Get my own profile
Public access
View all40 articles
16 articles
available
not available
Based on funding mandates
Co-authors
Dan FengHuazhong University of Sci. and Tech.Verified email at hust.edu.cn
Yu HuaProfessor, Huazhong University of Science and TechnologyVerified email at hust.edu.cn
Hong JiangUniversity of Texas at ArlingtonVerified email at uta.edu
Min FuTencentVerified email at tencent.com
Xiangyu ZouHarbin Institute of Technology, ShenzhenVerified email at hit.edu.cn
Yukun ZhouPhD student, Huazhong University of Science & Technology, Wuhan, ChinaVerified email at hust.edu.cn
Philip ShilaneDell TechnologiesVerified email at dell.com
Lei TianStaff Engineer in TintriVerified email at tintri.com
Yuchong HuHuazhong University of Science and TechnologyVerified email at hust.edu.cn
Xubin HeTemple UniversityVerified email at temple.edu
Qing LIAOHarbin Institute of Technology, ShenzhenVerified email at hit.edu.cn
Weizhe ZhangProfessor of Peng Cheng Laboratory & Harbin Institute of TechnologyVerified email at hit.edu.cn
Fred DouglisPeraton LabsVerified email at Peratonlabs.com
Dingwen TaoIndiana University Bloomington, IEEE/ACM Senior MemberVerified email at iu.edu
Qing LiuHuazhong University of Science and TechnologyVerified email at hust.edu.cn
Yujuan TanChongqing University Verified email at cqu.edu.cn
Tao LuDapuStorVerified email at dapustor.com
Pengfei ZuoHuawei CloudVerified email at huawei.com
Erik KruusNEC Labs AmericaVerified email at nec-labs.com
Yuanyuan SunAlibaba GroupVerified email at alibaba-inc.com