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Karan Pawar
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Effect of tool-electrode material in through-hole formation using ECDM process
J Arab, K Pawar, P Dixit
Materials and Manufacturing Processes 36 (9), 1019-1027, 2021
252021
Investigations into surface topography of glass microfeatures formed by pulsed electrochemical discharge milling for microsystem applications
AK Verma, DK Mishra, K Pawar, P Dixit
Microsystem Technologies 26, 2105-2116, 2020
192020
Effect of tool electrode-workpiece gap in the microchannel formation by electrochemical discharge machining
DK Mishra, K Pawar, P Dixit
ECS Journal of Solid State Science and Technology 9 (3), 034011, 2020
152020
Fabrication of deep microfeatures in glass substrate using electrochemical discharge machining for biomedical and microfluidic applications
DK Mishra, J Arab, K Pawar, P Dixit
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 263-266, 2019
92019
Investigation of Cu-Sn-Cu transient liquid phase bonding for microsystems packaging
K Pawar, P Dixit
Materials and Manufacturing Processes 38 (3), 284-294, 2022
52022
Electrochemical Discharge-assisted Roughening to Improve the Adhesion of Electroless Nickel with Glass Substrate
K Pawar, H Pandey, P Dixit
International Conference on Precision, Meso, Micro and Nano Engineering …, 2022
2022
A critical review of copper electroless deposition on glass substrates for microsystems packaging applications
K Pawar, P Dixit
Surface Engineering 38 (6), 576-617, 2022
2022
Adhesion improvement of the electroless film deposited on glass by the Ultrasonic micromachining process
H Pandey, K Pawar, P Dixit
5th World Congress on Micro and Nano Manufacturing WCMNM 2022, Leuven, Belgium, 2022
2022
Geometrical characteristics and tool wear analysis during multipass microchannel formation in ECDM
K Pawar, DK Mishra, J Arab, P Dixit
International Conference on Precision, Meso, Micro and Nano Engineering …, 2019
2019
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