| Numerical simulation and analytical modeling of the thermal behavior of single-and double-sided cooled power modules AP Catalano, C Scognamillo, V d’Alessandro, A Castellazzi IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 37 | 2020 |
| Compact modeling of a 3.3 kv sic mosfet power module for detailed circuit-level electrothermal simulations including parasitics C Scognamillo, AP Catalano, M Riccio, V d’Alessandro, L Codecasa, ... Energies 14 (15), 4683, 2021 | 25 | 2021 |
| Circuit-based electrothermal simulation of multicellular SiC power MOSFETs using FANTASTIC V d’Alessandro, L Codecasa, AP Catalano, C Scognamillo Energies 13 (17), 4563, 2020 | 23 | 2020 |
| Optimum thermal design of high-voltage double-sided cooled multi-chip SiC power modules AP Catalano, C Scognamillo, A Castellazzi, V d’Alessandro 2019 25th International Workshop on Thermal Investigations of ICs and …, 2019 | 21 | 2019 |
| Combined experimental-FEM investigation of electrical ruggedness in double-sided cooled power modules C Scognamillo, AP Catalano, P Lasserre, C Duchesne, V d'Alessandro, ... Microelectronics Reliability 114, 113742, 2020 | 20 | 2020 |
| Analysis of electrothermal effects in devices and arrays in InGaP/GaAs HBT technology V d’Alessandro, AP Catalano, C Scognamillo, L Codecasa, PJ Zampardi Electronics 10 (6), 757, 2021 | 18 | 2021 |
| Optimization of thermal vias design in PCB-based power circuits AP Catalano, R Trani, C Scognamillo, V d’Alessandro, A Castellazzi 2020 21st International conference on thermal, mechanical and multi-physics …, 2020 | 13 | 2020 |
| Using EMPHASIS for the thermography-based fault detection in photovoltaic plants AP Catalano, C Scognamillo, P Guerriero, S Daliento, V d’Alessandro Energies 14 (6), 1559, 2021 | 12 | 2021 |
| A Technique for the In-Situ Experimental Extraction of the Thermal Impedance of Power Devices C Scognamillo, S Fregonese, T Zimmer, V d'Alessandro, AP Catalano IEEE Transactions on Power Electronics 37 (10), 11511-11515, 2022 | 10 | 2022 |
| Numerical analysis of the thermal impact of ceramic materials in double-sided cooled power modules C Scognamillo, AP Catalano, A Castellazzi, V d'Alessandro 2020 26th International Workshop on Thermal Investigations of ICs and …, 2020 | 10 | 2020 |
| Accurate and efficient algorithm for computing structure functions from the spatial distribution of thermal properties in electronic devices L Codecasa, V D’Alessandro, AP Catalano, C Scognamillo, D D’Amore, ... IEEE Transactions on Electron Devices 68 (11), 5386-5393, 2021 | 9 | 2021 |
| Experimental determination, modeling, and simulation of nonlinear thermal effects in bipolar transistors under static conditions: A critical review and update V d’Alessandro, AP Catalano, C Scognamillo, M Müller, M Schröter, ... Energies 15 (15), 5457, 2022 | 7 | 2022 |
| Electrothermal modeling, simulation, and electromagnetic characterization of a 3.3 kV SiC mosfet power module C Scognamillo, AP Catalano, A Borghese, M Riccio, V d’Alessandro, ... 2021 33rd International Symposium on Power Semiconductor Devices and ICs …, 2021 | 7 | 2021 |
| Analytical modeling and numerical simulation of nonlinear thermal effects in bipolar transistors V D'Alessandro, C Scognamillo, AP Catalano, M Müller, M Schröter, ... 2022 28th International Workshop on Thermal Investigations of ICs and …, 2022 | 6 | 2022 |
| 3-D FEM investigation on electrical ruggedness of double-sided cooled power modules C Scognamillo, AP Catalano, R Trani, V d’Alessandro, A Castellazzi 2020 21st International Conference on Thermal, Mechanical and Multi-Physics …, 2020 | 5 | 2020 |
| A Critical Review of Techniques for the Experimental Extraction of the Thermal Resistance of Bipolar Transistors from DC Measurements—Part I: Thermometer-Based Approaches V d’Alessandro, AP Catalano, C Scognamillo, M Müller, M Schröter, ... Electronics 12 (16), 3471, 2023 | 4 | 2023 |
| Thermo-Electrochemical FEM and circuit simulations of Li-ion Batteries AP Catalano, C Scognamillo, F Piccirillo, M Iasiello, P Guerriero, N Bianco, ... IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023 | 4 | 2023 |
| Experimental validation of analytical models for through-PCB thermal vias AP Catalano, C Scognamillo, R Trani, A Castellazzi, V d'Alessandro 2020 26th International Workshop on Thermal Investigations of ICs and …, 2020 | 4 | 2020 |
| Numerical analysis and analytical modeling of the thermal behavior of double-sided cooled power modules AP Catalano, C Scognamillo, V d’Alessandro, A Castellazzi IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020 | 4 | 2020 |
| On-Chip Spike Detection and Classification using Neural Networks and Approximate Computing E Zacharelos, C Scognamillo, E Napoli, D Gragnaniello 2023 IEEE Biomedical Circuits and Systems Conference (BioCAS), 1-5, 2023 | 3 | 2023 |
Antonio Pio CatalanoAssistant Professor in Electronic Engineering for University of Naples Federico IIVerified email at unina.it
