| Fabrication of multiple through-holes in non-conductive materials by Electrochemical Discharge Machining for RF MEMS Packaging J Arab, DK Mishra, HK Kannojia, P Adhale, P Dixit Journal of Materials Processing Technology 271, 542-553, 2019 | 62 | 2019 |
| Effect of tool electrode roughness on the geometric characteristics of through-holes formed by ECDM J Arab, HK Kannojia, P Dixit Precision Engineering 60, 437-447, 2019 | 54 | 2019 |
| Fabrication and characterization of through-glass vias by the ECDM process HK Kannojia, J Arab, BJ Pegu, P Dixit Journal of The Electrochemical Society 166 (13), D531, 2019 | 44 | 2019 |
| A review of intermetallic compound growth and void formation in electrodeposited Cu–Sn Layers for microsystems packaging HK Kannojia, P Dixit Journal of Materials Science: Materials in Electronics 32 (6), 6742-6777, 2021 | 33 | 2021 |
| Void formation and intermetallic growth in pulse electrodeposited Cu-Sn layers for MEMS packaging HK Kannojia, SK Sharma, P Dixit Journal of Electronic Materials 47, 7386-7400, 2018 | 12 | 2018 |
| Challenges in fabrication of high aspect ratio electrostatic comb-drive microactuator using one-step X-ray lithography R Shukla, HK Kannojia, C Mukherjee, PR Sankar, BS Thakur, AK Sinha, ... ISSS Journal of Micro and Smart Systems 9, 173-180, 2020 | 7 | 2020 |
| Effect of Surface Roughness on Void Formation and Intermetallic Growth in Electrodeposited Cu-Sn stacks HK Kannojia, P Dixit Materials Letters 257, 126710, 2019 | 7 | 2019 |
| Design and fabrication of through-glass via (TGV) based 3D spiral inductors in fused silica substrate HK Kannojia, A Sidhique, AS Shukla, J Pednekar, S Gupta, P Dixit Microsystem Technologies, 1-10, 2021 | 6 | 2021 |
| Fabrication and Characterization of Through-glass vias (TGV) based 3D Spiral and Toroidal Inductors by Cost-effective ECDM Process HK Kannojia, J Arab, A Sidhique, DK Mishra, R Kumar, J Pednekar, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1192-1198, 2020 | 6 | 2020 |
| Experimental investigations in the intermetallic and microvoid formation in sub-200 °C Cu–Sn bonding HK Kannojia, P Dixit Journal of Materials Science: Materials in Electronics 30 (17), 16427-16438, 2019 | 6 | 2019 |
| Formation of Through-Wafer 3-D Interconnects in Fused Silica Substrates by Electrochemical Discharge Machining HK Kannojia, J Arab, R Kumar, J Pednekar, P Dixit 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 253-257, 2019 | 4 | 2019 |
| Void Formation in Low-Temperature Electroplated Cu-Sn Stack for Hermetic Packaging HK Kannojia, P Dixit 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 124-128, 2019 | 2 | 2019 |
| Mid-infrared dual-comb QCLs integrated with beam combiner based on Ge-on-Si platform D Wang, HK Kannojia, P Jouy, E Giraud, G Van Steenberge, B Kuyken 2023 IEEE Silicon Photonics Conference (SiPhotonics), 1-2, 2023 | | 2023 |
| Laser-Induced Forward Transfer for Assembly of Silicon Micro-Chiplets HK Kannojia, G Van Steenberge 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 170-174, 2022 | | 2022 |
| Through-substrate vias based three-dimensional interconnection technology P Dixit, HK Kannojia, K Henttinen Handbook of Silicon Based MEMS Materials and Technologies, 721-741, 2020 | | 2020 |
| Experimental Investigation into the Void Growth at Cu-Cu3Sn Interface HK Kannojia, P Dixit International Conference on Precision, Meso, Micro and Nano Engineering …, 2019 | | 2019 |
| CHALLENGES IN FABRICATION OF HIGH ASPECT RATIO ELECTROSTATIC COMB-DRIVE USING ONE-STEP X-RAY LITHOGRAPHY R Shukla, HK Kannojia, C Mukherjee, PR Sanker, BS Thakur, D Pandey ISSS International Conference on MEMS, Smart Materials, Structures and …, 2017 | | 2017 |
| Intermetallic Growth in Electroplated Cu-Sn Stacks for Hermetic Packaging HK Kannojia, R Gupta, S Sharma, P Dixit International Conference on Manufacturing Technology and Simulation, 195-199, 2017 | | 2017 |
| Formation of Voids in Cu-Sn Metal Stacks for MEMS Applications HK Kannojia, P Dixit International Conference on Precision, Meso, Micro & Nano Engineering (COPEN), 2017 | | 2017 |
Pradeep DixitIIT Bombay India, NTU Singapore, VTT FinlandVerified email at iitb.ac.in
