| Room-temperature bonding of vertical-cavity surface-emitting laser chips on Si substrates using Au microbumps in ambient air R Takigawa, E Higurashi, T Suga, R Sawada Applied Physics Express 1 (11), 112201, 2008 | 88 | 2008 |
| Lithium niobate ridged waveguides with smooth vertical sidewalls fabricated by an ultra-precision cutting method R Takigawa, E Higurashi, T Kawanishi, T Asano Optics express 22 (22), 27733-27738, 2014 | 53 | 2014 |
| Passive Alignment and Mounting of LiNbO Waveguide Chips on Si Substrates by Low-Temperature Solid-State Bonding of Au R Takigawa, E Higurashi, T Suga, T Kawanishi IEEE Journal of Selected Topics in Quantum Electronics 17 (3), 652-658, 2011 | 45 | 2011 |
| Air-gap structure between integrated LiNbO3 optical modulators and micromachined Si substrates R Takigawa, E Higurashi, T Suga, T Kawanishi Optics Express 19 (17), 15739-15749, 2011 | 40 | 2011 |
| Thin-film lithium niobate-on-insulator waveguides fabricated on silicon wafer by room-temperature bonding method with silicon nanoadhesive layer R Takigawa, T Asano Optics Express 26 (19), 24413-24421, 2018 | 34 | 2018 |
| Room-temperature wafer bonding of LiNbO3 and SiO2 using a modified surface activated bonding method R Takigawa, E Higurashi, T Asano Japanese journal of applied physics 57 (6S1), 06HJ12, 2018 | 28 | 2018 |
| Room-temperature transfer bonding of lithium niobate thin film on micromachined silicon substrate with Au microbumps R Takigawa, E Higurashi, T Suga, T Kawanishi Sensors and Actuators A: Physical 264, 274-281, 2017 | 22 | 2017 |
| Room-temperature hermetic sealing by ultrasonic bonding with Au compliant rim R Takigawa, K Iwanabe, T Shuto, T Takao, T Asano Japanese Journal of Applied Physics 53 (6S), 06JM05, 2014 | 21 | 2014 |
| Surface activated bonding of aluminum oxide films at room temperature J Utsumi, R Takigawa Scripta Materialia 191, 215-218, 2021 | 20 | 2021 |
| Direct bonding of LiNbO3 and SiC wafers at room temperature R Takigawa, J Utsumi Scripta Materialia 174, 58-61, 2020 | 20 | 2020 |
| Investigation of the interface between LiNbO3 and Si wafers bonded by laser irradiation R Takigawa, H Kawano, H Ikenoue, T Asano Japanese journal of applied physics 56 (8), 088002, 2017 | 20 | 2017 |
| Residual stress in lithium niobate film layer of LNOI/Si hybrid wafer fabricated using low-temperature bonding method R Takigawa, T Tomimatsu, E Higurashi, T Asano Micromachines 10 (2), 136, 2019 | 19 | 2019 |
| Room temperature wafer bonding of metal films using flattening by thermal imprint process Y Kurashima, A Maeda, R Takigawa, H Takagi Microelectronic engineering 112, 52-56, 2013 | 19 | 2013 |
| Low-Temperature Au-to-Au Bonding for LiNbO3/Si Structure Achieved in Ambient Air R Takigawa, E Higurashi, T Suga, S Shinada, T Kawanishi IEICE transactions on electronics 90 (1), 145-146, 2007 | 18 | 2007 |
| Fabrication of a bonded LNOI waveguide structure on Si substrate using ultra-precision cutting R Takigawa, K Kamimura, K Asami, K Nakamoto, T Tomimatsu, T Asano Japanese journal of applied physics 59 (SB), SBBD03, 2020 | 14 | 2020 |
| Bonding of lithium niobate to silicon in ambient air using laser irradiation H Kawano, R Takigawa, H Ikenoue, T Asano Japanese journal of applied physics 55 (8S3), 08RB09, 2016 | 11 | 2016 |
| Heterogeneously integrated laser-induced fluorescence detection devices: Integration of an excitation source T Kamei, K Sumitomo, S Ito, R Takigawa, N Tsujimura, H Kato, ... Japanese Journal of Applied Physics 53 (6S), 06JL02, 2014 | 11 | 2014 |
| Ultrathin adhesive layer between LiNbO3 and SiO2 for bonded LNOI waveguide applications R Takigawa, E Higurashi, T Asano Japanese journal of applied physics 58 (SJ), SJJE06, 2019 | 9 | 2019 |
| Demonstration of GaN/LiNbO3 hybrid wafer using room-temperature surface activated bonding R Takigawa, T Matsumae, M Yamamoto, E Higurashi, T Asano, H Kanaya ECS Journal of Solid State Science and Technology 9 (4), 045005, 2020 | 8 | 2020 |
| Demonstration of ultraprecision ductile-mode cutting for lithium niobate microring waveguides R Takigawa, E Higurashi, T Kawanishi, T Asano Japanese journal of applied physics 55 (11), 110304, 2016 | 6 | 2016 |
