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- chek sing teosingapore institute of manufacturing technology在 simtech.a-star.edu.sg 的电子邮件经过验证
- Jun MaAssistant Professor, The Hong Kong University of Science and Technology在 ust.hk 的电子邮件经过验证
- T. H. LeeProfessor of Electrical and Computer Engineering, National University of Singapore在 nus.edu.sg 的电子邮件经过验证
- Kok Kiong TanAssociate Professor, National University of Singapore在 nus.edu.sg 的电子邮件经过验证
- Silu ChenNingbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences在 nimte.ac.cn 的电子邮件经过验证
- Zhu HaiyueSingapore Institute of Manufacturing Technology, A*STAR在 SIMTech.a-star.edu.sg 的电子邮件经过验证
- Masayoshi TomizukaMechaniccal Engineering, University of California在 me.berkeley.edu 的电子邮件经过验证
- Clarence de SilvaProfessor of Mechanical Engineering, The University of British Columbia在 mech.ubc.ca 的电子邮件经过验证
- Tat Joo TEOHome Team Science and Technology Agency在 mit.edu 的电子邮件经过验证
- Liang WenyuA*STAR Institute for Infocomm Research; National University of Singapore在 i2r.a-star.edu.sg 的电子邮件经过验证
- Lihua XieProfessor of Electrical Engineering, Nanyang Technological University在 ntu.edu.sg 的电子邮件经过验证
- Qing-Guo WangNational University of Singapore在 nus.edu.sg 的电子邮件经过验证
- Abdullah Al MamunAssoc. Prof. of Electrical & Computer Engineering, National University of Singapore在 nus.edu.sg 的电子邮件经过验证
- Nazir KamaldinSingapore Management University在 smu.edu.sg 的电子邮件经过验证
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Xiaocong Li
School of Engineering and Applied Sciences, Harvard University
在 seas.harvard.edu 的电子邮件经过验证