Robert Keller
Robert Keller
Materials Research Engineer, NIST
Verified email at - Homepage
Cited by
Cited by
Transmission EBSD from 10 nm domains in a scanning electron microscope
RR Keller, RH Geiss
Journal of Microscopy 245 (3), 245-251, 2012
Tensile properties of free-standing aluminum thin films
DT Read, YW Cheng, RR Keller, JD McColskey
Scripta Materialia 45 (5), 583-589, 2001
Tensile and fracture behavior of free-standing copper films
RR Keller, JM Phelps, DT Read
Materials Science and Engineering: A 214 (1-2), 42-52, 1996
Thermal fatigue testing of thin metal films
R Mönig, RR Keller, CA Volkert
Review of Scientific Instruments 75 (11), 4997-5004, 2004
EBSD measurement of strains in GaAs due to oxidation of buried AlGaAs layers
RR Keller, A Roshko, RH Geiss, KA Bertness, TP Quinn
Microelectronic engineering 75 (1), 96-102, 2004
Characterization of interfacial dislocation networks in a creep-deformed nickel-base superalloy
RR Keller, HJ Maier, H Mughrabi
Scripta metallurgica et materialia 28 (1), 23-28, 1993
Grain boundary misorientation angles and stress-induced voiding in oxide passivated copper interconnects
JA Nucci, RR Keller, DP Field, Y Shacham-Diamand
Applied physics letters 70 (10), 1242-1244, 1997
Local crystallographic texture and voiding in passivated copper interconnects
JA Nucci, RR Keller, JE Sanchez Jr, Y Shacham‐Diamand
Applied physics letters 69 (26), 4017-4019, 1996
Electrical properties of superfilled sub-micrometer silver metallizations
D Josell, C Burkhard, Y Li, YW Cheng, RR Keller, CA Witt, DR Kelley, ...
Journal of applied physics 96 (1), 759-768, 2004
Specimen‐thickness effects on transmission Kikuchi patterns in the scanning electron microscope
KP Rice, RR Keller, MP Stoykovich
Journal of microscopy 254 (3), 129-136, 2014
Epitaxial (111) films of Cu, Ni, and CuxNiy on α−Al2O3 (0001) for graphene growth by chemical vapor deposition
DL Miller, MW Keller, JM Shaw, AN Chiaramonti, RR Keller
Journal of Applied Physics 112 (6), 064317, 2012
Quantitative electron spectroscopic imaging studies of microelectronic metallization layers.
J Marien, JM Plitzko, R Spolenak, R Keller, J Mayer
Journal of microscopy 194 (1), 71-78, 1999
On the unique evaluation of local lattice parameters by convergent-beam electron diffraction
HJ Maier, RR Keller, H Renner, H Mughrabi, A Preston
Philosophical Magazine A 74 (1), 23-43, 1996
Local textures and grain boundaries in voided copper interconnects
RR Keller, JA Nucci, DP Field
Journal of Electronic Materials 26 (9), 996-1001, 1997
On the onset of low-energy dislocation substructures in fatigue: grain size effects
R Keller, W Zielinski, WW Gerberich
Materials Science and Engineering: A 113, 267-280, 1989
Local lattice parameter measurements in a creep-deformed nickel-base superalloy by convergent beam electron diffraction
RR Keller, HJ Maier, H Renner, H Mughrabi
Scripta metallurgica et materialia 27 (9), 1167-1172, 1992
Giant secondary grain growth in Cu films on sapphire
DL Miller, MW Keller, JM Shaw, KP Rice, RR Keller, KM Diederichsen
AIP Advances 3 (8), 082105, 2013
Strain-induced grain growth during rapid thermal cycling of aluminum interconnects
RR Keller, RH Geiss, N Barbosa, AJ Slifka, DT Read
Metallurgical and Materials Transactions A 38 (13), 2263-2272, 2007
Transmission electron diffraction from nanoparticles, nanowires and thin films in an SEM with conventional EBSD equipment
RH Geiss, RR Keller, DT Read
Microscopy and Microanalysis 16 (S2), 1742-1743, 2010
Transmission imaging with a programmable detector in a scanning electron microscope
BW Caplins, JD Holm, RR Keller
Ultramicroscopy 196, 40-48, 2019
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