| Design and fabrication of a hybrid superhydrophobic–hydrophilic surface that exhibits stable dropwise condensation B Mondal, M Mac Giolla Eain, QF Xu, VM Egan, J Punch, AM Lyons ACS applied materials & interfaces 7 (42), 23575-23588, 2015 | 134 | 2015 |
| Friction factor and heat transfer in multiple microchannels with uniform flow distribution HS Park, J Punch International Journal of Heat and Mass Transfer 51 (17-18), 4535-4543, 2008 | 129 | 2008 |
| From chip to cooling tower data center modeling: Part I influence of server inlet temperature and temperature rise across cabinet TJ Breen, EJ Walsh, J Punch, AJ Shah, CE Bash 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010 | 127 | 2010 |
| Film thickness measurements in liquid–liquid slug flow regimes MMG Eain, V Egan, J Punch International Journal of heat and fluid flow 44, 515-523, 2013 | 119 | 2013 |
| Pressure drop in two phase slug/bubble flows in mini scale capillaries E Walsh, Y Muzychka, P Walsh, V Egan, J Punch International Journal of Multiphase Flow 35 (10), 879-884, 2009 | 101 | 2009 |
| Energy scavenging for energy efficiency in networks and applications K Joon Kim, F Cottone, S Goyal, J Punch Bell Labs Technical Journal 15 (2), 7-29, 2010 | 95 | 2010 |
| Effect of Ag content on the microstructure of Sn‐Ag‐Cu based solder alloys M Reid, J Punch, M Collins, C Ryan Soldering & Surface Mount Technology 20 (4), 3-8, 2008 | 84 | 2008 |
| Modeling electronic cooling axial fan flows R Grimes, M Davies, J Punch, T Dalton, R Cole J. Electron. Packag. 123 (2), 112-119, 2001 | 81 | 2001 |
| A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions D Herkommer, J Punch, M Reid Microelectronics Reliability 50 (1), 116-126, 2010 | 75 | 2010 |
| Accelerated temperature cycling induced strain and failure behaviour for BGA assemblies of third generation high Ag content Pb-free solder alloys E Dalton, G Ren, J Punch, MN Collins Materials & Design 154, 184-191, 2018 | 69 | 2018 |
| Energy harvester apparatus having improved efficiency F Cottone, S Goyal, J Punch US Patent 8,350,394, 2013 | 60 | 2013 |
| Phenomenological study of the effect of microstructural evolution on the thermal fatigue resistance of Pb-free solder joints R Coyle, J Osenbach, MN Collins, H McCormick, P Read, D Fleming, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 1 …, 2011 | 57 | 2011 |
| The influence of the Pb-free solder alloy composition and processing parameters on thermal fatigue performance of a ceramic chip resistor R Coyle, M Reid, C Ryan, R Popowich, P Read, D Fleming, M Collins, ... 2009 59th Electronic Components and Technology Conference, 423-430, 2009 | 57 | 2009 |
| Local Nusselt number enhancements in liquid–liquid Taylor flows MMG Eain, V Egan, J Punch International Journal of Heat and Mass Transfer 80, 85-97, 2015 | 56 | 2015 |
| Surface finish effect on reliability of SAC 305 soldered chip resistors MN Collins, J Punch, R Coyle Soldering & Surface Mount Technology 24 (4), 240-248, 2012 | 55 | 2012 |
| Effects of processing parameters and heat treatment on thermal conductivity of additively manufactured AlSi10Mg by selective laser melting C Butler, S Babu, R Lundy, ROR Meehan, J Punch, N Jeffers Materials Characterization 173, 110945, 2021 | 53 | 2021 |
| Microstructural influences on thermomechanical fatigue behaviour of third generation high Ag content Pb-Free solder alloys MN Collins, E Dalton, J Punch Journal of Alloys and Compounds 688, 164-170, 2016 | 53 | 2016 |
| From chip to cooling tower data center modeling: Part II influence of chip temperature control philosophy EJ Walsh, TJ Breen, J Punch, AJ Shah, CE Bash 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010 | 51 | 2010 |
| Finite element modelling of a BGA package subjected to thermal and power cycling B Rodgers, J Punch, J Jarvis ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical …, 2002 | 49 | 2002 |
| Enhanced vibrational energy harvester based on velocity amplification F Cottone, R Frizzell, S Goyal, G Kelly, J Punch Journal of Intelligent Material Systems and Structures 25 (4), 443-451, 2014 | 48 | 2014 |
