| Ultrathin antenna-integrated glass-based millimeter-wave package with through-glass vias AO Watanabe, TH Lin, M Ali, Y Wang, V Smet, PM Raj, MM Tentzeris, ... IEEE Transactions on Microwave Theory and Techniques 68 (12), 5082-5092, 2020 | 59 | 2020 |
| On-body long-range wireless backscattering sensing system using inkjet-/3-D-printed flexible ambient RF energy harvesters capable of simultaneous DC and harmonics generation TH Lin, J Bito, JGD Hester, J Kimionis, RA Bahr, MM Tentzeris IEEE Transactions on Microwave Theory and Techniques 65 (12), 5389-5400, 2017 | 50 | 2017 |
| A real-time range-adaptive impedance matching utilizing a machine learning strategy based on neural networks for wireless power transfer systems S Jeong, TH Lin, MM Tentzeris IEEE Transactions on Microwave Theory and Techniques 67 (12), 5340-5347, 2019 | 49 | 2019 |
| Broadband and miniaturized antenna-in-package (AiP) design for 5G applications TH Lin, K Kanno, AO Watanabe, PM Raj, RR Tummala, M Swaminathan, ... IEEE Antennas and Wireless Propagation Letters 19 (11), 1963-1967, 2020 | 45 | 2020 |
| Bandwidth Enhancement of 44 Butler Matrix Using Broadband Forward-Wave Directional Coupler and Phase Difference Compensation TH Lin, SK Hsu, TL Wu IEEE transactions on microwave theory and techniques 61 (12), 4099-4109, 2013 | 45 | 2013 |
| Inkjet-/3D-/4D-printed perpetual electronics and modules: RF and mm-wave devices for 5G+, IoT, smart agriculture, and smart cities applications A Eid, X He, R Bahr, TH Lin, Y Cui, A Adeyeye, B Tehrani, MM Tentzeris IEEE Microwave Magazine 21 (12), 87-103, 2020 | 35 | 2020 |
| Leading-edge and ultra-thin 3D glass-polymer 5G modules with seamless antenna-to-transceiver signal transmissions A Watanabe, TH Lin, PM Raj, V Sundaram, MM Tentzeris, RR Tummala, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2026-2031, 2018 | 31 | 2018 |
| Zero-power sensors for smart objects: Novel zero-power additively manufactured wireless sensor modules for IoT applications J Kimionis, W Su, J Hester, J Bito, X He, TH Lin, MM Tentzeris IEEE Microwave Magazine 19 (6), 32-47, 2018 | 30 | 2018 |
| Achieving fully autonomous system-on-package designs: An embedded-on-package 5G energy harvester within 3D printed multilayer flexible packaging structures TH Lin, S Daskalakis, A Georgiadis, MM Tentzeris 2019 IEEE MTT-S International Microwave Symposium (IMS), 2019 | 28 | 2019 |
| Novel 3D-/inkjet-printed flexible on-package antennas, packaging structures, and modules for broadband 5G applications TH Lin, R Bahr, MM Tentzeris, PM Raj, V Sundaram, R Tummala 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 214-220, 2018 | 26 | 2018 |
| Package-integrated, wideband power dividing networks and antenna arrays for 28-GHz 5G new radio bands M Ali, AO Watanabe, TH Lin, D Okamoto, MR Pulugurtha, MM Tentzeris, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 25 | 2020 |
| Nanostructured miniaturized artificial magnetic conductors (AMC) for high-performance antennas in 5G, IoT, and smart skin applications TH Lin, PM Raj, A Watanabe, V Sundaram, R Tummala, MM Tentzeris 2017 IEEE 17th International Conference on Nanotechnology (IEEE-NANO), 911-915, 2017 | 24 | 2017 |
| A flexible compact rectenna for 2.40 Hz ISM energy harvesting applications A Eid, J Hester, A Nauroze, TH Lin, J Costantine, Y Tawk, AH Ramadan, ... 2018 IEEE International Symposium on Antennas and Propagation & USNC/URSI …, 2018 | 23 | 2018 |
| A wideband, quasi-isotropic, kilometer-range FM energy harvester for perpetual IoT EM Jung, Y Cui, TH Lin, X He, A Eid, JGD Hester, GD Abowd, TE Starner, ... IEEE Microwave and Wireless Components Letters 30 (2), 201-204, 2019 | 19 | 2019 |
| A broadband forward-wave directional coupler using periodic Y-shaped ground via structures with arbitrary coupling levels JC Yen, SK Hsu, TH Lin, TL Wu IEEE transactions on microwave theory and techniques 61 (1), 38-47, 2012 | 19 | 2012 |
| Ambient energy harvesting from two-way talk radio for on-body autonomous wireless sensing network using inkjet and 3D printing TH Lin, J Bito, JG Hester, J Kimionis, RA Bahr, MM Tentzeris 2017 IEEE MTT-S International Microwave Symposium (IMS), 1034-1037, 2017 | 13 | 2017 |
| Range-adaptive Impedance Matching of Wireless Power Transfer System Using a Machine Learning Strategy Based on Neural Networks S Jeong, TH Lin, MM Tentzeris 2019 IEEE MTT-S International Microwave Symposium (IMS), 2019 | 11 | 2019 |
| 3D glass package-integrated, high-performance power dividing networks for 5G broadband antennas M Ali, A Watanabe, TH Lin, MR Pulugurtha, MM Tentzeris, RR Tummala 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 960-967, 2019 | 10 | 2019 |
| 3D glass-based panel-level package with antenna and low-loss interconnects for millimeter-wave 5G applications AO Watanabe, TH Lin, M Ali, T Ogawa, PM Raj, MM Tentzeris, ... 2019 IEEE MTT-S International Microwave Conference on Hardware and Systems …, 2019 | 9 | 2019 |
| Size-reduction of 3 dB microstrip forward-wave coupler using defected ground structure SK Hsu, TH Lin, TL Wu Asia-Pacific Microwave Conference 2011, 1774-1777, 2011 | 9 | 2011 |
Manos TentzerisGeorgia TechVerified email at ece.gatech.edu
