| Magnesium, magnesium alloys, and magnesium composites M Gupta, SNM Ling John Wiley & Sons, 2011 | 356 | 2011 |
| Magnesium, magnesium alloys, and magnesium composites M Gupta, SNM Ling John Wiley & Sons, 2011 | 356 | 2011 |
| Low temperature wafer anodic bonding J Wei, H Xie, ML Nai, CK Wong, LC Lee Journal of Micromechanics and Microengineering 13 (2), 217, 2003 | 176 | 2003 |
| Microstructure and mechanical properties of hypo/hyper-eutectic Al–Si alloys synthesized using a near-net shape forming technique M Gupta, S Ling Journal of Alloys and Compounds 287 (1-2), 284-294, 1999 | 160 | 1999 |
| Improving the performance of lead-free solder reinforced with multi-walled carbon nanotubes SML Nai, J Wei, M Gupta Materials Science and Engineering: A 423 (1-2), 166-169, 2006 | 158 | 2006 |
| Influence of ceramic reinforcements on the wettability and mechanical properties of novel lead-free solder composites SML Nai, J Wei, M Gupta Thin Solid Films 504 (1-2), 401-404, 2006 | 153 | 2006 |
| Hierarchical microstructure and strengthening mechanisms of a CoCrFeNiMn high entropy alloy additively manufactured by selective laser melting ZG Zhu, QB Nguyen, FL Ng, XH An, XZ Liao, PK Liaw, SML Nai, J Wei Scripta Materialia 154, 20-24, 2018 | 143 | 2018 |
| Interfacial intermetallic growth and shear strength of lead-free composite solder joints SML Nai, J Wei, M Gupta Journal of Alloys and Compounds 473 (1-2), 100-106, 2009 | 130 | 2009 |
| Interfacial intermetallic growth and shear strength of lead-free composite solder joints SML Nai, J Wei, M Gupta Journal of Alloys and Compounds 473 (1-2), 100-106, 2009 | 130 | 2009 |
| Effect of carbon nanotubes on the shear strength and electrical resistivity of a lead-free solder SML Nai, J Wei, M Gupta Journal of Electronic Materials 37 (4), 515-522, 2008 | 98 | 2008 |
| Spatial and geometrical-based characterization of microstructure and microhardness for an electron beam melted Ti–6Al–4V component P Wang, X Tan, MLS Nai, SB Tor, J Wei Materials & Design 95, 287-295, 2016 | 86 | 2016 |
| Lead-free solder reinforced with multiwalled carbon nanotubes SML Nai, J Wei, M Gupta Journal of electronic materials 35 (7), 1518-1522, 2006 | 86 | 2006 |
| Effect of carbon nanotubes on corrosion of Mg–CNT composites NN Aung, W Zhou, CS Goh, SML Nai, J Wei Corrosion Science 52 (5), 1551-1553, 2010 | 71 | 2010 |
| Influence of stirring speed on the synthesis of Al/SiC based functionally gradient materials SML Nai, M Gupta Composite Structures 57 (1-4), 227-233, 2002 | 71 | 2002 |
| Influence of stirring speed on the synthesis of Al/SiC based functionally gradient materials SML Nai, M Gupta Composite Structures 57 (1-4), 227-233, 2002 | 71 | 2002 |
| Effect of different heat treatments on the microstructure and mechanical properties in selective laser melted INCONEL 718 alloy S Raghavan, B Zhang, P Wang, CN Sun, MLS Nai, T Li, J Wei Materials and Manufacturing Processes 32 (14), 1588-1595, 2017 | 70 | 2017 |
| Effects of processing parameters on surface roughness of additive manufactured Ti-6Al-4V via electron beam melting P Wang, WJ Sin, MLS Nai, J Wei Materials 10 (10), 1121, 2017 | 69 | 2017 |
| Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling YD Han, HY Jing, SML Nai, LY Xu, CM Tan, J Wei Intermetallics 31, 72-78, 2012 | 68 | 2012 |
| Development of a Sn–Ag–Cu solder reinforced with Ni-coated carbon nanotubes YD Han, SML Nai, HY Jing, LY Xu, CM Tan, J Wei Journal of Materials Science: Materials in Electronics 22 (3), 315-322, 2011 | 68 | 2011 |
| Temperature dependence of creep and hardness of Sn-Ag-Cu lead-free solder YD Han, HY Jing, SML Nai, LY Xu, CM Tan, J Wei Journal of Electronic Materials 39 (2), 223-229, 2010 | 65 | 2010 |
