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li shiah lim
li shiah lim
Institute of Microelectronics
Verified email at ime.a-star.edu.sg
Title
Cited by
Cited by
Year
An inductively powered implantable blood flow sensor microsystem for vascular grafts
JH Cheong, SSY Ng, X Liu, RF Xue, HJ Lim, PB Khannur, KL Chan, ...
IEEE Transactions on Biomedical Engineering 59 (9), 2466-2475, 2012
772012
Characterization of silicon nanowire embedded in a MEMS diaphragm structure within large compressive strain range
L Lou, WT Park, S Zhang, LS Lim, DL Kwong, C Lee
IEEE electron device letters 32 (12), 1764-1766, 2011
192011
Sensorized guidewires with MEMS tri-axial force sensor for minimally invasive surgical applications
L Lou, K Ramakrishna, L Shao, WT Park, D Yu, L Lim, Y Wee, V Kripesh, ...
2010 Annual International Conference of the IEEE Engineering in Medicine and …, 2010
192010
Three chips stacking with low volume solder using single re-flow process
N Khan, DHS Wee, OS Chiew, C Sharmani, LS Lim, HY Li, S Vasarala
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
162010
Ultra-low-power wireless implantable blood flow sensing microsystem for vascular graft applications
RF Xue, JH Cheong, HK Cha, X Liu, P Li, HJ Lim, LS Lim, MY Cheng, ...
2011 International Symposium on Integrated Circuits, 224-229, 2011
132011
Design, process integration and characterization of wafer level vacuum packaging for MEMS resonator
A Yu, CS Premachandran, R Nagarajan, CW Kyoung, LQ Trang, R Kumar, ...
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
132010
A wirelessly powered and interrogated blood flow monitoring microsystem fully integrated with a prosthetic vascular graft for early failure detection
JH Cheong, CK Ho, SSY Ng, RF Xue, HK Cha, PB Khannur, X Liu, ...
2012 IEEE Asian Solid State Circuits Conference (A-SSCC), 177-180, 2012
92012
Characteristics of NEMS piezoresistive silicon nanowires pressure sensors with various diaphragm layers
L Lou, S Zhang, L Lim, WT Park, H Feng, DL Kwong, C Lee
Procedia Engineering 25, 1433-1436, 2011
92011
MEMS Tri-axial Tactile Sensor packaging using polymer fleible cable for sensorised guide wire application
M Hamidullah, MY Cheng, LS Lim, C He, H Feng, WT Park
2011 IEEE 13th Electronics Packaging Technology Conference, 207-210, 2011
82011
Electrical interconnect design optimization for fully embedded board-level optical interconnects
JYY Chai, GJ Yap, TG Lim, CW Tan, YM Khoo, CWL Teo, LS Lim, HL Yee, ...
2008 10th Electronics Packaging Technology Conference, 1126-1130, 2008
82008
Guide wire arrangement
WT Park, M Hamidullah, MY Cheng, HE Cairan, LS Lim
US Patent App. 13/864,220, 2013
72013
Design, fabrication and characterization of ultra miniature piezoresistive pressure sensors for medical implants
LS Lim, WT Park, L Lou, HH Feng, P Singh
Advanced Materials Research 254, 94-98, 2011
62011
Wireless sensor microsystems for emerging biomedical applications
M Je, JH Cheong, CK Ho, SSY Ng, RF Xue, HK Cha, X Liu, WT Park, ...
2015 IEEE International Symposium on Radio-Frequency Integration Technology …, 2015
42015
Development of thin film dielectric embedded 3D stacked package
SW Ho, N Su, LS Lim, SC Ong, WS Lee, VS Rao
2009 11th Electronics Packaging Technology Conference, 185-190, 2009
42009
Guide wire arrangement, strip arrangement and methods of forming the same
D Yu, WT Park, LS Lim, M Hamidullah, RK Kotlanka, V Kripesh, H Feng
US Patent App. 13/883,274, 2013
32013
Implantable blood flow sensor integrated on flexible circuit for vascular graft application
LS Lim, JH Cheong, JLA Jerry, C He
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 695-699, 2012
32012
Batteryless MEMS flow sensor within prosthetic vascular graft
C He, LS Lim, M Hamidullah, P Singh, WT Park, HH Feng
2011 Defense Science Research Conference and Expo (DSR), 1-4, 2011
32011
Direct eutectic AuSn solder bumping on Al bond pad surface using laser solder ball jetting
MZ Ding, JL Aw, LS Lim, LC Wai, VS Rao
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 224-229, 2013
22013
Low temperature bonding studies of Au-studs and AuSn-solder bumps on Au-surface using ultrasonic energy
JL Aw, JB Lee, N Jaafar, MZ Ding, LS Lim, CS Choong, VS Rao
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 384-388, 2013
12013
Characterization of a multi-layered MEMS pressure sensor using piezoresistive silicon nanowire within large measurable strain range
L Lou, S Zhang, WT Park, L Lim, DL Kwong, C Lee
2012 7th IEEE International Conference on Nano/Micro Engineered and …, 2012
12012
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