| Principles of inorganic materials design JN Lalena, DA Cleary, OBMH Duparc John Wiley & Sons, 2020 | 147 | 2020 |
| Experimental investigation of Ge-doped Bi-11Ag as a new Pb-free solder alloy for power die attachment JN Lalena, NF Dean, MW Weiser Journal of electronic materials 31, 1244-1249, 2002 | 144 | 2002 |
| Assembly of Metal−Anion Arrays within a Perovskite Host. Low-Temperature Synthesis of New Layered Copper−Oxyhalides, (CuX)LaNb2O7, X = Cl, Br TA Kodenkandath, JN Lalena, WL Zhou, EE Carpenter, C Sangregorio, ... Journal of the American Chemical Society 121 (46), 10743-10746, 1999 | 126 | 1999 |
| Inorganic materials synthesis and fabrication JN Lalena, DA Cleary, E Carpenter, NF Dean John Wiley & Sons, 2008 | 111 | 2008 |
| From quartz to quasicrystals: probing nature's geometric patterns in crystalline substances JN Lalena Crystallography Reviews 12 (2), 125-180, 2006 | 32 | 2006 |
| Divalent ion exchange of alkaline-earth cations into the triple-layered perovskite RbCa2Nb3O10 CH Mahler, BL Cushing, JN Lalena, JB Wiley Materials research bulletin 33 (11), 1581-1586, 1998 | 26 | 1998 |
| A Multistep Topotactic Route to the New Mixed-Valence Titanate, Na2-x+yCax/2La2Ti3O10. Electron Localization Effects in a Triple-Layered … JN Lalena, BL Cushing, AU Falster, WB Simmons, CT Seip, EE Carpenter, ... Inorganic chemistry 37 (18), 4484-4485, 1998 | 25 | 1998 |
| Doped alloys for electrical interconnects, methods of production and uses thereof N Dean, J Flint, J Lalena, M Weiser US Patent App. 11/147,958, 2006 | 21 | 2006 |
| Thermally conductive materials, solder preform constructions, assemblies and semiconductor packages B Ruchert, M Weiser, M Fery, N Dean, J Lalena US Patent App. 11/180,459, 2007 | 13 | 2007 |
| Synthesis and Characterization of New Mixed-Metal Triple-Layered Perovskites, Na2La2Ti3-xRuxO10 (x ≤ 1.0) JN Lalena, AU Falster, WB Simmons, EE Carpenter, J Wiggins, ... Chemistry of materials 12 (8), 2418-2423, 2000 | 11 | 2000 |
| Ge-doped Ag-Bi: A new Pb-free power die attach solder JN Lalena, NF Dean, MW Weiser, G AgBi Proc. Honeywell Electron. Mater., 131th Annu. TMS Meet. Exhibit, 1-18, 2002 | 7 | 2002 |
| Thermal interface materials; and compositions comprising indium and zinc J Lalena, N Dean, M Weiser US Patent App. 10/502,480, 2005 | 5 | 2005 |
| Die attach solder design. JN Lalena, MW Weiser, NF Dean Advanced Packaging 11 (2), 25-26, 2002 | 4 | 2002 |
| Sangregorio, AU Falster, JR Simmons, CJ O'Connor, and JB Wiley TA Kodenkandath, JN Lalena, WI Zhou, EE Carpenter J. Am. Chem. Soc 121, 10,743, 1999 | 3 | 1999 |
| Low-Temperature Multistep Topotactic Routes to New Mixed-Valence Perovskites JN Lalena, RA McIntyre, BL Cushing, KA Thomas, JL Heintz, CT Seip, ... MRS Online Proceedings Library (OPL) 547, 99, 1998 | 2 | 1998 |
| Inorganic materials synthesis and fabrication. 2008, Hoboken J Lalena John Wiley and Sons, Inc, 0 | 2 | |
| Inorganic Materials Synthesis And Fabrication. 1996. Hoboken JN Lalena, DA Cleary, EE Carpenter, NF Dean New Jersey, John Wiley & Sons, 0 | 2 | |
| Principles of Inorganic Materials Design. Von John N. Lalena und David A. Cleary. L Qi Angewandte Chemie 118 (19), 3069-3069, 2006 | 1 | 2006 |
| John B. Goodenough JB Goodenough Angew. Chem 130, 14380, 2018 | | 2018 |
| Compositions, methods and devices for high temperature lead-free solder J Lalena, N Dean, M Weiser | | 2002 |
