| Through-glass vias for glass interposers and MEMS packaging applications fabricated using magnetic assembly of microscale metal wires MJ Laakso, SJ Bleiker, J Liljeholm, GE Mårtensson, M Asiatici, AC Fischer, ... Ieee Access 6, 44306-44317, 2018 | 23 | 2018 |
| Quantitative assessment of structural and compositional colors induced by femtosecond laser: A case study on 301LN stainless steel surface X Shi, Z Huang, MJ Laakso, F Niklaus, R Sliz, T Fabritius, M Somani, ... Applied Surface Science 484, 655-662, 2019 | 19 | 2019 |
| Three-dimensional printing of silica glass with sub-micrometer resolution PH Huang, M Laakso, P Edinger, O Hartwig, GS Duesberg, LL Lai, ... Nature Communications 14 (1), 3305, 2023 | 16 | 2023 |
| Through silicon vias with invar metal conductor for high-temperature applications M Asiatici, MJ Laakso, AC Fischer, G Stemme, F Niklaus Journal of microelectromechanical systems 26 (1), 158-168, 2016 | 14 | 2016 |
| Water in contact with the backside of a silicon substrate enables drilling of high-quality holes through the substrate using ultrashort laser pulses MJO Laakso, S Pagliano, U Shah, GE Mårtensson, G Stemme, F Niklaus Optics Express 28 (2), 1394-1407, 2020 | 8 | 2020 |
| Vertical integration of microchips by magnetic assembly and edge wire bonding F Ribet, X Wang, M Laakso, S Pagliano, F Niklaus, N Roxhed, G Stemme Microsystems & Nanoengineering 6 (1), 12, 2020 | 5 | 2020 |
| Maskless manufacturing of through glass vias (TGVS) and their test structures MJ Laakso, J Liljeholm, AC Fischer, G Stemme, T Ebefors, F Niklaus 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems …, 2017 | 4 | 2017 |
| Wide temperature range through silicon vias made of Invar and spin-on glass for interposers and MEMS MJ Laakso, M Asiatici, AC Fischer, G Stemme, F Niklaus 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems …, 2016 | 4 | 2016 |
| Three-dimensional printing of silica-glass structures with submicrometric features M Laakso, PH Huang, P Edinger, O Hartwig, GS Duesberg, ... arXiv preprint arXiv:2005.06805, 2020 | 3 | 2020 |
| Magnetic properties of the CoxZn1− xO (x= 0.20, 0.86, 0.92) films and its tunnel magnetoresistance F Wang, W Wan, L Chen, MJO Laakso Materials Research Express 2 (12), 126102, 2015 | 1 | 2015 |
| Method and apparatus for additively forming an optical component PH Huang, G Stemme, F Niklaus, KB Gylfason, M Laakso, P Edinger, ... US Patent App. 17/171,587, 2022 | | 2022 |
| Quantitative assessment of structural and compositional colors induced by femtosecond laser: A case study on 301LN stainless steel surface (vol 484, pg 655, 2019) X Shi, Z Huang, MJ Laakso, F Niklaus, R Sliz, T Fabritius, M Somani, ... APPLIED SURFACE SCIENCE 504, 2020 | | 2020 |
| Microfabrication and Integration Using Sub-Picosecond Laser Pulses and Magnetic Assembly M Laakso Kungliga tekniska högskolan, 2020 | | 2020 |
| Corrigendum to" Quantitative assessment of structural and compositional colors induced by femtosecond laser: A case study on 301LN stainless steel surface"[Appl. Surf. Sci. 484 … X Shi, Z Huang, M Laakso, F Niklaus, R Sliz, T Fabritius, M Somani, T Nyo, ... Applied Surface Science 504, 2020 | | 2020 |
| Through-Glass Vias for MEMS Packaging M Laakso, SJ Bleiker, J Liljeholm, G Mårtensson, M Asiatici, AC Fischer, ... The Micronano System Workshop (MSW), 2018, Helsinki, Finland, 13-15 May, 2018 | | 2018 |
Frank NiklausProfessor of Micro and Nanosystems at KTH Royal Institute of Technology, Stockholm, SwedenVerified email at kth.se
