| All WSe2 1T1R resistive RAM cell for future monolithic 3D embedded memory integration M Sivan, Y Li, H Veluri, Y Zhao, B Tang, X Wang, E Zamburg, JF Leong, ... Nature communications 10 (1), 5201, 2019 | 132 | 2019 |
| High-throughput, area-efficient, and variation-tolerant 3-D in-memory compute system for deep convolutional neural networks H Veluri, Y Li, JX Niu, E Zamburg, AVY Thean IEEE Internet of Things Journal 8 (11), 9219-9232, 2021 | 17 | 2021 |
| Aerosol Jet Printed WSe2 Based RRAM on Kapton Suitable for Flexible Monolithic Memory Integration Y Li, M Sivan, JX Niu, H Veluri, E Zamburg, J Leong, U Chand, S Samanta, ... 2019 IEEE International Conference on Flexible and Printable Sensors and …, 2019 | 8 | 2019 |
| Design-Technology Co-optimization (DTCO) for Emerging Disruptive Logic & Embedded Memory Process Technologies JX Niu, H Veluri, AVY Thean 2019 Electron Devices Technology and Manufacturing Conference (EDTM), 246-248, 2019 | 2 | 2019 |
| Design and Study of an Artificial Spiking Neuron Enabled by Low-Voltage SiOx-based ReRAM JXH Niu, Y Li, H Veluri, AVY Thean 2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference …, 2019 | | 2019 |
| Design of Artificial Spiking Neuron with SiO2 Memristive Synapse to Demonstrate Neuron-Level Spike Timing Dependent Plasticity JX Niu, H Veluri, Y Li, U Chand, JF Leong, E Zamburg, M Sivan, ... 2019 International Conference on IC Design and Technology (ICICDT), 1-3, 2019 | | 2019 |
