yangjin MaElenionVerified email at elenion.com
Xiaoguang TuMarvell semiconductor Pte LtdVerified email at Marvell.com
Ganesh SamudraAssociate Professor, National University of SingaporeVerified email at nus.edu.sg
Junfeng SongVerified email at jlu.edu.cn
CHI DongzhiPrincipal Scientist, Institute of Materials Research and EngineeringVerified email at imre.a-star.edu.sg
Ali AyaziApple Inc.Verified email at ucla.edu
Nicholas C. HarrisMassachusetts Institute of TechnologyVerified email at alum.mit.edu
Selin TeoIMEVerified email at ime.a-star.edu.sg
Liang DingMarvellVerified email at marvell.com
Xianshu LuoInstitute of Microelectronics, A*STARVerified email at ime.a-star.edu.sg
Christophe GallandEPFL, Lausanne, SwitzerlandVerified email at epfl.ch
Ruizhi ShiNokiaVerified email at nokia.com