Bin Feng (冯斌)
Bin Feng (冯斌)
在 的电子邮件经过验证 - 首页
Cooperative Bilayer of Lattice-Disordered Nanoparticles as Room-Temperature Sinterable Nanoarchitecture for Device Integrations (Cover Story)
B Feng, D Shen, W Wang, Z Deng, L Lin, H Ren, A Wu, G Zou, L Liu, ...
ACS applied materials & interfaces 11 (18), 16972-16980, 2019
Sintering Mechanism of a Supersaturated Ag–Cu Nanoalloy Film for Power Electronic Packaging
Q Jia, G Zou, W Wang, H Ren, H Zhang, Z Deng, B Feng, L Liu
ACS applied materials & interfaces 12 (14), 16743-16752, 2020
Anisotropic growth of Ni 3 (BO 3) 2 nanowhiskers on nickel substrates and its application in the fabrication of superhydrophilic surfaces
Y Wang, J Feng, B Feng, X Song, J Cao
RSC Advances 5 (37), 28950-28957, 2015
A programmable, gradient-composition strategy producing synergistic and ultrahigh sensitivity amplification for flexible pressure sensing
B Feng, G Zou, W Wang, M Dong, Y Xiao, H Ren, X Zhao, G Zhao, A Wu, ...
Nano Energy 74, 104847, 2020
Mechanical properties and microstructure of low temperature sintered joints using organic-free silver nanostructured film for die attachment of SiC power electronics
W Wang, G Zou, Q Jia, H Zhang, B Feng, Z Deng, L Liu
Materials Science and Engineering: A 793, 139894, 2020
Nanoporous silver using pulsed laser deposition for high-performance oxygen reduction reaction and hydrogen peroxide sensing
X Zhao, Z Deng, W Zhao, B Feng, M Wang, M Huang, L Liu, G Zou, ...
Nanoscale 12 (37), 19413-19419, 2020
Enhanced adhesive bonding based on surface modification with silicon nanowire arrays
B Feng, J Cao, Y Wang, J Feng
ECS Journal of Solid State Science and Technology 5 (2), P41, 2015
Large-Area Die-Attachment Sintered by Organic-Free Ag Sintering Material at Low Temperature
NSM Zubir, H Zhang, G Zou, H Bai, Z Deng, B Feng, A Wu, L Liu, YN Zhou
Journal of Electronic Materials 48 (11), 7562-7572, 2019
Multifunctional sensing platform with pulsed-laser-deposited silver nanoporous structures
X Zhao, Z Deng, Y Long, B Feng, X Jiang, X Liu, Y Zhong, S Zou, Z Zhen, ...
Sensors and Actuators A: Physical 293, 136-144, 2019
Effect of Ag Sintered Bondline Thickness on High Temperature Reliability of SiC Power Devices
Z Deng, G Zou, Q Jia, B Feng, H Zhang, H Ren, L Liu
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2021
NacreInspired, Liquid MetalBased Ultrasensitive Electronic Skin by Spatially Regulated Cracking Strategy
B Feng, X Jiang, G Zou, W Wang, T Sun, H Yang, G Zhao, M Dong, Y Xiao, ...
Advanced Functional Materials, 2102359, 2021
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