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Johan Liu
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Year
Novel nanostructured thermal interface materials: a review
J Hansson, TMJ Nilsson, L Ye, J Liu
International Materials Reviews 63 (1), 22-45, 2018
2592018
Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives
L Ye, Z Lai, J Liu, A Tholen
IEEE Transactions on Electronics Packaging Manufacturing 22 (4), 299-302, 1999
2331999
Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates
Z Lai, J Liu
IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1996
2041996
Overview of conductive adhesive interconnection technologies for LCDs
H Kristiansen, J Liu
IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1998
2001998
Characterization of liquid crystal polymer for high frequency system-in-a-package applications
G Zou, H Gronqvist, JP Starski, J Liu
IEEE Transactions on Advanced Packaging 25 (4), 503-508, 2002
1622002
Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
C Andersson, Z Lai, J Liu, H Jiang, Y Yu
Materials Science and Engineering: A 394 (1-2), 20-27, 2005
1542005
Graphene related materials for thermal management
Y Fu, J Hansson, Y Liu, S Chen, A Zehri, MK Samani, N Wang, Y Ni, ...
2D Materials 7 (1), 012001, 2020
1512020
Functionalization mediates heat transport in graphene nanoflakes
H Han, Y Zhang, N Wang, MK Samani, Y Ni, ZY Mijbil, M Edwards, ...
Nature Communications 7 (1), 11281, 2016
1482016
Electrospun polyurethane scaffolds for proliferation and neuronal differentiation of human embryonic stem cells
B Carlberg, MZ Axell, U Nannmark, J Liu, HG Kuhn
Biomedical Materials 4 (4), 045004, 2009
1452009
Bioactive 3D cell culture system minimizes cellular stress and maintains the in vivo‐like morphological complexity of astroglial cells
TB Puschmann, C Zandén, Y De Pablo, F Kirchhoff, M Pekna, J Liu, ...
Glia 61 (3), 432-440, 2013
1442013
Tailoring the thermal and mechanical properties of graphene film by structural engineering
N Wang, MK Samani, H Li, L Dong, Z Zhang, P Su, S Chen, J Chen, ...
Small 14 (29), 1801346, 2018
1312018
Improved heat spreading performance of functionalized graphene in microelectronic device application
Y Zhang, H Han, N Wang, P Zhang, Y Fu, M Murugesan, M Edwards, ...
Advanced Functional Materials 25 (28), 4430-4435, 2015
1252015
Mechanically stretchable and electrically insulating thermal elastomer composite by liquid alloy droplet embedment
SH Jeong, S Chen, J Huo, EK Gamstedt, J Liu, SL Zhang, ZB Zhang, ...
Scientific reports 5 (1), 18257, 2015
1222015
A reliable and environmentally friendly packaging technology-flip-chip joining using anisotropically conductive adhesive
J Liu, A Tolvgard, J Malmodin, Z Lai
IEEE Transactions on Components and Packaging Technologies 22 (2), 186-190, 1999
1221999
Synthesis of graphene quantum dots and their applications in drug delivery
C Zhao, X Song, Y Liu, Y Fu, L Ye, N Wang, F Wang, L Li, ...
Journal of Nanobiotechnology 18, 1-32, 2020
1212020
Thermal chemical vapor deposition grown graphene heat spreader for thermal management of hot spots
Z Gao, Y Zhang, Y Fu, MMF Yuen, J Liu
Carbon 61, 342-348, 2013
1112013
Low partial pressure chemical vapor deposition of graphene on copper
J Sun, N Lindvall, MT Cole, KTT Angel, T Wang, KBK Teo, DHC Chua, ...
IEEE transactions on nanotechnology 11 (2), 255-260, 2011
952011
Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy
Y Gao, C Zou, B Yang, Q Zhai, J Liu, E Zhuravlev, C Schick
Journal of Alloys and Compounds 484 (1-2), 777-781, 2009
952009
Controllable chemical vapor deposition of large area uniform nanocrystalline graphene directly on silicon dioxide
J Sun, N Lindvall, MT Cole, T Wang, TJ Booth, P Břggild, KBK Teo, J Liu, ...
Journal of Applied Physics 111 (4), 044103, 2012
922012
A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity
Y Fu, N Nabiollahi, T Wang, S Wang, Z Hu, B Carlberg, Y Zhang, X Wang, ...
Nanotechnology 23 (4), 045304, 2012
872012
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