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Co-authors
- Alexandra BoltassevaPurdue UniversityVerified email at purdue.edu
- Marcello FerreraHeriot-Watt University - School of Engineering and Physical SciencesVerified email at hw.ac.uk
- Nathaniel KinseyVirginia Commonwealth UniversityVerified email at vcu.edu
- Daniele FaccioUniversity of GlasgowVerified email at glasgow.ac.uk
- Jongbum KimKorea Institute of Science and Technology (KIST)Verified email at kist.re.kr
- Alexander V. KildishevProfessor of ECE, Purdue UniversityVerified email at purdue.edu
- Vincenzo BrunoPhD Glasgow UniversityVerified email at research.gla.ac.uk
- Amr M ShaltoutStanford UniversityVerified email at stanford.edu
- Matteo ClericiUniversità degli studi dell’InsubriaVerified email at uninsubria.it
- Stefano VezzoliResearch FellowVerified email at ic.ac.uk
- Enrico Giuseppe CarnemollaSTMicroelectronics ImagingVerified email at st.com
- Soham SahaMaria Goeppert Mayer Fellow, Argonne National LaboratoryVerified email at purdue.edu
- Aveek DuttaHardware Developer, IBM QuantumVerified email at ibm.com
- Zhaxylyk KudyshevMagic LeapVerified email at purdue.edu
- Krishnakali ChaudhuriPurdue UniversityVerified email at purdue.edu
- Lucia CaspaniUniversità degli Studi dell'InsubriaVerified email at uninsubria.it
- Di WangPurdue University, Apple Inc.Verified email at purdue.edu
- Jieran FangPurdue UniversityVerified email at purdue.edu
- Yong P. ChenPurdue University; Aarhus University; WPI-AIMR; MUSTVerified email at purdue.edu
- Sajid Muhaimin Choudhury, PhDBangladesh University of Engineering and TechnologyVerified email at eee.buet.ac.bd