| Dramatic effect of oxide on measured liquid metal rheology ES Elton, TC Reeve, LE Thornley, ID Joshipura, PH Paul, AJ Pascall, ... Journal of Rheology 64 (1), 119-128, 2020 | 54 | 2020 |
| Advances in Pb-free solder microstructure control and interconnect design KN Reeve, JR Holaday, SM Choquette, IE Anderson, CA Handwerker Journal of Phase Equilibria and Diffusion 37, 369-386, 2016 | 28 | 2016 |
| Beta-tin grain formation in aluminum-modified lead-free solder alloys KN Reeve, CA Handwerker Journal of Electronic Materials 47, 61-76, 2018 | 18 | 2018 |
| Nucleation and growth of Cu-Al intermetallics in Al-modified Sn-Cu and Sn-Ag-Cu lead-free solder alloys KN Reeve, IE Anderson, CA Handwerker Journal of Electronic Materials 44, 842-866, 2015 | 14 | 2015 |
| Lead-free composite solder IE Anderson, SM Choquette, KN Reeve, JL Harringa US Patent App. 15/330,496, 2017 | 4 | 2017 |
| Rapid solidification of Sn-Cu-Al alloys for high-reliability, lead-free solder: Part II. Intermetallic coarsening behavior of rapidly solidified solders after multiple reflows KN Reeve, SM Choquette, IE Anderson, CA Handwerker Metallurgical and Materials Transactions A 47, 6526-6541, 2016 | 3 | 2016 |
| Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part I. Microstructural Characterization of Rapidly Solidified Solders KN Reeve, SM Choquette, IE Anderson, CA Handwerker Metallurgical and Materials Transactions A 47, 6507-6525, 2016 | 3 | 2016 |
| Process-structure-property relationships for droplet-on-demand liquid-metal-jetted parts NN Watkins, KD Traxel, AE Wilson-Heid, TC Reeve, CM Silva, JR Jeffries, ... Additive Manufacturing 73, 103709, 2023 | | 2023 |
| Orientation Relationships of Pure Tin on Single Crystal Germanium Substrates TC Reeve, ST Reeve, CA Handwerker Journal of Electronic Materials 49, 140-151, 2020 | | 2020 |
| Nucleation, Growth, and Structure of Beta-Tin in Tin-Based Lead-Free Solders TC Reeve Purdue University, 2018 | | 2018 |
