Get my own profile
Public access
View all24 articles
20 articles
available
not available
Based on funding mandates
Co-authors
Shu Ping LauThe Hong Kong Polytechnic University and Nanyang Technological UniversityVerified email at polyu.edu.hk
Yanyong LiThe depatement of Applied Physics, Hong Kong Polytechnic UniversityVerified email at polyu.edu.hk
Haoran MuSongshan Lake Materials LaboratoryVerified email at sslab.org.cn
Yang ChaiUniversity of Southern CaliforniaVerified email at usc.edu
Wei LuUniversity Research Facility in Materials Characterization and Device Fabrication, PolyU, HKVerified email at polyu.edu.hk
Chun Hin MakThe Hong Kong Polytechnic UniversityVerified email at connect.polyu.hk
Shaojuan LiSoochow UniversityVerified email at suda.edu.cn
Zai-Quan XuUniversity of Technology SydneyVerified email at uts.edu.au
Prof. Feng YanDepartment of Applied Physics, The Hong Kong Polytechnic UniversityVerified email at polyu.edu.hk
Chao Xie(谢超)Anhui UniversityVerified email at ahu.edu.cn
Huiyu Yuan(原会雨)Zhengzhou UniversityVerified email at zzu.edu.cn
Di Wu (吴翟)Professor, School of Physics and Microelectronics, Zhengzhou UniversityVerified email at zzu.edu.cn
Han ZhangProfessor and Director, Email: hzhang@szu.edu.cnVerified email at szu.edu.cn
Yupeng ZhangShenzhen UniversityVerified email at szu.edu.cn
Qasim KhanUniversity of WaterlooVerified email at seu.edu.cn
Professor Charles SuryaDean of School of Engineering, Nazarbayev University, Astana, KazakhstanVerified email at nu.edu.kz
Baoquan SunSoochow University, Institute of Functional Nano & Soft Materials (FUNSOM)Verified email at suda.edu.cn
Wei JiDepartment of Physics, Renmin University of ChinaVerified email at ruc.edu.cn
Zhibin YANGHong Kong Polytechnic UniversityVerified email at connect.polyu.hk
Jiasheng QianUniversity of AlbertaVerified email at ualberta.ca