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Co-authors
- Shu Ping LauThe Hong Kong Polytechnic University and Nanyang Technological UniversityVerified email at polyu.edu.hk
- Yanyong LiThe depatement of Applied Physics, Hong Kong Polytechnic UniversityVerified email at polyu.edu.hk
- Yang ChaiUniversity of Southern CaliforniaVerified email at usc.edu
- Wei LuUniversity Research Facility in Materials Characterization and Device Fabrication, PolyU, HKVerified email at polyu.edu.hk
- Chun Hin MakThe Hong Kong Polytechnic UniversityVerified email at connect.polyu.hk
- Longhui (Stephen) ZENGUniversity of California, San DiegoVerified email at ucsd.edu
- Zai-Quan XuUniversity of Technology SydneyVerified email at uts.edu.au
- Chao Xie(谢超)Anhui UniversityVerified email at ahu.edu.cn
- Prof. Feng YanChair Professor of Organic Electronics, Department of Applied Physics, The Hong Kong PolytechnicVerified email at polyu.edu.hk
- Huiyu YuanZhengzhou UniversityVerified email at zzu.edu.cn
- Di Wu (吴翟)Professor, School of Physics and Microelectronics, Zhengzhou UniversityVerified email at zzu.edu.cn
- Han ZhangProfessor and Director, Email: hzhang@szu.edu.cnVerified email at szu.edu.cn
- Gongxun Bai (白功勋)China Jiliang UniversityVerified email at cjlu.edu.cn
- Yupeng ZhangShenzhen UniversityVerified email at szu.edu.cn
- Professor Charles SuryaDean of School of Engineering, Nazarbayev University, Astana, KazakhstanVerified email at nu.edu.kz
- Baoquan SunSoochow University, Institute of Functional Nano & Soft Materials (FUNSOM)Verified email at suda.edu.cn
- Jiasheng QianUniversity of AlbertaVerified email at ualberta.ca
- Wei JiDepartment of Physics, Renmin University of ChinaVerified email at ruc.edu.cn
- Yao GuoBeijing Institute of TechnologyVerified email at pku.edu.cn
- Qiang ZhangTsinghua UniversityVerified email at mails.tsinghua.edu.cn