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- Vijay ShirhattiIndian Institute of Science在 iisc.ac.in 的电子邮件经过验证
- Dr. Vaishakh KedambaimooleUniversity of Cambridge在 cam.ac.uk 的电子邮件经过验证
- Rajanna KonandurProfessor of Instrumentation and Applied physics, Indian Institute of Science在 iap.iisc.ernet.in 的电子邮件经过验证
- Anindya NagTechnische Universität Dresden在 tu-dresden.de 的电子邮件经过验证
- M. Ercan AltinsoyDresden University of Technology, Chair of Acoustics and Haptics在 tu-dresden.de 的电子邮件经过验证
- Saurabh KumarAssistant Professor, Department of Medical Devices, NIPER-Guwahati, Assam (India)在 niperguwahati.in 的电子邮件经过验证
- Dr. Nagarjuna NeellaVellore Institute of Technology, VIT AP University, Amaravati, India在 vitap.ac.in 的电子邮件经过验证
- ANIKET CHAKRABORTHYResearch Student在 tu-dresden.de 的电子邮件经过验证
- Subhas C. MukhopadhyayMacquarie University在 mq.edu.au 的电子邮件经过验证
- Hidekuni TakaoKagawa University, Professor, Director of Nano-Micro Structure Device Integrated Research Center在 kagawa-u.ac.jp 的电子邮件经过验证
- Prosenjit SenIndian Institute of Science, Bangalore在 cense.iisc.ernet.in 的电子邮件经过验证
- Nasrin AfsariManeshLecturer在 curtin.edu.au 的电子邮件经过验证
- Dinesh R. GawadePhD Scholar at Tyndall National Institute and Microelectronic Circuits Centre Ireland, Cork, Ireland在 tyndall.ie 的电子邮件经过验证
- John L. BuckleyTyndall National Institute在 tyndall.ie 的电子邮件经过验证
- Roy B. V. B. SimorangkirAssistant Professor, Durham University在 ieee.org 的电子邮件经过验证
- Brendan O'FlynnTyndall National Institute, University College Cork在 tyndall.ie 的电子邮件经过验证
- Venkateswarlu Gaddam, Ph.DPostdoctoral Research Associate @ UTD在 utdallas.edu 的电子邮件经过验证
- Deji AkinwandeThe University of Texas at Austin, IEEE, MRS, APS, AAS Fellow在 ece.utexas.edu 的电子邮件经过验证
- Md Eshrat E AlahiSchool of Engineering and Technology, Walailak University, Thailand在 mail.wu.ac.th 的电子邮件经过验证