Khai Ngo
Cited by
Cited by
Switching converter with pseudo-resonant DC link
US Patent 4,965,709, 1990
A 1200-V, 60-A SiC MOSFET multichip phase-leg module for high-temperature, high-frequency applications
Z Chen, Y Yao, D Boroyevich, KDT Ngo, P Mattavelli, K Rajashekara
IEEE Transactions on Power Electronics 29 (5), 2307-2320, 2013
New core loss measurement method for high-frequency magnetic materials
M Mu, Q Li, DJ Gilham, FC Lee, KDT Ngo
IEEE Transactions on Power Electronics 29 (8), 4374-4381, 2013
Steady-state analysis and design of a switched-capacitor DC-DC converter
KDT Ngo, R Webster
23rd Annual IEEE Power Electronics Specialists Conference, 1992., 378 - 385 …, 1992
Acoustic energy harvesting using an electromechanical Helmholtz resonator
F Liu, A Phipps, S Horowitz, K Ngo, L Cattafesta, T Nishida, M Sheplak
The Journal of the Acoustical Society of America 123 (4), 1983-1990, 2008
A PWM method for reduction of switching loss in a full-bridge inverter
RS Lai, KDT Ngo
IEEE Transactions on Power Electronics 10 (3), 326-332, 1995
Energy reclamation from a vibrating piezoceramic composite beam
A Kasyap, J Lim, D Johnson, S Horowitz, T Nishida, K Ngo, M Sheplak, ...
Proceedings of 9th International Congress on sound and vibration 9 (271), 36-43, 2002
Full-bridge lossless switching converter
RL Steigerwald, KDT Ngo
US Patent 4,864,479, 1989
A high-temperature sic three-phase ac-dc converter design for> 100/spl deg/c ambient temperature
R Wang, D Boroyevich, P Ning, Z Wang, F Wang, P Mattavelli, KDT Ngo, ...
IEEE Transactions on Power Electronics 28 (1), 555-572, 2012
Characterization of lead-free solder and sintered nano-silver die-attach layers using thermal impedance
X Cao, T Wang, KDT Ngo, GQ Lu
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (4 …, 2011
A novel active power decoupling single-phase PWM rectifier topology
W Qi, H Wang, X Tan, G Wang, KDT Ngo
2014 IEEE Applied Power Electronics Conference and Exposition-APEC 2014, 89-95, 2014
A novel high-temperature planar package for SiC multichip phase-leg power module
P Ning, TG Lei, F Wang, GQ Lu, KDT Ngo, K Rajashekara
IEEE Transactions on power Electronics 25 (8), 2059-2067, 2010
Survey of high-temperature polymeric encapsulants for power electronics packaging
Y Yao, GQ Lu, D Boroyevich, KDT Ngo
IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (2 …, 2015
SiC wirebond multichip phase-leg module packaging design and testing for harsh environment
P Ning, R Lai, D Huff, F Wang, KDT Ngo, VD Immanuel, KJ Karimi
IEEE Transactions on Power Electronics 25 (1), 16-23, 2009
Low noise, high frequency synchronous rectifier
KDT Ngo, RL Steigerwald, JP Walden, BJ Baliga, CS Korman, HR Chang
US Patent 4,903,189, 1990
Behavioral modeling of the IGBT using the Hammerstein configuration
JT Hsu, KDT Ngo
IEEE transactions on Power Electronics 11 (6), 746-754, 1996
Ac vs. dc distribution for off-shore power delivery
F Wang, Y Pei, D Boroyevich, R Burgos, K Ngo
2008 34th Annual Conference of IEEE Industrial Electronics, 2113-2118, 2008
A frequency-domain study on the effect of DC-link decoupling capacitors
Z Chen, D Boroyevich, P Mattavelli, K Ngo
2013 IEEE Energy Conversion Congress and Exposition, 1886-1893, 2013
Low frequency pulsed resonant converter for energy harvesting
S Xu, KDT Ngo, T Nishida, GB Chung, A Sharma
IEEE Transactions on power electronics 22 (1), 63-68, 2007
A class of ceramic-based chip inductors for hybrid integration in power supplies
MH Lim, JD van Wyk, FC Lee, KDT Ngo
IEEE Transactions on Power Electronics 23 (3), 1556-1564, 2008
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