| Mechanical properties of Sn–0.7 Cu/Si3N4 lead-free composite solder MAAM Salleh, AMM Al Bakri, MH Zan, F Somidin, NFM Alui, ZA Ahmad Materials Science and Engineering: A 556, 633-637, 2012 | 74 | 2012 |
| Solderability of Sn-0.7 Cu/Si3N4 lead-free composite solder on Cu-substrate MS MAA, AMM Al Bakri, H Kamarudin, M Bnhussain, F Somidin Physics Procedia 22, 299-304, 2011 | 61 | 2011 |
| Characterising the polymorphic phase transformation at a localised point on a Cu6Sn5 grain F Somidin, H Maeno, MAAM Salleh, XQ Tran, SD McDonald, ... Materials Characterization 138, 113-119, 2018 | 40 | 2018 |
| In-Situ Observation of the Continuous Phase Transition in Determining the High Thermoelectric Performance of Polycrystalline Sn0.98Se M Dargusch, XL Shi, XQ Tran, T Feng, F Somidin, X Tan, W Liu, K Jack, ... The Journal of Physical Chemistry Letters 10 (21), 6512-6517, 2019 | 38 | 2019 |
| A comparative study of solder properties of Sn-0.7 Cu lead-free solder fabricated via the powder metallurgy and casting methods M Salleh, AMM Al Bakri, F Somidin, AV Sandu, N Saud, H Kamaruddin, ... Revista de Chimie (Bucharest) 64 (7), 2013 | 23 | 2013 |
| Atom locations in a Ni doped η-(Cu, Ni) 6Sn5 intermetallic compound W Yang, T Yamamoto, K Aso, F Somidin, K Nogita, S Matsumura Scripta Materialia 158, 1-5, 2019 | 21 | 2019 |
| Intermetallic compound formation on solder alloy/Cu-substrate interface using lead-free Sn-0.7 Cu/recycled-Aluminum composite solder F Somidin, MAA Mohd Salleh, KR Ahmad Advanced Materials Research 620, 105-111, 2013 | 21 | 2013 |
| Imaging the Polymorphic Transformation in a Single Cu6Sn5 Grain in a Solder Joint F Somidin, H Maeno, XQ Tran, S D. McDonald, MAA Mohd Salleh, ... Materials 11 (11), 2229, 2018 | 15 | 2018 |
| Atomic locations of minor dopants and their roles in the stabilization of W Yang, XQ Tran, T Yamamoto, S Yoshioka, F Somidin, K Nogita, ... Physical Review Materials 4 (6), 065002, 2020 | 11 | 2020 |
| Origin of Primary Cu6Sn5 in Hypoeutectic Solder Alloys and a Method of Suppression to Improve Mechanical Properties SFN Muhd Amli, MAA Mohd Salleh, MII Ramli, H Yasuda, J Chaiprapa, ... Journal of Electronic Materials 50, 710-722, 2021 | 10 | 2021 |
| Direct observation of the Ni stabilising effect in interfacial (Cu, Ni) 6Sn5 intermetallic compounds F Somidin, H Maeno, T Toriyama, SD McDonald, W Yang, S Matsumura, ... Materialia 9, 100530, 2020 | 9 | 2020 |
| Reducing cracking in solder joint interfacial Cu6Sn5 with modified reflow profile F Somidin, SD McDonald, X Ye, D Qu, K Sweatman, T Akaiwa, ... Transactions of The Japan Institute of Electronics Packaging 13, E19-004-1 …, 2020 | 7 | 2020 |
| The effectiveness of Ni microalloying on the microstructure and mechanical properties of low temperature In-35 wt% Sn/Cu solder joint MS Chang, MAAM Salleh, F Somidin, DSC Halin, H Yasuda, K Nogita Materials Science and Engineering: A 882, 145457, 2023 | 6 | 2023 |
| Recent development of novel lead-free composite solders using microwave-assisted sintering powder metallurgy route MAAM Salleh, AMM Al Bakri, F Somidin, H Kamarudin International Review of Mechanical Engineering 7, 53-59, 2013 | 5 | 2013 |
| In situ observation of liquid solder alloys and solid substrate reactions using high-voltage transmission electron microscopy XF Tan, F Somidin, SD McDonald, MJ Bermingham, H Maeno, ... Materials 15 (2), 510, 2022 | 4 | 2022 |
| In-situ observation of high-temperature Pb-free electric interconnections by synchrotron microradiography NRA Razak, XF Tan, F Somidin, H Yasuda, SD McDonald, K Nogita Materials Letters 291, 129520, 2021 | 4 | 2021 |
| Atomic insights into the ordered solid solutions of Ni and Au in η-Cu6Sn5 W Yang, XQ Tran, T Yamamoto, K Aso, F Somidin, XF Tan, Y Kawami, ... Acta Materialia 224, 117513, 2022 | 3 | 2022 |
| Mixed assembly of lead-free solder joint: a short review RM Said, MAAM Salleh, MII Ramli, N Saud, F Somidin, NRA Razak, ... Journal of Physics: Conference Series 2169 (1), 012039, 2022 | 3 | 2022 |
| Effect of reflow conditions on the intermetallic layer in solder joints K Nogita, F Somidin, MAAM Salleh, K Sweatman, T Nishimura, ... 2018 International Conference on Electronics Packaging and iMAPS All Asia …, 2018 | 3 | 2018 |
| Formation of Kirkendall Voids at Low and High Aging Temperature in the Sn-0.7Cu-1.0wt.%Si3N4/Cu Solder Joints N Saud, F Somidin, NS Ibrahim, MAA Mohd Salleh Advanced Materials Research 1107, 577-581, 2015 | 3 | 2015 |
