W. Y. Zhang
W. Y. Zhang
Globalfoundries USA, National University of Singapore
Verified email at globalfoundries.com
Cited by
Cited by
Nanostructure of calcium silicate hydrate gels in cement paste
X Zhang, W Chang, T Zhang, CK Ong
Journal of the American Ceramic Society 83 (10), 2600-2604, 2000
Electron-beam assisted platinum deposition as a protective layer for FIB and TEM applications
WY Kwong, WY Zhang
ISSM 2005, IEEE International Symposium on Semiconductor Manufacturing, 2005 …, 2005
The Einstein-Kähler metric on Cartan-Hartogs domain of the third type
W An, Y Weiping, Z Wenjuan
Advanced in Mathematics (CHINA) 33 (2), 215-228, 2004
Photoluminescence and photoelectron spectroscopic analysis of InGaAsN grown by metalorganic chemical vapor deposition
W Chang, J Lin, W Zhou, SJ Chua, ZC Feng
Applied physics letters 79 (27), 4497-4499, 2001
Application of IR-OBIRCH to the failure analysis of CMOS integrated circuits
L Soon, DTM Ling, M Kuan, KW Yee, D Cheong, G Zhang
Proceedings of the 10th International Symposium on the Physical and Failure …, 2003
Infrared reflection investigation of ion‐implanted and post‐implantation‐annealed epitaxially grown 6H‐SiC
W Chang, ZC Feng, J Lin, R Liu, ATS Wee, K Tone, JH Zhao
Surface and Interface Analysis: An International Journal devoted to the …, 2002
Study of TDDB reliability in misaligned via chain structures
W Liu, YK Lim, JB Tan, WY Zhang, H Liu, SY Siah
2012 IEEE International Reliability Physics Symposium (IRPS), 3A. 4.1-3A. 4.6, 2012
Study of electric field—based lifetime projection method in IMD TDDB
W Zhang, X Zeng, W Liu, YK Lim, JF Liu, EC Chua
2010 IEEE International Reliability Physics Symposium, 938-942, 2010
Research of TOU power price model based on DSM
L Chang, Y Jiangang, YAO Wenfeng
Relay 33 (15), 57-61, 2005
Reliability Improvement in Al Metallization: A Combination of Statistical Prediction and Failure Analytical Methodology
G Zhang, CM Tana, KT Tanb, KY Simb, WY Zhangb
Microelectronics Reliability 44, 1843-1848, 2004
Effect of chemical mechanical polishing scratch on TDDB reliability and its reduction in 45nm BEOL process
W Liu, YK Lim, F Zhang, WY Zhang, CQ Chen, BC Zhang, JB Tan, ...
2009 IEEE International Reliability Physics Symposium, 613-618, 2009
Surface and interface properties of ion implanted 4H-silicon carbide
WY Chang, ZC Feng, J Lin, F Yan, JH Zhao
International Journal of Modern Physics B 16 (01n02), 151-158, 2002
New insight in BEOL TDDB Cu diffusion mechanism: a Constant Current Stress approach
T Shen, H Jiang, W Zhang, T Cahyadi, EC Chua, C Capasso
2014 IEEE International Reliability Physics Symposium, 3A. 5.1-3A. 5.5, 2014
Oxide particle induced leakage in flash memory endurance test
W Zhang, SH Tan
2006 IEEE International Reliability Physics Symposium Proceedings, 608-610, 2006
Infrared reflectance study of 3C-SiC grown on Si by chemical vapor deposition
ZC Feng, CW Huang, WY Chang, J Zhao, CC Tin, WJ Lu, WE Collins
Materials science forum 527, 695-698, 2006
SAR image enhancement fusion based on improved IHS method
W Zhang, XW Ding, HL Chen
J Marine Sci 25 (1), 73-79, 2007
Optical characterization of ion-implanted 4H-SiC
ZC Feng, F Yan, WY Chang, JH Zhao, J Lin
Materials Science Forum 389, 647-650, 2002
Highly Sensitive Tunable Diode Laser Absorption Spectroscopy of CO2 Around 1.57 μm
S Jie, G Xiao-Ming, Z Wei-Jun, Y Yi-Qian, Y Yong, P Shi-Xin
Chinese Physics Letters 22 (1), 57, 2005
Wu Zonghan, Xie Xishun, Chang Wenyi, Zhu Yafei, Xu Fudong
Acta Biophysica Sinica 3, 025, 1993
Optimizing Cu barrier thickness for interconnects performance, reliability and yield
T Shen, B Rajagopalan, MC Silvestre, E Ramanathan, ...
2016 IEEE International Reliability Physics Symposium (IRPS), IT-1-1-IT-1-4, 2016
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