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Jing Tao
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TSV-integrated surface electrode ion trap for scalable quantum information processing
P Zhao, JP Likforman, HY Li, J Tao, T Henner, YD Lim, WW Seit, CS Tan, ...
Applied Physics Letters 118 (12), 124003, 2021
222021
In-depth parametric study of Ar or N2 plasma activated Cu surfaces for Cu-Cu direct bonding
L Hu, SCK Goh, J Tao, YD Lim, P Zhao, MJZ Lim, CS Tan
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 420-425, 2021
162021
Design and Fabrication of Grating Couplers for the Optical Addressing of Trapped Ions
YD Lim, HY Li, P Zhao, J Tao, L Guidoni, CS Tan
IEEE Photonics Journal 13 (4), 1-6, 2021
122021
Fabrication and Characterization of Surface Electrode Ion Trap for Quantum Computing
J Tao, NP Chew, L Guidoni, YD Lim, P Zhao, CS Tan
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 363-366, 2018
122018
Time-Dependent Evolution Study of Ar/N2 Plasma-Activated Cu Surface for Enabling Two-Step Cu-Cu Direct Bonding in a Non-Vacuum Environment
L Hu, SCK Goh, J Tao, YD Lim, P Zhao, MJZ Lim, T Salim, ...
ECS Journal of Solid State Science and Technology 10 (12), 124001, 2021
102021
Process development and reliability study on Ar/N2 plasma activated Cu-Cu wafer-level bonding
SL Chua, L Hu, J Tao, CS Tan
The Conference on Wafer Bonding for MEMS, 3D-and Wafer Level Integration …, 2019
102019
Glass Substrate Interposer for TSV-integrated Surface Electrode Ion Trap
P Zhao, HY Li, YD Lim, J Tao, WW Seit, L Guidoni, CS Tan
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 262-265, 2020
82020
Design, Fabrication and Characterization of Surface Electrode Ion Trap Integrated with TSV
P Zhao, J Tao, HY Li, YD Lim, L Guidoni, CS Tan
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 13-17, 2019
82019
3D Integration of CMOS-Compatible Surface Electrode Ion Trap and Silicon Photonics for Scalable Quantum Computing
J Tao, YD Lim, HY Li, NP Chew, AAA Apriyana, L Bu, P Zhao, L Guidoni, ...
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1735-1743, 2019
82019
Investigation of process parameters and characterization of nanowire anisotropic conductive film for interconnection applications
J Tao, M Hasan, J Xu, A Mathewson, KM Razeeb
IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (3 …, 2014
82014
RF Performance Benchmarking of TSV Integrated Surface Electrode Ion Trap for Quantum Computing
P Zhao, HY Li, J Tao, JP Likforman, YD Lim, WW Seit, L Guidoni, CS Tan
IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021
72021
Design and Development of Single-Qubit Ion Trap on Glass and Si Substrates With RF Analysis and Performance Benchmarking
AAA Apriyana, H Li, P Zhao, J Tao, YD Lim, Y Lin, L Guidoni, CS Tan
IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020
62020
Surface Electrode Ion-Trap with Ground Structures for Minimizing the Dielectric Loss in the Si Substrate
J Tao, HY Li, YD Lim, P Zhao, AAA Apriyana, L Guidoni, CS Tan
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019
62019
Systematic Investigation and Characterization of Ag Paste for LED Die Attach
L Hu, J Tao, S Bao, SCK Goh, YD Lim, P Zhao, MJZ Lim, SC Tan, ...
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), 140-143, 2021
52021
Heterogenous Integration of Silicon Ion Trap and Glass Interposer for Scalable Quantum Computing Enabled by TSV, Micro-bumps and RDL
P Zhao, HY Li, J Tao, YD Lim, WW Seit, L Guidoni, CS Tan
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 279-284, 2021
52021
Study of fine pitch micro-interconnections formed by low temperature bonded copper nanowires based anisotropic conductive film
J Tao, A Mathewson, KM Razeeb
2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 1064-1070, 2014
52014
Nanowire based anisotropic conductive film (NW-ACF) for low temperature 3D stacking applications
J Tao, A Mathewson, KM Razeeb
MiNaPAD Forum 2014, 2014
52014
Large‐Scale Fabrication of Surface Ion Traps on a 300 mm Glass Wafer
J Tao, JP Likforman, P Zhao, HY Li, T Henner, YD Lim, WW Seit, ...
physica status solidi (b) 258 (7), 2000589, 2021
42021
Performance Comparison of High Resistivity Silicon, Silicon with Grounding Plane and Glass as Substrate of Ion Trap for Quantum Information Processing
P Zhao, J Tao, HY Li, YD Lim, Y Lin, L Guidoni, CS Tan
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 1-5, 2020
42020
EO Integration of Planar Ion Trap and Silicon Photonics for Optical Addressing in Quantum Computing
YD Lim, J Tao, P Zhao, HY Li, AAA Apriyana, L Guidoni, CS Tan
CLEO: Applications and Technology, ATh1I. 3, 2020
42020
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