Ai Ting Tan - Google 学术搜索

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引用次数

	总计	2019 年至今
引用	186	136
h 指数	4	4
i10 指数	4	4

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2016201720182019202020212022202320246 19 23 23 17 39 23 29 5

Ai Ting Tan

Ai Ting Tan

PhD student

在 siswa.um.edu.my 的电子邮件经过验证

Soldering ultrasonic joining


标题按引用次数排序按年份排序按标题排序	引用次数引用次数	年份
Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions AT Tan, AW Tan, F Yusof Science and technology of advanced materials 16 (3), 033505, 2015	80	2015
Effect of ultrasonic vibration time on the Cu/Sn-Ag-Cu/Cu joint soldered by low-power-high-frequency ultrasonic-assisted reflow soldering AT Tan, AW Tan, F Yusof Ultrasonics sonochemistry 34, 616-625, 2017	47	2017
Evolution of microstructure and mechanical properties of Cu/SAC305/Cu solder joints under the influence of low ultrasonic power AT Tan, AW Tan, F Yusof Journal of Alloys and Compounds 705, 188-197, 2017	43	2017
Influence of high-power-low-frequency ultrasonic vibration time on the microstructure and mechanical properties of lead-free solder joints AT Tan, AW Tan, F Yusof Journal of Materials Processing Technology 238, 8-14, 2016	16	2016
Ultrasonic assisted reflow soldering of lead free solder joint/Tan Ai Ting AT Tan University of Malaya, 2017		2017

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