| VLSI placement parameter optimization using deep reinforcement learning A Agnesina, K Chang, SK Lim Proceedings of the 39th international conference on computer-aided design, 1-9, 2020 | 75 | 2020 |
| GAN-CTS: A generative adversarial framework for clock tree prediction and optimization YC Lu, J Lee, A Agnesina, K Samadi, SK Lim 2019 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 1-8, 2019 | 60 | 2019 |
| Autodmp: Automated dreamplace-based macro placement A Agnesina, P Rajvanshi, T Yang, G Pradipta, A Jiao, B Keller, B Khailany, ... Proceedings of the 2023 International Symposium on Physical Design, 149-157, 2023 | 21 | 2023 |
| Heterogeneous 3D integration for a RISC-V system with STT-MRAM L Zhu, L Bamberg, A Agnesina, F Catthoor, D Milojevic, M Komalan, ... IEEE Computer Architecture Letters 19 (1), 51-54, 2020 | 18 | 2020 |
| A general framework for VLSI tool parameter optimization with deep reinforcement learning A Agnesina, S Pentapati, SK Lim NeurIPS 2020 Workshop on Machine Learning for Systems, 2020 | 12 | 2020 |
| A novel 3D DRAM memory cube architecture for space applications A Agnesina, A Sidana, J Yamaguchi, C Krutzik, J Carson, ... Proceedings of the 55th Annual Design Automation Conference, 1-6, 2018 | 9 | 2018 |
| Improving FPGA-based logic emulation systems through machine learning A Agnesina, SK Lim, E Lepercq, JED Cid ACM Transactions on Design Automation of Electronic Systems (TODAES) 25 (5 …, 2020 | 8 | 2020 |
| Hier-3D: A hierarchical physical design methodology for face-to-face-bonded 3D ICs A Agnesina, M Brunion, A García-Ortiz, F Catthoor, D Milojevic, ... Proceedings of the ACM/IEEE International Symposium on Low Power Electronics …, 2022 | 6 | 2022 |
| MemPool-3D: Boosting performance and efficiency of shared-L1 memory many-core clusters with 3D integration M Cavalcante, A Agnesina, S Riedel, M Brunion, A García-Ortiz, ... 2022 Design, Automation & Test in Europe Conference & Exhibition (DATE), 394-399, 2022 | 6 | 2022 |
| ART-3D: Analytical 3D placement with reinforced parameter tuning for monolithic 3D ICs G Murali, SM Shaji, A Agnesina, G Luo, SK Lim Proceedings of the 2022 International Symposium on Physical Design, 97-104, 2022 | 5 | 2022 |
| CircuitOps: An ML Infrastructure Enabling Generative AI for VLSI Circuit Optimization R Liang, A Agnesina, G Pradipta, VA Chhabria, H Ren 2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD), 1-6, 2023 | 4 | 2023 |
| Parameter optimization of vlsi placement through deep reinforcement learning A Agnesina, K Chang, SK Lim IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2022 | 4 | 2022 |
| A clock tree prediction and optimization framework using generative adversarial learning YC Lu, J Lee, A Agnesina, K Samadi, SK Lim IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2021 | 4 | 2021 |
| Reducing compilation effort in commercial FPGA emulation systems using machine learning A Agnesina, E Lepercq, J Escobedo, SK Lim 2019 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 1-8, 2019 | 4 | 2019 |
| Bringing 3D COTS DRAM memory cubes to space A Agnesina, J Yamaguchi, C Krutzik, J Carson, J Yang-Scharlotta, SK Lim 2019 IEEE Aerospace Conference, 1-11, 2019 | 4 | 2019 |
| On legalization of die bonding bumps and pads for 3D ICs S Pentapati, A Agnesina, M Brunion, YH Huang, SK Lim Proceedings of the 2023 International Symposium on Physical Design, 62-70, 2023 | 3 | 2023 |
| Power, performance, area and cost analysis of memory-on-logic face-to-face bonded 3D processor designs A Agnesina, M Brunion, J Kim, A Garcia-Ortiz, D Milojevic, F Catthoor, ... 2021 IEEE/ACM International Symposium on Low Power Electronics and Design …, 2021 | 3 | 2021 |
| A fault-tolerant and high-speed memory controller targeting 3D flash memory cubes for space applications A Agnesina, J Yamaguchi, C Krutzik, J Carson, D Nakamura, SK Lim 2020 IEEE 38th International Conference on Computer Design (ICCD), 425-432, 2020 | 1 | 2020 |
| A COTS-based novel 3-D DRAM memory cube architecture for space applications A Agnesina, J Yamaguchi, C Krutzik, J Carson, J Yang-Scharlotta, SK Lim IEEE Transactions on Very Large Scale Integration (VLSI) Systems 28 (9 …, 2020 | 1 | 2020 |
| On Legalization of Die Bonding Bumps and Pads for 3D ICs YH Huang, S Pentapati, A Agnesina, M Brunion, SK Lim IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2024 | | 2024 |
Sung Kyu LimProfessor, Georgia Institute of TechnologyVerified email at ece.gatech.edu
