Soft robotic manipulation and locomotion with a 3D printed electroactive hydrogel D Han, C Farino, C Yang, T Scott, D Browe, W Choi, JW Freeman, H Lee ACS applied materials & interfaces 10 (21), 17512-17518, 2018 | 288 | 2018 |
4D printing reconfigurable, deployable and mechanically tunable metamaterials C Yang, M Boorugu, A Dopp, J Ren, R Martin, D Han, W Choi, H Lee Materials Horizons 6 (6), 1244-1250, 2019 | 184 | 2019 |
4D printing of a bioinspired microneedle array with backward‐facing barbs for enhanced tissue adhesion D Han, RS Morde, S Mariani, AA La Mattina, E Vignali, C Yang, ... Advanced Functional Materials 30 (11), 1909197, 2020 | 173 | 2020 |
Rapid multi-material 3D printing with projection micro-stereolithography using dynamic fluidic control D Han, C Yang, NX Fang, H Lee Additive Manufacturing 27, 606-615, 2019 | 163 | 2019 |
Rapid processing and drug evaluation in glioblastoma patient-derived organoid models with 4D bioprinted arrays M Chadwick, C Yang, L Liu, CM Gamboa, K Jara, H Lee, HE Sabaawy Iscience 23 (8), 2020 | 43 | 2020 |
Highly conductive polymer composites from room-temperature ionic liquid cured epoxy resin: effect of interphase layer on percolation conductance X Zhang, H Sun, C Yang, K Zhang, MMF Yuen, S Yang RSC advances 3 (6), 1916-1921, 2013 | 29 | 2013 |
Rapid pulsed light sintering of silver nanowires on woven polyester for personal thermal management with enhanced performance, durability and cost-effectiveness HJ Hwang, H Devaraj, C Yang, Z Gao, C Chang, H Lee, R Malhotra Scientific reports 8 (1), 17159, 2018 | 28 | 2018 |
4D‐Printed Transformable Tube Array for High‐Throughput 3D Cell Culture and Histology C Yang, J Luo, M Polunas, N Bosnjak, STD Chueng, M Chadwick, ... Advanced Materials 32 (40), 2004285, 2020 | 26 | 2020 |
Improving surface roughness of additively manufactured parts using a photopolymerization model and multi-objective particle swarm optimization N Kim, I Bhalerao, D Han, C Yang, H Lee Applied Sciences 9 (1), 151, 2019 | 26 | 2019 |
Multimaterial Printing for Cephalopod-Inspired Light-Responsive Artificial Chromatophores D Han, Y Wang, C Yang, H Lee ACS Applied Materials & Interfaces, 2021 | 20 | 2021 |
Highly conductive die attach adhesive from percolation control and its applications in light-emitting device thermal management X Zhang, K Zhang, M Zhang, C Yang, H Sun, Z Gao, MMF Yuen, S Yang Applied Physics Letters 102 (1), 2013 | 10 | 2013 |
Spatial uncertainty modeling for surface roughness of additively manufactured microstructures via image segmentation N Kim, C Yang, H Lee, NR Aluru Applied Sciences 9 (6), 1093, 2019 | 7 | 2019 |
Thermal transport in 3D printed shape memory polymer metamaterials S Farzinazar, Y Wang, C Abdol-Hamid Owens, C Yang, H Lee, J Lee APL Materials 10 (8), 2022 | 4 | 2022 |
High-gravity spreading of liquid puddles on wetting flexible substrates C Yang, A Burrous, J Xie, H Shaikh, A Elike-Avion, L Rojas Rodriguez, ... Applied Physics Letters 108 (7), 2016 | 4 | 2016 |
Tunable thermal transport in 4D printed mechanical metamaterials CAH Owens, Y Wang, S Farzinazar, C Yang, H Lee, J Lee Materials & Design 231, 111992, 2023 | 1 | 2023 |
Expandable arrays and methods of use HE Sabaawy, H Lee, C Yang, D Han US Patent 11,565,264, 2023 | 1 | 2023 |
Lightweight Microlattice With Tunable Mechanical Properties Using 3D Printed Shape Memory Polymer C Yang, M Boorugu, A Dopp, H Lee International Manufacturing Science and Engineering Conference 51357 …, 2018 | 1 | 2018 |
Transparent functionalized zinc oxide/epoxy nanocomposite with high thermal performance for high-power light-emitting diodes M Zhang, K Zhang, X Zhang, C Yang, MMF Yuen 2012 14th International Conference on Electronic Materials and Packaging …, 2012 | 1 | 2012 |
Thermal improvement of die attach with iodine treatment and its application in solid state lighting K Zhang, X Zhang, M Zhang, C Yang, H Sun, M Yuen, B Zhong, AR Bok, ... 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and …, 2012 | 1 | 2012 |
Materials Horizons 2019 Outstanding Article C Yang, M Boorugu, A Dopp, J Ren, R Martin, D Han, W Choi, H Lee Materials Horizons 7 (11), 2783-2790, 2020 | | 2020 |