| Numerical investigation on the effect of pressure and temperature on the melt filling during injection molding process MS Rusdi, MZ Abdullah, AS Mahmud, CY Khor, MS Abdul Aziz, ZM Ariff, ... Arabian Journal for Science and Engineering 41, 1907-1919, 2016 | 21 | 2016 |
| Stencil printing process performance on various aperture size and optimization for lead-free solder paste MS Rusdi, MZ Abdullah, S Chellvarajoo, MS Abdul Aziz, MK Abdullah, ... The International Journal of Advanced Manufacturing Technology 102, 3369-3379, 2019 | 19 | 2019 |
| Three-dimensional CFD simulation of the stencil printing performance of solder paste MS Rusdi, MZ Abdullah, MHH Ishak, MSA Aziz, MK Abdullah, ... The International Journal of Advanced Manufacturing Technology 108, 3351-3359, 2020 | 10 | 2020 |
| Multiphase flow in solder paste stencil printing process using CFD approach MS Rusdi, MZ Abdullah, MSA Aziz, MK Abdullah, S Chellvarajoo, A Husin, ... Journal of Advanced Research in Fluid Mechanics and Thermal Sciences 46 (1 …, 2018 | 10 | 2018 |
| SAC105 Stencil printing process using cross viscosity model MS Rusdi, MZ Abdullah, MSA Aziz, MK Abdullah, MHH Ishak, YK Hwa, ... Journal of Advanced Research in Fluid Mechanics and Thermal Sciences 54 (1 …, 2019 | 8 | 2019 |
| Heat Transfer Performance of a SyntheticJet Generated byDiffuser-Shaped Orifice A Husin, MZ Abdullah, A Ismail, AA Janvekar, MS Rusdi, WMAWM Ali Journal of Advanced Research in Fluid Mechanics and Thermal Sciences 53 (1 …, 2019 | 5 | 2019 |
| Numerical Investigation on the Effect of Squeegee Angle during Stencil Printing Process MS Rusdi, MZ Abdullah, MSA Aziz, MK Abdullah, AA Bakar, ... Journal of Physics: Conference Series 1082 (1), 012057, 2018 | 4 | 2018 |
| Abdullah@ Harun, Srivalli Chellvarajoo, Azmi Husin, Parimalam Rethinasamy, and Sivakumar Veerasamy." Multiphase flow in solder paste stencil printing process using CFD approach." MS Rusdi Journal of Advanced Research in Fluid Mechanics and Thermal Sciences 46, 147-152, 0 | 3 | |
| Computational Analysis of Polymer Melt Filling in a Medical Mold Cavity During the Injection Molding Process. MK Abdullah, MS Rusdi, MZ Abdullah, AS Mahmud, ZM Ariff, KC Yee, ... Pertanika Journal of Science & Technology 31 (1), 2023 | 2 | 2023 |
| Numerical investigation on the effect of injection pressure on melt front pressure and velocity drop MS Rusdi, MZ Abdullah, AS Mahmud, CY Khor, MS Abdul Aziz, ... Applied Mechanics and Materials 786, 210-214, 2015 | 2 | 2015 |
| The Comparison of Medical Grade PP with Common Grade PP in Injection Moulding Process MZM Zaki, MS Rusdi, CLT Xiao, NSZ Abidin, MAFM Shafee, A Vimalraj, ... CFD Letters 14 (4), 1-13, 2022 | 1 | 2022 |
| Effects of different viscometer test on stencil printing process for CFD simulation MHH Ishak, MS Rusdi, MZ Abdullah, MSA Aziz, MK Abdullah, ... | 1 | 2021 |
| Optimization of Wire-bonding Process Parameters for Gold Wire and Aluminium Substrate using Response Surface Method MSAM Rosli, MS Rusdi, MH Hassan, SAHA Seman, N Jamaludin, ... International Journal of Nanoelectronics and Materials (IJNeaM) 16 (December …, 2023 | | 2023 |
| Failure Behavior and Mechanism of Pultruded Kenaf/Glass Hybrid Composite Under Compressive Impact Loading. MF Razali, SAH Abu Seman, MS Rusdi, MN Megat Anorhisham Pertanika Journal of Science & Technology 31 (1), 2023 | | 2023 |
| An experimental investigation of shear strength and adhesion on the chip-substrate joint in LED packaging MA Alim, MSA Aziz, MZ Abdullah, R Kamarudin, JR Lee, MS Rusdi, ... International Journal of Adhesion and Adhesives 119, 103272, 2022 | | 2022 |
| NUMERICAL STUDY ON THE EFFECT OF DIFFERENT VISCOMETER TEST ON STENCIL PRINTING PROCESS MHH Ishak, MS Rusdi, MZ Abdullah, MSA Aziz, MK Abdullah, ... Jurnal Teknologi 84 (6-2), 135-143, 2022 | | 2022 |
| The Effect of the Epoxy Curing Method on the Encapsulation of Led K Muniary, MS Rusdi, MS Abdul Aziz, R Kamaruddin, MHH Ishak, ... Green Materials and Electronic Packaging Interconnect Technology Symposium …, 2022 | | 2022 |
| Effect of Different Epoxy Materials During LED Wire Bonding Encapsulation Process Using CFD Approach MSB Zubir, MSB Rusdi, MS Abdul Aziz, R Kamaruddin, MHH Ishak, ... Green Materials and Electronic Packaging Interconnect Technology Symposium …, 2022 | | 2022 |
| Influence of Epoxy Viscosity on Led Encapsulation Process AAA Jaludin, MS Abdul Aziz, GW Shing, MHH Ishak, MS Rusdi, MI Ahmad Green Materials and Electronic Packaging Interconnect Technology Symposium …, 2022 | | 2022 |
| Investigation of Thermal Reflow Profile for Copper Pillar Technology JR Lee, MS Abdul Aziz, MFR Rosli, MS Rusdi, R Kamaruddin, MHH Ishak, ... Green Materials and Electronic Packaging Interconnect Technology Symposium …, 2022 | | 2022 |
Mohd Zulkfly AbdullahUniversiti Sains Malaysia在 eng.usm.my 的电子邮件经过验证
