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Zhiguo Qian
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Embedded multi-die interconnect bridge (EMIB)--a high density, high bandwidth packaging interconnect
R Mahajan, R Sankman, N Patel, DW Kim, K Aygun, Z Qian, Y Mekonnen, ...
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 557-565, 2016
2302016
Fast full-wave surface integral equation solver for multiscale structure modeling
ZG Qian, WC Chew
IEEE Transactions on Antennas and Propagation 57 (11), 3594-3601, 2009
2082009
Generalized impedance boundary condition for conductor modeling in surface integral equation
ZG Qian, WC Chew, R Suaya
IEEE Transactions on Microwave Theory and Techniques 55 (11), 2354-2364, 2007
1342007
BRIDGE INTERCONNECT WITH AIR GAP IN PACKAGE ASSEMBLY
C Chiu, Z Qian, MJ Manusharow
US Patent 20,150,011,050, 2015
1272015
Bridge interconnect with air gap in package assembly
CP Chiu, Z Qian, MJ Manusharow
US Patent 8,872,349, 2014
1242014
Accurate analysis of large-scale periodic structures using an efficient sub-entire-domain basis function method
WB Lu, TJ Cui, ZG Qian, XX Yin, W Hong
IEEE transactions on antennas and propagation 52 (11), 3078-3085, 2004
1212004
An augmented electric field integral equation for high‐speed interconnect analysis
ZG Qian, WC Chew
Microwave and Optical Technology Letters 50 (10), 2658-2662, 2008
982008
X-line routing for dense multi-chip-package interconnects
Z Qian, K Aygun
US Patent 8,946,900, 2015
972015
Enhanced A-EFIE with perturbation method
ZG Qian, WC Chew
IEEE transactions on antennas and propagation 58 (10), 3256-3264, 2010
972010
A quantitative study on the low frequency breakdown of EFIE
ZG Qian, WC Chew
Microwave and Optical Technology Letters 50 (5), 1159-1162, 2008
622008
Fast algorithms for large-scale periodic structures using subentire domain basis functions
WB Lu, TJ Cui, XX Yin, ZG Qian, W Hong
IEEE transactions on antennas and propagation 53 (3), 1154-1162, 2005
602005
An enhanced augmented electric-field integral equation formulation for dielectric objects
T Xia, H Gan, M Wei, WC Chew, H Braunisch, Z Qian, K Aygün, A Aydiner
IEEE Transactions on Antennas and Propagation 64 (6), 2339-2347, 2016
472016
An augmented electric field integral equation for layered medium Green's function
YP Chen, L Jiang, ZG Qian, WC Chew
IEEE transactions on antennas and propagation 59 (3), 960-968, 2010
462010
Nyström method solution of volume integral equations for electromagnetic scattering by 3D penetrable objects
MS Tong, ZG Qian, WC Chew
IEEE transactions on antennas and propagation 58 (5), 1645-1652, 2010
432010
Embedded multidie interconnect bridge—A localized, high-density multichip packaging interconnect
R Mahajan, Z Qian, RS Viswanath, S Srinivasan, K Aygün, WL Jen, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 9 …, 2019
372019
Interconnect routing configurations and associated techniques
Z Qian, K Aygun, D Kim
US Patent 9,542,522, 2017
332017
An integral equation modeling of lossy conductors with the enhanced augmented electric field integral equation
T Xia, H Gan, M Wei, WC Chew, H Braunisch, Z Qian, K Aygün, A Aydiner
IEEE Transactions on Antennas and Propagation 65 (8), 4181-4190, 2017
292017
An augmented electric field integral equation for low frequency electromagnetic analysis
ZG Qian, WC Chew
2008 IEEE Antennas and Propagation Society International Symposium, 1-4, 2008
212008
An efficient multiregion model for electromagnetic scattering and radiation by PEC targets
TJ Cui, WB Lu, ZG Qian, W Hong, XX Yin
IEEE Transactions on Antennas and Propagation 52 (7), 1707-1716, 2004
172004
Skin-effect-incorporated transient simulation using the Laguerre-FDTD scheme
M Yi, M Ha, Z Qian, A Aydiner, M Swaminathan
IEEE transactions on microwave theory and techniques 61 (12), 4029-4039, 2013
152013
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