Embedded multi-die interconnect bridge (EMIB)--a high density, high bandwidth packaging interconnect R Mahajan, R Sankman, N Patel, DW Kim, K Aygun, Z Qian, Y Mekonnen, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 557-565, 2016 | 230 | 2016 |

Fast full-wave surface integral equation solver for multiscale structure modeling ZG Qian, WC Chew IEEE Transactions on Antennas and Propagation 57 (11), 3594-3601, 2009 | 208 | 2009 |

Generalized impedance boundary condition for conductor modeling in surface integral equation ZG Qian, WC Chew, R Suaya IEEE Transactions on Microwave Theory and Techniques 55 (11), 2354-2364, 2007 | 134 | 2007 |

BRIDGE INTERCONNECT WITH AIR GAP IN PACKAGE ASSEMBLY C Chiu, Z Qian, MJ Manusharow US Patent 20,150,011,050, 2015 | 127 | 2015 |

Bridge interconnect with air gap in package assembly CP Chiu, Z Qian, MJ Manusharow US Patent 8,872,349, 2014 | 124 | 2014 |

Accurate analysis of large-scale periodic structures using an efficient sub-entire-domain basis function method WB Lu, TJ Cui, ZG Qian, XX Yin, W Hong IEEE transactions on antennas and propagation 52 (11), 3078-3085, 2004 | 121 | 2004 |

An augmented electric field integral equation for high‐speed interconnect analysis ZG Qian, WC Chew Microwave and Optical Technology Letters 50 (10), 2658-2662, 2008 | 98 | 2008 |

X-line routing for dense multi-chip-package interconnects Z Qian, K Aygun US Patent 8,946,900, 2015 | 97 | 2015 |

Enhanced A-EFIE with perturbation method ZG Qian, WC Chew IEEE transactions on antennas and propagation 58 (10), 3256-3264, 2010 | 97 | 2010 |

A quantitative study on the low frequency breakdown of EFIE ZG Qian, WC Chew Microwave and Optical Technology Letters 50 (5), 1159-1162, 2008 | 62 | 2008 |

Fast algorithms for large-scale periodic structures using subentire domain basis functions WB Lu, TJ Cui, XX Yin, ZG Qian, W Hong IEEE transactions on antennas and propagation 53 (3), 1154-1162, 2005 | 60 | 2005 |

An enhanced augmented electric-field integral equation formulation for dielectric objects T Xia, H Gan, M Wei, WC Chew, H Braunisch, Z Qian, K Aygün, A Aydiner IEEE Transactions on Antennas and Propagation 64 (6), 2339-2347, 2016 | 47 | 2016 |

An augmented electric field integral equation for layered medium Green's function YP Chen, L Jiang, ZG Qian, WC Chew IEEE transactions on antennas and propagation 59 (3), 960-968, 2010 | 46 | 2010 |

Nyström method solution of volume integral equations for electromagnetic scattering by 3D penetrable objects MS Tong, ZG Qian, WC Chew IEEE transactions on antennas and propagation 58 (5), 1645-1652, 2010 | 43 | 2010 |

Embedded multidie interconnect bridge—A localized, high-density multichip packaging interconnect R Mahajan, Z Qian, RS Viswanath, S Srinivasan, K Aygün, WL Jen, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 9 …, 2019 | 37 | 2019 |

Interconnect routing configurations and associated techniques Z Qian, K Aygun, D Kim US Patent 9,542,522, 2017 | 33 | 2017 |

An integral equation modeling of lossy conductors with the enhanced augmented electric field integral equation T Xia, H Gan, M Wei, WC Chew, H Braunisch, Z Qian, K Aygün, A Aydiner IEEE Transactions on Antennas and Propagation 65 (8), 4181-4190, 2017 | 29 | 2017 |

An augmented electric field integral equation for low frequency electromagnetic analysis ZG Qian, WC Chew 2008 IEEE Antennas and Propagation Society International Symposium, 1-4, 2008 | 21 | 2008 |

An efficient multiregion model for electromagnetic scattering and radiation by PEC targets TJ Cui, WB Lu, ZG Qian, W Hong, XX Yin IEEE Transactions on Antennas and Propagation 52 (7), 1707-1716, 2004 | 17 | 2004 |

Skin-effect-incorporated transient simulation using the Laguerre-FDTD scheme M Yi, M Ha, Z Qian, A Aydiner, M Swaminathan IEEE transactions on microwave theory and techniques 61 (12), 4029-4039, 2013 | 15 | 2013 |