| Numerical simulation and analytical modeling of the thermal behavior of single-and double-sided cooled power modules AP Catalano, C Scognamillo, V d’Alessandro, A Castellazzi IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 36 | 2020 |
| Accurate and efficient analysis of the upward heat flow in InGaP/GaAs HBTs through an automated FEM‐based tool and Design of Experiments V d'Alessandro, AP Catalano, L Codecasa, PJ Zampardi, B Moser International Journal of Numerical Modelling: Electronic Networks, Devices …, 2019 | 34 | 2019 |
| Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies V d'Alessandro, AP Catalano, A Magnani, L Codecasa, N Rinaldi, ... Microelectronics Reliability 78, 233-242, 2017 | 26 | 2017 |
| Compact modeling of a 3.3 kv sic mosfet power module for detailed circuit-level electrothermal simulations including parasitics C Scognamillo, AP Catalano, M Riccio, V d’Alessandro, L Codecasa, ... Energies 14 (15), 4683, 2021 | 24 | 2021 |
| Circuit-based electrothermal simulation of multicellular SiC power MOSFETs using FANTASTIC V d’Alessandro, L Codecasa, AP Catalano, C Scognamillo Energies 13 (17), 4563, 2020 | 23 | 2020 |
| Optimum thermal design of high-voltage double-sided cooled multi-chip SiC power modules AP Catalano, C Scognamillo, A Castellazzi, V d’Alessandro 2019 25th International Workshop on Thermal Investigations of ICs and …, 2019 | 21 | 2019 |
| A Priori Error Bound for Moment Matching Approximants of Thermal Models L Codecasa, AP Catalano, V d’Alessandro IEEE Transactions on Components, Packaging and Manufacturing Technology 9 …, 2019 | 21 | 2019 |
| Combined experimental-FEM investigation of electrical ruggedness in double-sided cooled power modules C Scognamillo, AP Catalano, P Lasserre, C Duchesne, V d'Alessandro, ... Microelectronics Reliability 114, 113742, 2020 | 20 | 2020 |
| Modeling thermal coupling in bipolar power amplifiers toward dynamic electrothermal simulation V d'Alessandro, AP Catalano, L Codecasa, B Moser, PJ Zampardi 2018 IEEE MTT-S International Conference on Numerical Electromagnetic and …, 2018 | 19 | 2018 |
| Analysis of electrothermal effects in devices and arrays in InGaP/GaAs HBT technology V d’Alessandro, AP Catalano, C Scognamillo, L Codecasa, PJ Zampardi Electronics 10 (6), 757, 2021 | 18 | 2021 |
| An efficient simulation methodology to quantify the impact of parameter fluctuations on the electrothermal behavior of multichip SiC power modules A Borghese, AP Catalano, M Riccio, L Codecasa, A Fayyaz, ... Materials Science Forum 963, 855-858, 2019 | 17 | 2019 |
| Model-order reduction procedure for fast dynamic electrothermal simulation of power converters AP Catalano, M Riccio, L Codecasa, A Magnani, G Romano, ... Applications in Electronics Pervading Industry, Environment and Society …, 2019 | 15 | 2019 |
| Optimization of thermal vias design in PCB-based power circuits AP Catalano, R Trani, C Scognamillo, V d’Alessandro, A Castellazzi 2020 21st International conference on thermal, mechanical and multi-physics …, 2020 | 13 | 2020 |
| Thermal management solutions for a lightweight 3L GaN inverter R Trani, AP Catalano, A Castellazzi, V D'Alessandro 2019 10th International Conference on Power Electronics and ECCE Asia (ICPE …, 2019 | 13 | 2019 |
| Influence of layout and technology parameters on the thermal behavior of InGaP/GaAs HBTs AP Catalano, A Magnani, V d'Alessandro, L Codecasa, PJ Zampardi, ... 2017 13th Conference on Ph. D. Research in Microelectronics and Electronics …, 2017 | 13 | 2017 |
| Using EMPHASIS for the thermography-based fault detection in photovoltaic plants AP Catalano, C Scognamillo, P Guerriero, S Daliento, V d’Alessandro Energies 14 (6), 1559, 2021 | 12 | 2021 |
| A Technique for the In-Situ Experimental Extraction of the Thermal Impedance of Power Devices C Scognamillo, S Fregonese, T Zimmer, V d'Alessandro, AP Catalano IEEE Transactions on Power Electronics 37 (10), 11511-11515, 2022 | 10 | 2022 |
| Numerical analysis of the thermal impact of ceramic materials in double-sided cooled power modules C Scognamillo, AP Catalano, A Castellazzi, V d'Alessandro 2020 26th International Workshop on Thermal Investigations of ICs and …, 2020 | 10 | 2020 |
| Combined SPICE-FEM analysis of electrothermal effects in InGaP/GaAs HBT devices and arrays for handset applications V d'Alessandro, AP Catalano, L Codecasa, B Moser, PJ Zampardi 2018 19th International Conference on Thermal, Mechanical and Multi-Physics …, 2018 | 10 | 2018 |
| Accurate and efficient algorithm for computing structure functions from the spatial distribution of thermal properties in electronic devices L Codecasa, V D’Alessandro, AP Catalano, C Scognamillo, D D’Amore, ... IEEE Transactions on Electron Devices 68 (11), 5386-5393, 2021 | 9 | 2021 |
Vincenzo d'AlessandroFull Professor of Electronics, DIETI, University Federico II, Naples, ItalyVerified email at unina.it
