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Hongzhi Wu (伍宏志)
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Four-dimensional printing of a novel acrylate-based shape memory polymer using digital light processing
H Wu, P Chen, C Yan, C Cai, Y Shi
Materials & Design 171, 107704, 2019
1312019
Investigation into the processability, recyclability and crystalline structure of selective laser sintered Polyamide 6 in comparison with Polyamide 12
P Chen, H Wu, W Zhu, L Yang, Z Li, C Yan, S Wen, Y Shi
Polymer Testing 69, 366-374, 2018
832018
Insights into unit cell size effect on mechanical responses and energy absorption capability of titanium graded porous structures manufactured by laser powder bed fusion
L Yang, C Han, H Wu, L Hao, Q Wei, C Yan, Y Shi
Journal of the mechanical behavior of biomedical materials 109, 103843, 2020
782020
A Material Combination Concept to Realize 4D Printed Products with Newly Emerging Property/Functionality
H Wu, X Zhang, Z Ma, C Zhang, J Ai, P Chen, C Yan, B Su, Y Shi
Advanced Science 7 (9), 1903208, 2020
662020
Selective laser sintering-based 4D printing of magnetism-responsive grippers
H Wu, O Wang, Y Tian, M Wang, B Su, C Yan, K Zhou, Y Shi
ACS applied materials & interfaces 13 (11), 12679-12688, 2020
612020
Crystallization kinetics of polyetheretherketone during high temperature-selective laser sintering
P Chen, H Cai, Z Li, M Li, H Wu, J Su, S Wen, Y Zhou, J Liu, C Wang, ...
Additive Manufacturing 36, 101615, 2020
512020
Tailorable and predictable mechanical responses of additive manufactured TPMS lattices with graded structures
L Yang, Y Li, S Wu, P Chen, H Wu, J Su, H Wang, J Liu, C Yan, Y Shi
Materials Science and Engineering: A 843, 143109, 2022
322022
Comparative evaluation of printability and compression properties of poly-ether-ether-ketone triply periodic minimal surface scaffolds fabricated by laser powder bed fusion
H Wang, P Chen, H Wu, A Chen, S Wu, J Su, M Wang, X Feng, C Yang, ...
Additive Manufacturing 57, 102961, 2022
302022
Four-dimensional printing——the additive manufacturing technology of intelligent components
史玉升, 伍宏志, 闫春泽, 杨潇, 陈道兵, 张策, 苏彬, 宋波, 李中伟, ...
Journal of Mechanical Engineering 56 (15), 1-25, 2020
262020
A 2D correlation infrared spectroscopic study on the temperature-induced molecular motion mechanism concerning self-formed composite structure of 3D printed PA6
P Chen, H Wu, L Yang, Z Li, C Yan, J Liu, S Wen, Y Shi
Polymer 167, 48-53, 2019
122019
4D 打印——智能构件的增材制造技术
史玉升, 伍宏志, 闫春泽, 杨潇, 陈道兵, 张策, 苏彬, 宋波, 李中伟, ...
机械工程学报 56 (15), 1-25, 2020
102020
Multi‐Material Additively Manufactured Magnetoelectric Architectures with a Structure‐Dependent Mechanical‐to‐Electrical Conversion Capability
H Wu, Q Wang, Z Wu, M Wang, L Yang, Z Liu, S Wu, B Su, C Yan, Y Shi
Small Methods 6 (12), 2201127, 2022
82022
Mechanical properties and energy absorption of AlSi10Mg Gyroid lattice structures fabricated by selective laser melting
S Wu, L Yang, X Yang, P Chen, J Su, H Wu, Z Liu, H Wang, C Wang, ...
Smart Manufacturing 1 (01), 2150001, 2022
72022
4D printing of stimuli-responsive materials
C Yan, X Yang, H Wu
Additive Manufacturing: Materials, Functionalities and Applications, 85-112, 2022
52022
Polymer multi-material high-flexibility laser additive manufacturing system and method thereof
YAN Chunze, H Wu, Y Shi, WEN Shifeng, L Zhang
US Patent App. 16/248,296, 2020
52020
Multimaterial additive manufacturing manipulator for fabricating magnetoelectric pressure sensors
ZF Liu, ZQ Li, Q Wang, Y Wang, L Yang, X Nie, P Geng, ZH Wu, SH Tang, ...
Science China Technological Sciences 65 (11), 2542-2550, 2022
42022
Independently temperature-controlled high-temperature selective laser sintering frame structure
WEN Shifeng, P Chen, YAN Chunze, L Yang, LI Zhaoqing, H Wu, Y Shi
US Patent 10,821,675, 2020
32020
4D Printing: A Material Combination Concept to Realize 4D Printed Products with Newly Emerging Property/Functionality (Adv. Sci. 9/2020)
H Wu, X Zhang, Z Ma, C Zhang, J Ai, P Chen, C Yan, B Su, Y Shi
Advanced Science 7 (9), 2020
32020
增材制造技术前沿: 从 3D 打印迈向 4D 打印——3D 打印材料制备与成形技术前沿分论坛侧记
伍宏志, 吴甲民
收藏 10, 2019
22019
Flexible piezoelectric sensor based on 4D printing and preparation method thereof
B Su, H Wu, YAN Chunze, Y Shi
US Patent 11,938,680, 2024
12024
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Articles 1–20