Follow
Harindra Kumar Kannojia
Harindra Kumar Kannojia
Verified email at imec.be
Title
Cited by
Cited by
Year
Fabrication of multiple through-holes in non-conductive materials by Electrochemical Discharge Machining for RF MEMS Packaging
J Arab, DK Mishra, HK Kannojia, P Adhale, P Dixit
Journal of Materials Processing Technology 271, 542-553, 2019
722019
Effect of tool electrode roughness on the geometric characteristics of through-holes formed by ECDM
J Arab, HK Kannojia, P Dixit
Precision Engineering 60, 437-447, 2019
622019
Fabrication and characterization of through-glass vias by the ECDM process
HK Kannojia, J Arab, BJ Pegu, P Dixit
Journal of The Electrochemical Society 166 (13), D531, 2019
532019
A review of intermetallic compound growth and void formation in electrodeposited Cu–Sn Layers for microsystems packaging
HK Kannojia, P Dixit
Journal of Materials Science: Materials in Electronics 32 (6), 6742-6777, 2021
432021
Void formation and intermetallic growth in pulse electrodeposited Cu-Sn layers for MEMS packaging
HK Kannojia, SK Sharma, P Dixit
Journal of Electronic Materials 47, 7386-7400, 2018
132018
Fabrication and Characterization of Through-glass vias (TGV) based 3D Spiral and Toroidal Inductors by Cost-effective ECDM Process
HK Kannojia, J Arab, A Sidhique, DK Mishra, R Kumar, J Pednekar, ...
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1192-1198, 2020
102020
Design and fabrication of through-glass via (TGV) based 3D spiral inductors in fused silica substrate
HK Kannojia, A Sidhique, AS Shukla, J Pednekar, S Gupta, P Dixit
Microsystem Technologies, 1-10, 2022
82022
Challenges in fabrication of high aspect ratio electrostatic comb-drive microactuator using one-step X-ray lithography
R Shukla, HK Kannojia, C Mukherjee, PR Sankar, BS Thakur, AK Sinha, ...
ISSS Journal of Micro and Smart Systems 9, 173-180, 2020
82020
Effect of Surface Roughness on Void Formation and Intermetallic Growth in Electrodeposited Cu-Sn stacks
HK Kannojia, P Dixit
Materials Letters 257, 126710, 2019
82019
Experimental investigations in the intermetallic and microvoid formation in sub-200 °C Cu–Sn bonding
HK Kannojia, P Dixit
Journal of Materials Science: Materials in Electronics 30 (17), 16427-16438, 2019
62019
Formation of Through-Wafer 3-D Interconnects in Fused Silica Substrates by Electrochemical Discharge Machining
HK Kannojia, J Arab, R Kumar, J Pednekar, P Dixit
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 253-257, 2019
42019
Void Formation in Low-Temperature Electroplated Cu-Sn Stack for Hermetic Packaging
HK Kannojia, P Dixit
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 124-128, 2019
22019
Laser-Induced Forward Transfer for Assembly of Silicon Micro-Chiplets
HK Kannojia, G Van Steenberge
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 170-174, 2022
12022
Microlens integration on photonic integrated circuits: a platform for achieving relaxed packaging tolerances and hybrid integration of external functionality
J Missinne, R Verplancke, YT Chang, J Van Asch, H Kannojia, V Geudens, ...
Silicon Photonics XIX 12891, 83-91, 2024
2024
Mid-infrared dual-comb QCLs integrated with beam combiner based on Ge-on-Si platform
D Wang, HK Kannojia, P Jouy, E Giraud, G Van Steenberge, B Kuyken
2023 IEEE Silicon Photonics Conference (SiPhotonics), 1-2, 2023
2023
Assembly of thin micro-chiplets using laser-induced forward transfer
HK Kannojia, G Van Steenberge
25th IEEE Electronic Packaging and Technology Conference (EPTC), 917-921, 2023
2023
Towards a Full-Color MicroLED Display with a Patterned Quantum Dot Color Conversion Layer
D Cuypers, H Kannojia, G Van Steenberge
IDW 23 30, 813-816, 2023
2023
Through-substrate vias based three-dimensional interconnection technology
P Dixit, HK Kannojia, K Henttinen
Handbook of Silicon Based MEMS Materials and Technologies, 721-741, 2020
2020
Experimental Investigation into the Void Growth at Cu-Cu3Sn Interface
HK Kannojia, P Dixit
International Conference on Precision, Meso, Micro and Nano Engineering …, 2019
2019
CHALLENGES IN FABRICATION OF HIGH ASPECT RATIO ELECTROSTATIC COMB-DRIVE USING ONE-STEP X-RAY LITHOGRAPHY
R Shukla, HK Kannojia, C Mukherjee, PR Sanker, BS Thakur, D Pandey
ISSS International Conference on MEMS, Smart Materials, Structures and …, 2017
2017
The system can't perform the operation now. Try again later.
Articles 1–20