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Yutai Su
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Thermo-elasto-plastic phase-field modelling of mechanical behaviours of sintered nano-silver with randomly distributed micro-pores
Y Su, G Fu, C Liu, K Zhang, L Zhao, C Liu, A Liu, J Song
Computer Methods in Applied Mechanics and Engineering 378, 113729, 2021
372021
Statistical effects of pore features on mechanical properties and fracture behaviors of heterogeneous random porous materials by phase-field modeling
Y Su, J Zhu, X Long, L Zhao, C Chen, C Liu
International Journal of Solids and Structures 264, 112098, 2023
292023
Machine learning method to predict dynamic compressive response of concrete-like material at high strain rates
X Long, M Mao, T Su, Y Su, M Tian
Defence Technology 23, 100-111, 2023
282023
Gaussian filtering method of evaluating the elastic/elasto-plastic properties of sintered nanocomposites with quasi-continuous volume distribution
Y Su, Z Shen, X Long, C Chen, L Qi, X Chao
Materials Science and Engineering: A 872, 145001, 2023
202023
Connecting the macroscopic and mesoscopic properties of sintered silver nanoparticles by crystal plasticity finite element method
X Long, K Chong, Y Su, L Du, G Zhang
Engineering Fracture Mechanics 281, 109137, 2023
192023
Constitutive, creep, and fatigue behavior of sintered Ag for finite element simulation of mechanical reliability: a critical review
X Long, Y Guo, Y Su, KS Siow, C Chen
Journal of Materials Science: Materials in Electronics, 1-17, 2022
182022
Machine learning framework for predicting the low cycle fatigue life of lead-free solders
X Long, C Lu, Y Su, Y Dai
Engineering Failure Analysis 148, 107228, 2023
172023
Unveiling the damage evolution of SAC305 during fatigue by entropy generation
X Long, Y Guo, Y Su, KS Siow, C Chen
International Journal of Mechanical Sciences 244, 108087, 2023
172023
Meso-scale low-cycle fatigue damage of polycrystalline nickel-based alloy by crystal plasticity finite element method
X Long, K Chong, Y Su, C Chang, L Zhao
International Journal of Fatigue 175, 107778, 2023
142023
Coupling of phase field and viscoplasticity for modelling cyclic softening and crack growth under fatigue
J Song, LG Zhao, H Qi, S Li, D Shi, J Huang, Y Su, K Zhang
European Journal of Mechanics-A/Solids 92, 104472, 2022
142022
Determine the unique constitutive properties of elastoplastic materials from their plastic zone evolution under nanoindentation
X Long, Z Shen, Q Jia, J Li, R Dong, Y Su, X Yang, K Zhou
Mechanics of Materials 175, 104485, 2022
122022
Identification of mechanical properties of thin-film elastoplastic materials by machine learning
X Long, C Lu, Z Shen, Y Su
Acta Mechanica Solida Sinica 36 (1), 13-21, 2023
112023
Ultrasonically enhanced flux-less bonding with Zn-5Al alloy under ambient condition for high-temperature electronics interconnects
C Liu, A Liu, Y Su, Y Chen, Z Zhou, C Liu
Journal of Manufacturing Processes 73, 139-148, 2022
112022
Life prediction methodology of system-in-package based on physics of failure
G Fu, Y Su, W Guo, B Wan, Z Zhang, Y Wang
Microelectronics Reliability 88, 173-178, 2018
112018
Determination of gradient residual stress for elastoplastic materials by nanoindentation
Z Shen, R Dong, J Li, Y Su, X Long
Journal of Manufacturing Processes 109, 359-366, 2024
102024
Fatigue reliability design for metal dual inline packages under random vibration based on response surface method
Y Su, G Fu, B Wan, T Yu, W Zhou, X Wang
Microelectronics Reliability 100, 113404, 2019
92019
Indentation reverse algorithm of mechanical response for Elastoplastic Coatings based on LSTM Deep Learning
X Long, X Ding, J Li, R Dong, Y Su, C Chang
Materials 16 (7), 2617, 2023
82023
Dimensionless analysis to determine elastoplastic properties of thin films by indentation
X Long, J Li, Z Shen, Y Su
Coatings 12 (11), 1768, 2022
82022
Research on sintering process and thermal conductivity of hybrid nanosilver solder paste based on molecular dynamics simulation
Z Zhang, G Fu, B Wan, Y Su, M Jiang
Microelectronics Reliability 126, 114203, 2021
82021
Fatigue crack evolution and effect analysis of Ag sintering die-attachment in SiC power devices under power cycling based on phase-field simulation
Y Su, G Fu, C Liu, C Liu, X Long
Microelectronics Reliability 126, 114244, 2021
82021
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Articles 1–20