The recoiling of liquid droplets upon collision with solid surfaces HY Kim, JH Chun Physics of fluids 13 (3), 643-659, 2001 | 276 | 2001 |
Production of charged uniformly sized metal droplets JH Chun, CH Passow US Patent 5,266,098, 1993 | 173 | 1993 |
Instability of a liquid jet emerging from a droplet upon collision with a solid surface HY Kim, ZC Feng, JH Chun Physics of Fluids 12 (3), 531-541, 2000 | 139 | 2000 |
Nano-scale scratching in chemical–mechanical polishing N Saka, T Eusner, JH Chun CIRP annals 57 (1), 341-344, 2008 | 81 | 2008 |
A 16 Gb/s/link, 64 GB/s bidirectional asymmetric memory interface H Lee, KYK Chang, JH Chun, T Wu, Y Frans, B Leibowitz, N Nguyen, ... IEEE Journal of Solid-State Circuits 44 (4), 1235-1247, 2009 | 75 | 2009 |
Droplet-based manufacturing JH Chun, CH Passow, NP Suh CIRP annals 42 (1), 235-238, 1993 | 67 | 1993 |
Spray deposition of a Sn-40 Wt Pct Pb alloy with uniform droplets CH Passow, JH Chun, T Ando Metallurgical Transactions A 24, 1187-1193, 1993 | 60 | 1993 |
Anti-sticking behavior of DLC-coated silicon micro-molds B Saha, E Liu, SB Tor, NW Khun, DE Hardt, JH Chun Journal of micromechanics and microengineering 19 (10), 105025, 2009 | 57 | 2009 |
Evolution of copper-oxide damascene structures in chemical mechanical polishing: I. Contact mechanics modeling JY Lai, N Saka, JH Chun Journal of The Electrochemical Society 149 (1), G31, 2001 | 53 | 2001 |
Direct TOF scanning LiDAR sensor with two-step multievent histogramming TDC and embedded interference filter H Seo, H Yoon, D Kim, J Kim, SJ Kim, JH Chun, J Choi IEEE Journal of Solid-State Circuits 56 (4), 1022-1035, 2021 | 51 | 2021 |
A 16Gb/s/link, 64GB/s bidirectional asymmetric memory interface cell K Chang, H Lee, JH Chun, T Wu, TJ Chin, K Kaviani, J Shen, X Shi, ... 2008 IEEE symposium on VLSI circuits, 126-127, 2008 | 50 | 2008 |
Production and characterization of mono-sized Sn-Pb alloy balls P Yim, JH Chun, T Ando, VK Sikka International journal of powder metallurgy (1986) 32 (2), 155-164, 1996 | 49 | 1996 |
The role of pad topography in chemical-mechanical polishing S Kim, N Saka, JH Chun IEEE Transactions on Semiconductor Manufacturing 27 (3), 431-442, 2014 | 48 | 2014 |
Digitalization of automotive industry–scenarios for future manufacturing S Peters, JH Chun, G Lanza EDP Sciences, 2015 | 47 | 2015 |
Efficient Scalable Modeling of Double-Equivalent Circuit for On-Chip Spiral Inductors YG Ahn, SK Kim, JH Chun, BS Kim IEEE transactions on microwave theory and techniques 57 (10), 2289-2300, 2009 | 46 | 2009 |
RF ESD protection strategies: Codesign vs. low-C protection W Soldner, M Streibl, U Hodel, M Tiebout, H Gossner, ... Microelectronics Reliability 47 (7), 1008-1015, 2007 | 42 | 2007 |
ESD protection circuits for advanced CMOS technologies JH Chun Stanford University, 2006 | 42 | 2006 |
High efficiency photoresist coating JH Chun, J Derksen, S Han US Patent 6,191,053, 2001 | 39 | 2001 |
Effects of droplet thermal state on deposit microstructure in spray forming CA Chen, P Acquaviva, JH Chun, T Ando Scripta materialia 34 (5), 689-696, 1996 | 39 | 1996 |
A low power CMOS compatible embedded EEPROM for passive RFID tag KS Lee, JH Chun, KW Kwon Microelectronics Journal 41 (10), 662-668, 2010 | 38 | 2010 |