Simon J. Bleiker
Simon J. Bleiker
PhD Student in Micro and Nanosystmes, KTH Royal Institute of Technology
Verified email at - Homepage
Cited by
Cited by
Integrating mems and ics
AC Fischer, F Forsberg, M Lapisa, SJ Bleiker, G Stemme, N Roxhed, ...
Microsystems & Nanoengineering 1 (1), 1-16, 2015
High-aspect-ratio through silicon vias for high-frequency application fabricated by magnetic assembly of gold-coated nickel wires
SJ Bleiker, AC Fischer, U Shah, N Somjit, T Haraldsson, N Roxhed, ...
IEEE Transactions on components, packaging and Manufacturing technology 5 (1 …, 2014
Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wires
AC Fischer, SJ Bleiker, T Haraldsson, N Roxhed, G Stemme, F Niklaus
Journal of micromechanics and microengineering 22 (10), 105001, 2012
Integrated silicon photonic MEMS
N Quack, AY Takabayashi, H Sattari, P Edinger, G Jo, SJ Bleiker, ...
Microsystems & Nanoengineering 9 (1), 27, 2023
Scalable manufacturing of nanogaps
V Dubois, SJ Bleiker, G Stemme, F Niklaus
Advanced Materials 30 (46), 1801124, 2018
Nanoelectromechanical relay without pull-in instability for high-temperature non-volatile memory
S Rana, J Mouro, SJ Bleiker, JD Reynolds, HMH Chong, F Niklaus, ...
Nature communications 11 (1), 1181, 2020
Wafer-level vacuum sealing by transfer bonding of silicon caps for small footprint and ultra-thin MEMS packages
X Wang, SJ Bleiker, P Edinger, C Errando-Herranz, N Roxhed, G Stemme, ...
Journal of microelectromechanical systems 28 (3), 460-471, 2019
Wafer-level hermetically sealed silicon photonic MEMS
G Jo, P Edinger, SJ Bleiker, X Wang, AY Takabayashi, H Sattari, N Quack, ...
Photonics Research 10 (2), A14-A21, 2022
Amorphous carbon active contact layer for reliable nanoelectromechanical switches
D Grogg, CL Ayala, U Drechsler, A Sebastian, WW Koelmans, SJ Bleiker, ...
2014 IEEE 27th international conference on micro electro mechanical systems …, 2014
Performance analysis of nanoelectromechanical relay-based field-programmable gate arrays
T Qin, SJ Bleiker, S Rana, F Niklaus, D Pamunuwa
IEEE Access 6, 15997-16009, 2018
Through-glass vias for glass interposers and MEMS packaging applications fabricated using magnetic assembly of microscale metal wires
MJ Laakso, SJ Bleiker, J Liljeholm, GE Mårtensson, M Asiatici, AC Fischer, ...
Ieee Access 6, 44306-44317, 2018
Adhesive wafer bonding with ultra-thin intermediate polymer layers
SJ Bleiker, V Dubois, S Schröder, G Stemme, F Niklaus
Sensors and Actuators A: Physical 260, 16-23, 2017
Wafer-level vacuum packaging enabled by plastic deformation and low-temperature welding of copper sealing rings with a small footprint
X Wang, SJ Bleiker, M Antelius, G Stemme, F Niklaus
Journal of microelectromechanical systems 26 (2), 357-365, 2017
Nanoelectromechanical digital logic circuits using curved cantilever switches with amorphous-carbon-coated contacts
CL Ayala, D Grogg, A Bazigos, SJ Bleiker, M Fernandez-Bolanos, ...
Solid-State Electronics 113, 157-166, 2015
Wafer-level heterogeneous 3D integration for MEMS and NEMS
F Niklaus, M Lapisa, SJ Bleiker, V Dubois, N Roxhed, AC Fischer, ...
2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D …, 2012
Cost-efficient wafer-level capping for MEMS and imaging sensors by adhesive wafer bonding
SJ Bleiker, MM Visser Taklo, N Lietaer, A Vogl, T Bakke, F Niklaus
Micromachines 7 (10), 192, 2016
AC Fischer, F Forsberg, M Lapisa, SJ Bleiker, G Stemme, N Roxhed, ...
Microsystems Nanoeng 1 (1), e16, 2015
High aspect ratio TSVs fabricated by magnetic self-assembly of gold-coated nickel wires
AC Fischer, SJ Bleiker, N Somjit, N Roxhed, T Haraldsson, G Stemme, ...
2012 IEEE 62nd Electronic Components and Technology Conference, 541-547, 2012
Wafer-level vacuum sealing for packaging of silicon photonic MEMS
G Jo, P Edinger, SJ Bleiker, X Wang, AY Takabayashi, H Sattari, N Quack, ...
Silicon Photonics XVI 11691, 51-57, 2021
Vacuum-sealed silicon photonic MEMS tunable ring resonator with an independent control over coupling and phase
P Edinger, G Jo, CP Van Nguyen, AY Takabayashi, C Errando-Herranz, ...
Optics Express 31 (4), 6540-6551, 2023
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