| TSV-integrated surface electrode ion trap for scalable quantum information processing P Zhao, JP Likforman, HY Li, J Tao, T Henner, YD Lim, WW Seit, CS Tan, ... Applied Physics Letters 118 (12), 124003, 2021 | 22 | 2021 |
| In-depth parametric study of Ar or N2 plasma activated Cu surfaces for Cu-Cu direct bonding L Hu, SCK Goh, J Tao, YD Lim, P Zhao, MJZ Lim, CS Tan 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 420-425, 2021 | 14 | 2021 |
| Fabrication and Characterization of Surface Electrode Ion Trap for Quantum Computing J Tao, NP Chew, L Guidoni, YD Lim, P Zhao, CS Tan 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 363-366, 2018 | 12 | 2018 |
| Design and Fabrication of Grating Couplers for the Optical Addressing of Trapped Ions YD Lim, HY Li, P Zhao, J Tao, L Guidoni, CS Tan IEEE Photonics Journal 13 (4), 1-6, 2021 | 10 | 2021 |
| Process development and reliability study on Ar/N2 plasma activated Cu-Cu wafer-level bonding SL Chua, L Hu, J Tao, CS Tan The Conference on Wafer Bonding for MEMS, 3D-and Wafer Level Integration …, 2019 | 10 | 2019 |
| Time-Dependent Evolution Study of Ar/N2 Plasma-Activated Cu Surface for Enabling Two-Step Cu-Cu Direct Bonding in a Non-Vacuum Environment L Hu, SCK Goh, J Tao, YD Lim, P Zhao, MJZ Lim, T Salim, ... ECS Journal of Solid State Science and Technology 10 (12), 124001, 2021 | 8 | 2021 |
| Glass Substrate Interposer for TSV-integrated Surface Electrode Ion Trap P Zhao, HY Li, YD Lim, J Tao, WW Seit, L Guidoni, CS Tan 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 262-265, 2020 | 8 | 2020 |
| Investigation of process parameters and characterization of nanowire anisotropic conductive film for interconnection applications J Tao, M Hasan, J Xu, A Mathewson, KM Razeeb IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (3 …, 2014 | 8 | 2014 |
| RF Performance Benchmarking of TSV Integrated Surface Electrode Ion Trap for Quantum Computing P Zhao, HY Li, J Tao, JP Likforman, YD Lim, WW Seit, L Guidoni, CS Tan IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 7 | 2021 |
| Design, Fabrication and Characterization of Surface Electrode Ion Trap Integrated with TSV P Zhao, J Tao, HY Li, YD Lim, L Guidoni, CS Tan 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 13-17, 2019 | 7 | 2019 |
| Design and Development of Single-Qubit Ion Trap on Glass and Si Substrates With RF Analysis and Performance Benchmarking AAA Apriyana, H Li, P Zhao, J Tao, YD Lim, Y Lin, L Guidoni, CS Tan IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 6 | 2020 |
| Surface Electrode Ion-Trap with Ground Structures for Minimizing the Dielectric Loss in the Si Substrate J Tao, HY Li, YD Lim, P Zhao, AAA Apriyana, L Guidoni, CS Tan IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019 | 6 | 2019 |
| 3D Integration of CMOS-Compatible Surface Electrode Ion Trap and Silicon Photonics for Scalable Quantum Computing J Tao, YD Lim, HY Li, NP Chew, AAA Apriyana, L Bu, P Zhao, L Guidoni, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1735-1743, 2019 | 6 | 2019 |
| Systematic Investigation and Characterization of Ag Paste for LED Die Attach L Hu, J Tao, S Bao, SCK Goh, YD Lim, P Zhao, MJZ Lim, SC Tan, ... 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), 140-143, 2021 | 5 | 2021 |
| Heterogenous Integration of Silicon Ion Trap and Glass Interposer for Scalable Quantum Computing Enabled by TSV, Micro-bumps and RDL P Zhao, HY Li, J Tao, YD Lim, WW Seit, L Guidoni, CS Tan 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 279-284, 2021 | 5 | 2021 |
| Study of fine pitch micro-interconnections formed by low temperature bonded copper nanowires based anisotropic conductive film J Tao, A Mathewson, KM Razeeb 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 1064-1070, 2014 | 5 | 2014 |
| Nanowire based anisotropic conductive film (NW-ACF) for low temperature 3D stacking applications J Tao, A Mathewson, KM Razeeb MiNaPAD Forum 2014, 2014 | 5 | 2014 |
| Large‐Scale Fabrication of Surface Ion Traps on a 300 mm Glass Wafer J Tao, JP Likforman, P Zhao, HY Li, T Henner, YD Lim, WW Seit, ... physica status solidi (b) 258 (7), 2000589, 2021 | 4 | 2021 |
| Performance Comparison of High Resistivity Silicon, Silicon with Grounding Plane and Glass as Substrate of Ion Trap for Quantum Information Processing P Zhao, J Tao, HY Li, YD Lim, Y Lin, L Guidoni, CS Tan 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 1-5, 2020 | 4 | 2020 |
| Test structure for electrical characterization of copper nanowire anisotropic conductive film (NW-ACF) for 3D stacking applications J Tao, A Mathewson, KM Razeeb 2014 International Conference on Microelectronic Test Structures (ICMTS …, 2014 | 4 | 2014 |
Chuan Seng TanProfessor, Nanyang Technological University, Singapore | IEEE Fellow | IMAPS FellowVerified email at ntu.edu.sg
