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Jian ZhuSchool of Science and Engineering, Chinese University of Hong Kong, Shenzhen, ChinaVerified email at cuhk.edu.cn
Ujjaval GuptaDManD, SUTD-MIT IDC | NUS | IIScVerified email at u.nus.edu
Hareesh GodabaUniversity of SussexVerified email at sussex.ac.uk
Jianyong OuyangNational University of SingaporeVerified email at nus.edu.sg
Pengcheng Li (李鹏程)Wuhan Institute of TechnologyVerified email at wit.edu.cn
Jisen LiAssociate Researcher,Shenzhen Institute of Artificial Intelligence and Robotics for SocietyVerified email at cuhk.edu.cn
Jun LiuIHPC, A*STARVerified email at ihpc.a-star.edu.sg
Keith Choon Chiang FooPrincipal Scientist, A*STAR IHPC. Previously with Harvard, NTUVerified email at ihpc.a-star.edu.sg
Sameh TawfickUniversity of IllinoisVerified email at illinois.edu
Liang WenyuA*STAR Institute for Infocomm Research; National University of SingaporeVerified email at i2r.a-star.edu.sg
Heow Pueh LeeMechanical Engineering, National University of SingaporeVerified email at nus.edu.sg
Dr Hui HUANGSingapore Institute of Manufacturing Technology, A*STAR, SingaporeVerified email at SIMTech.a-star.edu.sg
Hongliang RenChinese University of Hong Kong | National University of Singapore | JHU/Harvard(RF) | CUHK(PhD)Verified email at jhu.edu
Ray BaughmanVerified email at utdallas.edu
Mingchao Liu (刘明超)University of Birmingham; NTU; University of Oxford; Tsinghua UniversityVerified email at bham.ac.uk
Aimy WissaMAE Professor, Princeton UniversityVerified email at princeton.edu
Dominic VellaUniversity of OxfordVerified email at maths.ox.ac.uk
Marianne AlleyneAssistant Professor, Entomology, University of Illinois at Urbana-ChampaignVerified email at illinois.edu
Ophelia BolminSandia National LaboratoriesVerified email at andrew.cmu.edu
William P. KingRalph A. Andersen Endowed Chair, Department of Mechanical Science and Engineering, University ofVerified email at illinois.edu
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Wang Yuzhe
Singapore Institute of Manufacturing Technology, Agency for Science Technology and Research
Verified email at simtech.a-star.edu.sg