| Embedded multi-die interconnect bridge (EMIB)--a high density, high bandwidth packaging interconnect R Mahajan, R Sankman, N Patel, DW Kim, K Aygun, Z Qian, Y Mekonnen, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 557-565, 2016 | 314 | 2016 |
| Fast full-wave surface integral equation solver for multiscale structure modeling ZG Qian, WC Chew IEEE Transactions on Antennas and Propagation 57 (11), 3594-3601, 2009 | 228 | 2009 |
| BRIDGE INTERCONNECT WITH AIR GAP IN PACKAGE ASSEMBLY C Chiu, Z Qian, MJ Manusharow US Patent 20,150,011,050, 2015 | 169 | 2015 |
| Bridge interconnect with air gap in package assembly CP Chiu, Z Qian, MJ Manusharow US Patent 8,872,349, 2014 | 160 | 2014 |
| Generalized impedance boundary condition for conductor modeling in surface integral equation ZG Qian, WC Chew, R Suaya IEEE Transactions on Microwave Theory and Techniques 55 (11), 2354-2364, 2007 | 146 | 2007 |
| X-line routing for dense multi-chip-package interconnects Z Qian, K Aygun US Patent 8,946,900, 2015 | 129 | 2015 |
| Accurate analysis of large-scale periodic structures using an efficient sub-entire-domain basis function method WB Lu, TJ Cui, ZG Qian, XX Yin, W Hong IEEE transactions on antennas and propagation 52 (11), 3078-3085, 2004 | 127 | 2004 |
| An augmented electric field integral equation for high‐speed interconnect analysis ZG Qian, WC Chew Microwave and Optical Technology Letters 50 (10), 2658-2662, 2008 | 106 | 2008 |
| Enhanced A-EFIE with perturbation method ZG Qian, WC Chew IEEE Transactions on Antennas and Propagation 58 (10), 3256-3264, 2010 | 105 | 2010 |
| Embedded multidie interconnect bridge—A localized, high-density multichip packaging interconnect R Mahajan, Z Qian, RS Viswanath, S Srinivasan, K Aygün, WL Jen, ... IEEE transactions on components, packaging and manufacturing technology 9 …, 2019 | 68 | 2019 |
| A quantitative study on the low frequency breakdown of EFIE ZG Qian, WC Chew Microwave and Optical Technology Letters 50 (5), 1159-1162, 2008 | 66 | 2008 |
| Fast algorithms for large-scale periodic structures using subentire domain basis functions WB Lu, TJ Cui, XX Yin, ZG Qian, W Hong IEEE transactions on antennas and propagation 53 (3), 1154-1162, 2005 | 61 | 2005 |
| An enhanced augmented electric-field integral equation formulation for dielectric objects T Xia, H Gan, M Wei, WC Chew, H Braunisch, Z Qian, K Aygün, A Aydiner IEEE Transactions on Antennas and Propagation 64 (6), 2339-2347, 2016 | 54 | 2016 |
| An augmented electric field integral equation for layered medium Green's function YP Chen, L Jiang, ZG Qian, WC Chew IEEE Transactions on Antennas and Propagation 59 (3), 960-968, 2010 | 50 | 2010 |
| Nyström method solution of volume integral equations for electromagnetic scattering by 3D penetrable objects MS Tong, ZG Qian, WC Chew IEEE transactions on antennas and propagation 58 (5), 1645-1652, 2010 | 48 | 2010 |
| Universal chiplet interconnect express (UCIe): An open industry standard for innovations with chiplets at package level DD Sharma, G Pasdast, Z Qian, K Aygun IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 47 | 2022 |
| Interconnect routing configurations and associated techniques Z Qian, K Aygun, D Kim US Patent 9,542,522, 2017 | 46 | 2017 |
| An integral equation modeling of lossy conductors with the enhanced augmented electric field integral equation T Xia, H Gan, M Wei, WC Chew, H Braunisch, Z Qian, K Aygün, A Aydiner IEEE Transactions on Antennas and Propagation 65 (8), 4181-4190, 2017 | 33 | 2017 |
| Microelectronic assemblies having magnetic core inductors K Bharath, AA Elsherbini, SM Liff, K Radhakrishnan, Z Qian, JM Swan US Patent 11,450,560, 2022 | 22 | 2022 |
| Semiconductor package with through bridge die connections Z Qian, J Xie, K Aygun US Patent 10,950,550, 2021 | 22 | 2021 |
