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Co-authors
- Cheng Deng (邓成)School of Electronic Engineering, Xi'an 710071, Xidian UniversityVerified email at mail.xidian.edu.cn
- Dacheng TaoNanyang Technological UniversityVerified email at ntu.edu.sg
- Xianglong Liu (刘祥龙)Beihang UniversityVerified email at buaa.edu.cn
- Wei Liu, IEEE/IAPR/IMA FellowDistinguished Scientist, TencentVerified email at ee.columbia.edu
- De Xie(谢德)Ph.D. student, School of Electronic Engineering, Xidian University, Xi'an 710071, ChinaVerified email at stu.xidian.edu.cn
- Xinbo Gao, Fellow of IEEEXidian University & CQUPTVerified email at mail.xidian.edu.cn
- Erkun Yang(杨二昆)Xidian UniversityVerified email at xidian.edu.cn
- Shangqian GaoFlorida State UniversityVerified email at pitt.edu
- Junchi YanFIAPR/FIET/IEEE-AI2Watch, SJTU (2018-), IBM (2011-2018)Verified email at cs.sjtu.edu.cn
- Hao WangHangzhou Dianzi UniversityVerified email at hdu.edu.cn
- Liang ZhanAssociate Professor, Deps. of ECE and BioE, University of PittsburghVerified email at pitt.edu