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Co-authors
- WM zhuSingapore Institute of Manufacturing TechnologyVerified email at simtech.a-star.edu.sg
- Din Ping TsaiCity University of Hong KongVerified email at cityu.edu.hk
- Weiming ZHUUniversity of Electronic Science and Technology of ChinaVerified email at uestc.edu.cn
- Tarik BOUROUINAUniversité Gustave Eiffel, ESIEE Paris, CNRS, ESYCOM Lab.Verified email at esiee.fr
- Pin Chieh WuAssociate Professor, National Cheng Kung UniversityVerified email at gs.ncku.edu.tw
- JH TengIMRE, A*STAR, SingaporeVerified email at imre.a-star.edu.sg
- Yamin Leprince-WangProfesseur de Physique, Université Gustave EiffelVerified email at u-pem.fr
- Qinghua SongAssociate Professor, SIGS, Tsinghua UniversityVerified email at sz.tsinghua.edu.cn
- Er Ping LIZhejiang UniversityVerified email at zju.edu.cn
- Nikolay I. ZheludevUniversity of Southampton and NTU SingaporeVerified email at soton.ac.uk
- Lip Ket ChinCity University of Hong KongVerified email at cityu.edu.hk
- Jifang TaoShandong University
- Wang ZhangProfessor of materials science, Shanghai Jiao Tong universityVerified email at sjtu.edu.cn