Low dielectric constant materials for ULSI interconnects M Morgen, ET Ryan, JH Zhao, C Hu, T Cho, PS Ho Annual Review of Materials Science 30 (1), 645-680, 2000 | 510 | 2000 |
Circuit device with at least partial packaging and method for forming GR Leal, JH Zhao, ER Prack, RJ Wenzel, BD Sawyer, DG Wontor, ... US Patent 6,838,776, 2005 | 248 | 2005 |
Circuit device with at least partial packaging, exposed active surface and a voltage reference plane GR Leal, JH Zhao, ER Prack, RJ Wenzel, BD Sawyer, DG Wontor, ... US Patent 6,921,975, 2005 | 233 | 2005 |
Measurement of elastic modulus, Poisson ratio, and coefficient of thermal expansion of on-wafer submicron films JH Zhao, T Ryan, PS Ho, AJ McKerrow, WY Shih Journal of Applied Physics 85 (9), 6421-6424, 1999 | 174 | 1999 |
Packaging effects on reliability of Cu/low-k interconnects G Wang, C Merrill, JH Zhao, SK Groothuis, PS Ho IEEE Transactions on Device and Materials Reliability 3 (4), 119-128, 2003 | 155 | 2003 |
Simultaneous measurement of Young’s modulus, Poisson ratio, and coefficient of thermal expansion of thin films on substrates JH Zhao, Y Du, M Morgen, PS Ho Journal of Applied Physics 87 (3), 1575-1577, 2000 | 99 | 2000 |
Dual stage modeling of moisture absorption and desorption in epoxy mold compounds MD Placette, X Fan, JH Zhao, D Edwards Microelectronics Reliability 52 (7), 1401-1408, 2012 | 94 | 2012 |
Reliability issues for flip-chip packages PS Ho, G Wang, M Ding, JH Zhao, X Dai Microelectronics Reliability 44 (5), 719-737, 2004 | 92 | 2004 |
Thermomechanical properties and moisture uptake characteristics of hydrogen silsesquioxane JH Zhao, I Malik, T Ryan, ET Ogawa, PS Ho, WY Shih, AJ McKerrow, ... Applied Physics Letters 74 (7), 944-946, 1999 | 84 | 1999 |
Characterization of viscoelasticity of molding compounds in time domain SH Chae, JH Zhao, DR Edwards, PS Ho International Electronic Packaging Technical Conference and Exhibition 43598 …, 2009 | 83 | 2009 |
Thermal stress and glass transition of ultrathin polystyrene films JH Zhao, M Kiene, C Hu, PS Ho Applied Physics Letters 77 (18), 2843-2845, 2000 | 72 | 2000 |
D− centers in spherical quantum dots JL Zhu, JH Zhao, WH Duan, BL Gu Physical Review B 46 (12), 7546, 1992 | 69 | 1992 |
Experimental evaluations of the strength of silicon die by 3-point-bend versus ball-on-ring tests JH Zhao, J Tellkamp, V Gupta, D Edwards Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM …, 2008 | 68 | 2008 |
Circuit device with at least partial packaging and method for forming GR Leal, JH Zhao, ER Prack, RJ Wenzel, BD Sawyer, DG Wontor, ... US Patent 7,361,987, 2008 | 64 | 2008 |
Microstructure-based stress modeling of tin whisker growth JH Zhao, P Su, M Ding, S Chopin, PS Ho IEEE transactions on electronics packaging manufacturing 29 (4), 265-273, 2006 | 64 | 2006 |
Analysis and modeling verification for thermal-mechanical deformation in flip-chip packages JH Zhao, X Dai, PS Ho 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat …, 1998 | 63 | 1998 |
Neutral and negative donors in quantum dots JL Zhu, JH Zhao, JJ Xiong Journal of Physics: Condensed Matter 6 (27), 5097, 1994 | 58 | 1994 |
Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures JH Zhao, WJ Qi, PS Ho Microelectronics Reliability 42 (1), 27-34, 2002 | 54 | 2002 |
Dimensionality and potential-shape effects on D 0 and D− ground states in quantum dots JL Zhu, JH Zhao, JJ Xiong Physical Review B 50 (3), 1832, 1994 | 54 | 1994 |
A dual stage model of anomalous moisture diffusion and desorption in epoxy mold compounds MD Placette, X Fan, JH Zhao, D Edwards 2011 12th intl. Conf. On thermal, mechanical & multi-physics simulation and …, 2011 | 52 | 2011 |