| Major stressors and coping strategies of frontline nursing staff during the outbreak of coronavirus disease 2020 (COVID-19) in Alabama H Ali, A Cole, A Ahmed, S Hamasha, G Panos Journal of multidisciplinary healthcare, 2057-2068, 2020 | 112 | 2020 |
| A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint S Su, FJ Akkara, R Thaper, A Alkhazali, M Hamasha, S Hamasha Journal of Electronic Packaging 141 (4), 040802, 2019 | 66 | 2019 |
| Assessment of Solder Joint Fatigue Life Under Realistic Service Conditions S Hamasha, Y Jaradat, A Qasaimeh, M Obaidat, P Borgesen Journal of Electronic Materials, 1-13, 2014 | 61 | 2014 |
| Solder joint reliability under realistic service conditions P Borgesen, S Hamasha, M Obaidat, V Raghavan, X Dai, M Meilunas, ... Microelectronics Reliability 53 (9-11), 1587-1591, 2013 | 59 | 2013 |
| A mechanistic thermal fatigue model for SnAgCu solder joints P Borgesen, L Wentlent, S Hamasha, S Khasawneh, S Shirazi, D Schmitz, ... Journal of Electronic Materials 47 (5), 2526-2544, 2018 | 54 | 2018 |
| Effects of strain rate and amplitude variations on solder joint fatigue life in isothermal cycling S Hamasha, P Borgesen Journal of Electronic Packaging 138 (2), 021002, 2016 | 54 | 2016 |
| Correlation between solder joint fatigue life and accumulated work in isothermal cycling S Hamasha, A Qasaimeh, Y Jaradat, P Borgesen IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (9 …, 2015 | 53 | 2015 |
| Damage evolution in lead free solder joints in isothermal fatigue A Qasaimeh, S Hamasha, Y Jaradat, P Borgesen Journal of Electronic Packaging 137 (2), 021012, 2015 | 45 | 2015 |
| Effect of Cycling Amplitude Variations on SnAgCu Solder Joint Fatigue Life S Hamasha, F Akkara, S Su, H Ali, P Borgesen IEEE Transactions on Components, Packaging and Manufacturing Technology 8 …, 2018 | 44 | 2018 |
| Solder joint reliability in isothermal varying load cycling S Hamasha, S Su, F Akkara, A Dawahdeh, P Borgesen, A Qasaimeh 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017 | 44 | 2017 |
| Evolution of the Cyclic Stress-Strain and Constitutive Behaviors of Doped Lead Free Solder During Fatigue Testing MA Hoque, MM Chowdhury, N Fu, JC Suhling, S Hamasha, P Lall 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 43 | 2018 |
| Characterization of material damage and microstructural evolution occurring in lead free solders subjected to cyclic loading MM Chowdhury, MA Hoque, N Fu, JC Suhling, S Hamasha, P Lall 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 865-874, 2018 | 42 | 2018 |
| Effect of Surface Finish and High Bi Solder Alloy on Component Reliability in Thermal Cycling F Akkara, M Abueed, M Rababah, C Zhao, S Su, S Hamasha, J Suhling, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2032-2040, 2018 | 37 | 2018 |
| Effects of varying amplitudes on the fatigue life of lead free solder joints M Obaidat, S Hamasha, Y Jaradat, A Qasaimeh, B Arfaei, M Anselm, ... 2013 IEEE 63rd Electronic Components and Technology Conference, 1308-1314, 2013 | 37 | 2013 |
| Fatigue properties of lead-free doped solder joints S Su, FJ Akkara, M Abueed, M Jian, S Hamasha, J Suhling, P Lall 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 35 | 2018 |
| Statistical variations of solder joint fatigue life under realistic service conditions S Hamasha, L Wentlent, P Borgesen IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (9 …, 2015 | 35 | 2015 |
| Effect of long-term room temperature aging on the fatigue properties of SnAgCu solder joint S Su, N Fu, F John Akkara, S Hamasha Journal of Electronic Packaging 140 (3), 031005, 2018 | 34 | 2018 |
| Challenges for the prediction of solder joint life in long term vibration F Batieha, S Hamasha, Y Jaradat, L Wentlent, A Qasaimeh, P Borgesen 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1553-1559, 2015 | 33 | 2015 |
| Evolution of the Mechanical Behavior of Lead Free Solders Exposed to Thermal Cycling SMK Hasan, A Fahim, JC Suhling, S Hamasha, P Lall 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 31 | 2019 |
| Interpreting accelerated test results for lead free solder joints P Borgesen, S Hamasha, L Wentlent, D Watson, C Greene 2016 Pan Pacific Microelectronics Symposium (Pan Pacific), 1 - 9, 2016 | 31 | 2016 |
