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Fang Luo
Fang Luo
Stony Brook University (SUNY Stony Brook), NY
Verified email at stonybrook.edu - Homepage
Title
Cited by
Cited by
Year
A review of SiC power module packaging: Layout, material system and integration
C Chen, F Luo, Y Kang
CPSS Transactions on Power Electronics and Applications 2 (3), 170-186, 2017
2352017
Leakage current reduction in a single-phase bidirectional AC–DC full-bridge inverter
D Dong, F Luo, D Boroyevich, P Mattavelli
IEEE Transactions on Power Electronics 27 (10), 4281-4291, 2012
1682012
Evaluation of the switching characteristics of a gallium-nitride transistor
M Danilovic, Z Chen, R Wang, F Luo, D Boroyevich, P Mattavelli
2011 IEEE Energy Conversion Congress and Exposition, 2681-2688, 2011
1642011
Grid-interface bidirectional converter for residential DC distribution systems—Part 2: AC and DC interface design with passive components minimization
D Dong, F Luo, X Zhang, D Boroyevich, P Mattavelli
IEEE Transactions on Power Electronics 28 (4), 1667-1679, 2012
1252012
Adaptive multi-level active gate drivers for SiC power devices
S Zhao, A Dearien, Y Wu, C Farnell, AU Rashid, F Luo, HA Mantooth
IEEE Transactions on Power Electronics 35 (2), 1882-1898, 2019
1152019
A survey of active EMI filters for conducted EMI noise reduction in power electronic converters
B Narayanasamy, F Luo
IEEE Transactions on Electromagnetic Compatibility 61 (6), 2040-2049, 2019
1072019
Practical design considerations for a Si IGBT+ SiC MOSFET hybrid switch: Parasitic interconnect influences, cost, and current ratio optimization
A Deshpande, F Luo
IEEE Transactions on Power Electronics 34 (1), 724-737, 2018
1062018
Analysis of CM volt-second influence on CM inductor saturation and design for input EMI filters in three-phase DC-fed motor drive systems
F Luo, S Wang, F Wang, D Boroyevich, N Gazel, Y Kang, AC Baisden
IEEE Transactions on Power Electronics 25 (7), 1905-1914, 2010
1032010
Parasitic effects of grounding paths on common-mode EMI filter's performance in power electronics systems
S Wang, YY Maillet, F Wang, R Lai, F Luo, D Boroyevich
IEEE Transactions on Industrial Electronics 57 (9), 3050-3059, 2009
842009
A novel solid state fault current limiter for DC power distribution network
F Luo, J Chen, X Lin, Y Kang, S Duan
2008 Twenty-Third Annual IEEE Applied Power Electronics Conference and …, 2008
832008
Study of conducted EMI reduction for three-phase active front-end rectifier
D Jiang, R Lai, F Wang, F Luo, S Wang, D Boroyevich
iEEE transactions on Power Electronics 26 (12), 3823-3831, 2010
802010
A variable step maximum power point tracking method using differential equation solution
F Luo, P Xu, Y Kang, S Duan
2007 2nd IEEE Conference on Industrial Electronics and Applications, 2259-2263, 2007
742007
Design and evaluation of laminated busbar for three-level T-type NPC power electronics building block with enhanced dynamic current sharing
Z Yuan, H Peng, A Deshpande, B Narayanasamy, AI Emon, F Luo, ...
IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 395-406, 2019
722019
Design of a high-efficiency, high specific-power three-level T-type power electronics building block for aircraft electric-propulsion drives
A Deshpande, Y Chen, B Narayanasamy, Z Yuan, C Chen, F Luo
IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 407-416, 2019
692019
A double-end sourced wire-bonded multichip SiC MOSFET power module with improved dynamic current sharing
M Wang, F Luo, L Xu
IEEE Journal of Emerging and Selected Topics in Power Electronics 5 (4 …, 2017
692017
Improving high-frequency performance of an input common mode EMI filter using an impedance-mismatching filter
F Luo, D Dong, D Boroyevich, P Mattavelli, S Wang
IEEE Transactions on Power Electronics 29 (10), 5111-5115, 2014
682014
Design considerations for GaN HEMT multichip halfbridge module for high-frequency power converters
F Luo, Z Chen, L Xue, P Mattavelli, D Boroyevich, B Hughes
2014 IEEE Applied Power Electronics Conference and Exposition-APEC 2014, 537-544, 2014
672014
Space-charge accumulation and its impact on high-voltage power module partial discharge under DC and PWM waves: Testing and modeling
Y Wang, Y Ding, Z Yuan, H Peng, J Wu, Y Yin, T Han, F Luo
IEEE Transactions on Power Electronics 36 (10), 11097-11108, 2021
642021
Flexible PCB-based 3-D integrated SiC half-bridge power module with three-sided cooling using ultralow inductive hybrid packaging structure
C Chen, Z Huang, L Chen, Y Tan, Y Kang, F Luo
IEEE Transactions on Power Electronics 34 (6), 5579-5593, 2018
642018
A review of advanced thermal management solutions and the implications for integration in high-voltage packages
AC Iradukunda, DR Huitink, F Luo
IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 256-271, 2019
622019
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