| Wafer-level-packaged HARPSS+ MEMS platform: Integration of robust timing and inertial measurement units (TIMU) on a single chip H Wen, A Daruwalla, Y Jeong, P Gupta, J Choi, CS Liu, F Ayazi Position, Location and Navigation Symposium (PLANS), 2018 IEEE/ION, 261-266, 2018 | 23 | 2018 |
| A high-performance single-chip timing and inertial measurement unit with robust mode-matched gyroscopes H Wen, A Daruwalla, Y Jeong, P Gupta, J Choi, C Liu, F Ayazi 2018 IEEE 31st International Conference on Micro Electro Mechanical Systems …, 2018 | 20 | 2018 |
