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Energetics of self-interstitial clusters in Si
NEB Cowern, G Mannino, PA Stolk, F Roozeboom, HGA Huizing, ...
Physical Review Letters 82 (22), 4460, 1999
Extended defects in shallow implants
A Claverie, B Colombeau, B De Mauduit, C Bonafos, X Hebras, ...
Applied Physics A 76 (7), 1025-1033, 2003
Engineering strained silicon on insulator wafers with the Smart CutTM technology
B Ghyselen, JM Hartmann, T Ernst, C Aulnette, B Osternaud, ...
Solid-state electronics 48 (8), 1285-1296, 2004
Evidence on the mechanism of boron deactivation in Ge-preamorphized ultrashallow junctions
BJ Pawlak, R Surdeanu, B Colombeau, AJ Smith, NEB Cowern, ...
Applied Physics Letters 84 (12), 2055-2057, 2004
Formation energies and relative stability of perfect and faulted dislocation loops in silicon
F Cristiano, J Grisolia, B Colombeau, M Omri, B De Mauduit, A Claverie, ...
Journal of Applied Physics 87 (12), 8420-8428, 2000
Visible photoluminescence at room temperature from microcrystalline silicon precipitates in SiO2 formed by ion implantation
T Komoda, J Kelly, F Cristiano, A Nejim, PLF Hemment, KP Homewood, ...
Nuclear Instruments and Methods in Physics Research Section B: Beam …, 1995
Mechanisms of B deactivation control by F co-implantation
NEB Cowern, B Colombeau, J Benson, AJ Smith, W Lerch, S Paul, T Graf, ...
Applied Physics Letters 86 (10), 101905, 2005
Thermal evolution of extended defects in implanted Si:: impact on dopant diffusion
A Claverie, B Colombeau, GB Assayag, C Bonafos, F Cristiano, M Omri, ...
Materials Science in Semiconductor Processing 3 (4), 269-277, 2000
Advanced activation of ultra-shallow junctions using flash-assisted RTP
W Lerch, S Paul, J Niess, S McCoy, T Selinger, J Gelpey, F Cristiano, ...
Materials Science and Engineering: B 124, 24-31, 2005
A physically based model for the spatial and temporal evolution of self-interstitial agglomerates in ion-implanted silicon
CJ Ortiz, P Pichler, T Fühner, F Cristiano, B Colombeau, NEB Cowern, ...
Journal of applied physics 96 (9), 4866-4877, 2004
Clusters formation in ultralow-energy high-dose boron-implanted silicon
F Cristiano, X Hebras, N Cherkashin, A Claverie, W Lerch, S Paul
Applied physics letters 83 (26), 5407-5409, 2003
Reduced pressure chemical vapour deposition of SiGe virtual substrates for high mobility devices
JM Hartmann, Y Bogumilowicz, P Holliger, F Laugier, R Truche, ...
Semiconductor science and technology 19 (3), 311, 2003
Direct imaging of boron segregation to extended defects in silicon
S Duguay, T Philippe, F Cristiano, D Blavette
Applied Physics Letters 97 (24), 242104, 2010
Ion beam induced defects in crystalline silicon
F Cristiano, N Cherkashin, X Hebras, P Calvo, Y Lamrani, E Scheid, ...
Nuclear Instruments and Methods in Physics Research Section B: Beam …, 2004
Kinetic aspects of the growth of platelets and voids in H implanted Si
J Grisolia, F Cristiano, GB Assayag, A Claverie
Nuclear Instruments and Methods in Physics Research Section B: Beam …, 2001
Comprehensive study of the electron scattering mechanisms in 4H-SiC MOSFETs
V Uhnevionak, A Burenkov, C Strenger, G Ortiz, E Bedel-Pereira, V Mortet, ...
IEEE Transactions on Electron Devices 62 (8), 2562-2570, 2015
Deactivation of ultrashallow boron implants in preamorphized silicon after nonmelt laser annealing with multiple scans
JA Sharp, NEB Cowern, RP Webb, KJ Kirkby, D Giubertoni, S Gennaro, ...
Applied physics letters 89 (19), 192105, 2006
Optimized laser thermal annealing on germanium for high dopant activation and low leakage current
M Shayesteh, D O’Connell, F Gity, P Murphy-Armando, R Yu, K Huet, ...
IEEE Transactions on Electron Devices 61 (12), 4047-4055, 2014
Evolution of boron-interstitial clusters in crystalline Si studied by transmission electron microscopy
S Boninelli, S Mirabella, E Bruno, F Priolo, F Cristiano, A Claverie, ...
Applied Physics Letters 91 (3), 031905, 2007
Thermal stability of boron electrical activation in preamorphised ultra-shallow junctions
F Cristiano, N Cherkashin, P Calvo, Y Lamrani, X Hebras, A Claverie, ...
Materials Science and Engineering: B 114, 174-179, 2004
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