| A review: characteristics of noise absorption material S Amares, E Sujatmika, TW Hong, R Durairaj, H Hamid Journal of Physics: Conference Series 908 (1), 012005, 2017 | 92 | 2017 |
| Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys E Efzan Mhd Noor, A Singh Soldering & Surface Mount Technology 26 (3), 147-161, 2014 | 66 | 2014 |
| A review: influence of nano particles reinforced on solder alloy E Efzan Mhd Noor, A Singh, Y Tze Chuan Soldering & Surface Mount Technology 25 (4), 229-241, 2013 | 54 | 2013 |
| Characterizations of physical properties of Sn-Bi solder alloy S Amares, MN Ervina Efzan, TC Yap Advanced Materials Research 845, 261-265, 2014 | 14 | 2014 |
| Effect on Shear Strength and Hardness Properties of Tin Based Solder Alloy, Sn-50Bi, Sn-50Bi+2%TiO2 Nanoparticles A Singh, B Tchari Advanced Materials Research 1159, 54-59, 2020 | 8 | 2020 |
| Study on hardness and shear strength with microstructure properties of Sn52Bi/Cu+ 1% Al2O3 nanoparticles A Singh, R Durairaj IOP Conference Series: Materials Science and Engineering 834 (1), 012075, 2020 | 8 | 2020 |
| A Study of Temperature, Microstructure and Hardness Properties of Sn-3.8 Ag-0.7 Cu (SAC) Solder Alloy A Singh, EEM Noor MATEC Web of Conferences 27, 02003, 2015 | 8 | 2015 |
| Characterization of mechanical testing on lead free solder on electronic application EMN Ervina, A Singh 2012 35th IEEE/CPMT International Electronics Manufacturing Technology …, 2012 | 8 | 2012 |
| Experimental Study on the Melting Temperature, Microstructural and Improved Mechanical Properties of Sn58Bi/Cu Solder Alloy Reinforced with 1%, 2% and 3% Zirconia (ZrO2 … KSH Amares Singh, Rajkumar Durairaj Archives of Metallurgy and Materials 66 (2), 407-418, 2021 | 6 | 2021 |
| Reliability study of lead free Sn-3.8 Ag-0.7 Cu and copper (Cu) substrate based on the microstructure, physical and mechanical properties A Singh, R Durairaj, KC Lee, YY Sia Journal of Mechanical Engineering (JMechE), 169-180, 2018 | 6 | 2018 |
| Influence of Nano-3% Al2O3 on the Properties of Low Temperature Sn-58Bi (SB) Lead-free Solder Alloy S Amares, MNE Efzan, R Durairaj, A Niakan IOP Conference Series: Materials Science and Engineering 205 (1), 012002, 2017 | 6 | 2017 |
| Effect on the wettability, hardness and shear strength properties of 3%-nano Titanium Oxide (TiO2) added Sn-3.8 Ag-0.7 Cu (SAC)/Copper (Cu) solder joint A Singh, R Durairaj MATEC Web of Conferences 237, 02013, 2018 | 4 | 2018 |
| Environmental friendly low mass 20g-Sn58Bi/Cu solder alloy as an alternative to lead SnPb and its properties study S Amares, D Rajkumar IOP Conference Series: Earth and Environmental Science 505 (1), 012004, 2020 | 3 | 2020 |
| Impact of 3% Molybdenum (Mo) nanoparticles on the interfacial and shear properties of lead-free Sn58Bi/Cu solder joint A Singh, R Durairaj, KG Kumar, SH Kuan IOP Conference Series: Materials Science and Engineering 1225 (1), 012029, 2022 | 1 | 2022 |
| Green Composites Reinforced with Natural Fibers: A Review on Mechanical Properties AS Shamini Janasekaran, Zhou Lei, Tok Rui Jun, Lee Jia Yunn Advanced Maritime Technologies and Applications 166, 1-9, 2022 | 1* | 2022 |
| Analysis of Noise Level and Sound Transmission Loss of Noise Barrier Material for the Construction Site WH Tan, S Amares, W Faridah, WK Heng International Journal of Integrated Engineering 13 (4), 151-162, 2021 | 1 | 2021 |
| Finite Element Analysis of Sn-58Bi Shear Test MMK Leong, S Amares Journal of Physics: Conference Series 2523 (1), 012043, 2023 | | 2023 |
| Development of a low-cost non-destructive test system for measurement of elastic modulus WH Chio, S Amares Journal of Physics: Conference Series 2523 (1), 012009, 2023 | | 2023 |
| Current Trends in Artificial Intelligence on Healthcare S Janasekaran, AZ Yousef, A Singh, NH Jamadon Advances in Technology Transfer Through IoT and IT Solutions, 1-8, 2023 | | 2023 |
| Acoustical and simulation analysis on the resonator muffler. ASG Tan W. H., Cheng E. M., Lim E., Tan W. C ARPN Journal of Engineering and Applied Sciences 17 (20), 1828-1833, 2022 | | 2022 |
Rajkumar Durairaj, R.DurairajUniversiti Tunku Abdul Rahman在 utar.edu.my 的电子邮件经过验证
